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    MOLDING MATERIAL MP8000 Search Results

    MOLDING MATERIAL MP8000 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USBAA00000-002 Amphenol Cables on Demand Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m Datasheet
    CS-USBAB00000-001 Amphenol Cables on Demand Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m Datasheet
    CS-USBAB00000-002 Amphenol Cables on Demand Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m Datasheet
    CS-USBAA00000-003 Amphenol Cables on Demand Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m Datasheet
    CS-USBAA00000-005 Amphenol Cables on Demand Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m Datasheet

    MOLDING MATERIAL MP8000 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Nitto

    Abstract: MOLDING MATERIAL MP8000 Nitto MP 8000 MP-8000 JEDEC22 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22
    Text: Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP-8000 Molding Compound 160 Ld Plastic Quad Flat Pack PQFP (CY7C611) Asat, Hong Kong Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF MP-8000 CY7C611) MP-8000 CY7C611A-NC JEDEC22 30C/60 Nitto MOLDING MATERIAL MP8000 Nitto MP 8000 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22

    MP8000CH

    Abstract: MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
    Text: Cypress Semiconductor Package Qualification Report QTP# 000102 VERSION 1.0 March, 2000 84 Lead Plastic Leaded Chip Carrier NITTO 8000CH Molding Compound Level 3 Anam-Manila, Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF 8000CH MP8000CH 37KPHIL-M CY7C373I-JC 30C/60 MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto

    TSS463

    Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
    Text: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2


    Original     		PDF TSS463 TSS461C TSS461C TSS463/TSS461C TS80C31X2/C32X2 Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A

    Nitto

    Abstract: CY7C199 JESD22
    Text: Qualification Report August 1996, QTP# 96114, Version 1.0 NITTO LOW ALPHA MOLDING COMPOUND PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		PDF CY7C199 28-pin, 300-mil 7C199C 0075V) CY7C199-VC 85C/85 Nitto CY7C199 JESD22

    MC81F4104M

    Abstract: MC81F4104S ABOV MC81F 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor
    Text: Document name Page RT_Report 1 of 9 MC81F4104x Include : MC81F4104M, MC81F4104S Qualification Report Report No. AQA-09-06-03 Issued Date 30. June. 2009 Issued By ◈ Part Number MC81F4104x Dong Hee Park ◈ Process Feature ( QA Engineer) 2Poly 4 Metal 4KB Flash 8Bit MCU


    Original     		PDF MC81F4104x MC81F4104M, MC81F4104S) AQA-09-06-03 MC81F4104M MC81F4104S 10TSSOP ABOV MC81F 84-1SR4 MP-8000CH4 MP-8000 JESD22 a113 MAGNACHIP MagnaChip Semiconductor

    DIGITAL IC TESTER report for project

    Abstract: wafer fab control plan atmel 823 PPAP PPAP submission requirement table PPAP flow wafer fab control JESD20 electrical engineering projects dc0327
    Text: TSS463B PPAP TSS463B Serial VAN Data Link Controller ATMEL P/N : TSS463B-TERA PPAP Submission Date: Supplier: 2003 October Atmel Nantes SA Address: La Chantrerie BP 70602 44306 NANTES Cedex 3 France Tel : 33 0 2 40 18 18 18 Fax : 33(0) 2 40 18 19 20 1 Rev. 3 : Initial Submission – 2003 October


    Original     		PDF TSS463B TSS463B TSS463B-TERA DIGITAL IC TESTER report for project wafer fab control plan atmel 823 PPAP PPAP submission requirement table PPAP flow wafer fab control JESD20 electrical engineering projects dc0327

    PPAP

    Abstract: 87c510 INCOMING PLASTIC PACKAGING FILM CHECKLIST INCOMING PLASTIC FILM CHECKLIST ATMEL Packing method PPAP flow MP8000AN Z428 atmel 823 AT83C5103
    Text: AT83C5103 - AT87C5103 PPAP AT83C5103 / AT87C5103 C51 LPC 8-Bit Microcontroller ATMEL P/N : AT8xC5103xxx-IBRAL PPAP Submission Date: March 2003 Supplier: ATMEL-NANTES SA Address: La Chantrerie BP 70602 44306 NANTES Cedex 3 France Tel : 33 0 2 40 18 18 18 Fax : 33(0) 2 40 18 19 20


    Original     		PDF AT83C5103 AT87C5103 AT87C5103 AT8xC5103xxx-IBRAL PPAP 87c510 INCOMING PLASTIC PACKAGING FILM CHECKLIST INCOMING PLASTIC FILM CHECKLIST ATMEL Packing method PPAP flow MP8000AN Z428 atmel 823

    f82c735a

    Abstract: intel date code marking f82c735 tm1977b daewon 1420 daewon B65555 6300HG intel code marking MP8000
    Text: Product Change Notification Change Notification #: 887 Revision 1 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.


    Original     		PDF F82C735A B65555A f82c735a intel date code marking f82c735 tm1977b daewon 1420 daewon B65555 6300HG intel code marking MP8000

    TSS-IO16-A

    Abstract: EIA-556-A tssio16a ATMEL flow soldering Z31300 TS87251g2 marking code 4e TSSIO16E Z27184 ts87c51
    Text: Atmel Wireless & Microcontrollers Qualification Package TSSIO16E in Automotive 0.5 µm SCMOS3 Technology TSSIO16E Automotive 0.5µm SCMOS3 August 2000 Rev. 0– AUGUST 2000 1 Atmel Wireless & Microcontrollers 1. General


    Original     		PDF TSSIO16E TSSIO16E TSS-IO16-A EIA-556-A tssio16a ATMEL flow soldering Z31300 TS87251g2 marking code 4e Z27184 ts87c51

    mp8000

    Abstract: Nitto MP8000 98XX EPM5192LC84 MP-8000 MSL Rating altera date code JEDEC-STD020 epm5192
    Text: CUSTOMER ADVISORY PLCC MOISTURE SENSITIVITY LEVEL RECLASSIFICATION Altera’s internal reliability monitors indicate a drift in the Moisture Sensitivity Level MSL of its nondry-packed 44-, 68- and 84-pin PLCC packages that have seal date codes of 98XX. While our


    Original     		PDF 84-pin JEDEC-Std-020, MP8000, MP8000. EPM5192LC84 mp8000 Nitto MP8000 98XX MP-8000 MSL Rating altera date code JEDEC-STD020 epm5192

    HP83000

    Abstract: 0.7 um CMOS process parameters Nitto 9850 JEDEC20 G226 Nitto MP8000 MP8000 ITS9000 atmel PLCC bottom "marking" MG2RTP
    Text: Qualpack MG2RT/MG2RTP Qualification Package MG2RT / MG2RTP 0.5 µm Radiation Tolerant SCMOS3 Technology MG2RT / MG2RTP 0.5 µm SCMOS3 1999 August TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 0 – 1999 August 1 Qualpack MG2RT/MG2RTP 1. General Information . 3


    Original     		PDF

    XC95XXXL

    Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
    Text: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4


    Original     		PDF XC4005XL PQFP-160 PLCC-84, HQFP-304, VQFP-100 XC4044XL XC4013XLA XC95XXXL XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices

    A9701

    Abstract: MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure
    Text: The Reliability Data Program Expanded Version Jan. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4


    Original     		PDF PLCC-20, A9701 MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure

    XcxxX

    Abstract: vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent
    Text: The Reliability Data Program Expanded Version April. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4


    Original     		PDF PLCC-20, XcxxX vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent