751E
Abstract: 940C 948F BR1339 ansi y14.5m motorola plastic package outlines
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Ordering Information Device Nomenclature MC 74 XXXX YYYYYY ZZ Motorola Circuit Identifier Package Type •D • DW •M • SD • DT Temperature Range • 74 = –40 to +85°C = = = = = Plastic Narrow JECDEC SOIC Plastic Wide JEDEC SOIC
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BR1339
14-Pin
751E
940C
948F
ansi y14.5m
motorola plastic package outlines
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NXR-1400
Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s
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AN1231/D
AN1231
AN1231/D*
NXR-1400
nicolet nxr1400
reballing
Air-Vac Engineering Company
830B
A112
AN1231
JESD22
MPC105
OMPAC
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transistor nec 8772
Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s
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AN1231
transistor nec 8772
nec 7912
nec 8772
motorola 7912
1764 676
kapton
NXR-1400
2SB444
8772 P
bga dye pry
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62Sn36Pb2Ag
Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
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AN1850/D
62Sn36Pb2Ag
90Pb10Sn
CBGA 255 motorola
480 PBGA pad recommendations
Solder Balls
63Sn37Pb
cte table epoxy substrate
motorola pbga 302
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CBGA 255 motorola
Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin
Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in
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AN1850/D
CBGA 255 motorola
90Pb10Sn
cte table epoxy
BGA cte
pbga package weight
cte table epoxy substrate
AN-1850
360-Pin
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AN1984
Abstract: SOIC16 1320A-02
Text: Freescale Semiconductor, Inc. MOTOROLA Order number: AN1984 Rev 1, 03/2004 SEMICONDUCTOR TECHNICAL DATA AN1984 Handling Motorola Pressure Sensors By William McDonald Freescale Semiconductor, Inc. INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These
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AN1984
AN1984
SOIC16
1320A-02
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AN1260
Abstract: A112 A113
Text: MOTOROLA Order this document by AN1260/D SEMICONDUCTOR TECHNICAL DATA AN1260 Storage and Handling of Drypacked Surface Mounted Devices SMD Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown INTRODUCTION This information provides Motorola customers with the
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AN1260/D
AN1260
AN1260/D*
AN1260
A112
A113
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2088AB
Abstract: eb107 TO-210AA Package AAVID THERMALLOY COMPOUND 250 814a TO-210AB TRANSISTOR SUBSTITUTION DATA BOOK 1993 AN1040 DO-203AA DO-203AB
Text: Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE . Archived 2005 MOTOROLA Order this document by AN1040/D AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power
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AN1040/D
AN1040
2088AB
eb107
TO-210AA Package
AAVID THERMALLOY COMPOUND 250
814a
TO-210AB
TRANSISTOR SUBSTITUTION DATA BOOK 1993
AN1040
DO-203AA
DO-203AB
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2088AB
Abstract: TO-210AA Package motorola mhw 252 mhw 592 to220 torque for SELF TAPPING SCREW socket SELF TAPPING SCREW 4-40 Kapton Washer eb107 SIL-PAD density TO-210AB
Text: MOTOROLA Freescale Semiconductor, Inc. Order this document by AN1040/D SEMICONDUCTOR APPLICATION NOTE AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power
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AN1040/D
AN1040
2088AB
TO-210AA Package
motorola mhw 252
mhw 592
to220 torque for SELF TAPPING SCREW
socket SELF TAPPING SCREW
4-40 Kapton Washer
eb107
SIL-PAD density
TO-210AB
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LCX16500 Low-Voltage CMOS 18-Bit Universal Bus Transceiver With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16500 is a high performance, non–inverting 18–bit universal bus transceiver operating from a 2.7 to 3.6V supply. This part is
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18-Bit
MC74LCX16500
BR1339
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b1236
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LCX16646 Low-Voltage CMOS 16-Bit Transceiver/Registered Transceiver With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16646 is a high performance, non–inverting 16–bit
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16-Bit
MC74LCX16646
BR1339
b1236
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Hex Schmitt Inverter MC74LVX14 With 5V-Tolerant Inputs LVX The MC74LVX14 is an advanced high speed CMOS Schmitt inverter. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems. The MC74LVX14 is pin and functionally compatible to the
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MC74LVX14
MC74LVX04,
MC74LVX14
BR1492
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Low-Voltage CMOS 16-Bit Transparent Latch MC74LCX16373 With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16373 is a high performance, non–inverting 16–bit transparent latch operating from a 2.7 to 3.6V supply. The device is byte
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16-Bit
MC74LCX16373
BR1339
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Low-Voltage CMOS 16-Bit D-Type Flip-Flop MC74LCX16374 With 5V-Tolerant Inputs and Outputs 3-State, Non-Inverting The MC74LCX16374 is a high performance, non–inverting 16–bit D–type flip–flop operating from a 2.7 to 3.6V supply. The device is byte
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MC74LCX16374
BR1339
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Untitled
Abstract: No abstract text available
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Advance Information MC74LVXC3245 Configurable Dual Supply Octal Transceiver with 3-State Outputs for 3V Systems The 74LVXC3245 is a 24–pin dual–supply, octal configurable voltage interface transceiver especially well suited for PCMCIA and other real
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MC74LVXC3245
74LVXC3245
BR1339
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HF 1932
Abstract: No abstract text available
Text: Case Outlines L SUFFIX - s CERAMIC PACKAGE CASE 620-10 ISSUE V i - NOTES. 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: INCH. 3. OlMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 0 030
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BR1334
HF 1932
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1J27
Abstract: No abstract text available
Text: Case Outlines 1 4 -P in P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F - S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MHUMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.0061
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51A-03
BR1492
1J27
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Untitled
Abstract: No abstract text available
Text: Case Outlines 1 4 -Pin P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F P7 PL | 0 1 0.25 0.0101 t n x — JG I— o I B 1 i c D 14 PL_ [ $ I 0.25(0.0101 © K I t r 1 IT 1 B ® _ J F L- / R X 45J E 3 " SEATING PLANE NOTES'
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51A-03
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motorola plastic package outlines
Abstract: No abstract text available
Text: Case Outlines C a se O utlines 4-P in P ackage DT SUFFIX PLASTIC PACKAGE CASE 369A-13 DPAK ISSUE W _ f _ 1 SEATING — — 1 PLANE NOTES: 1. 2 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES ' 1 MIN MAX MIN MAX A 0.235
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69A-13
BR1486
motorola plastic package outlines
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Untitled
Abstract: No abstract text available
Text: Case Outlines L SUFFIX NOTES 1 DIMENSIONING AND TOLERANCING PER a n d v i i cjj i ono 2 3 CONTROLLING DIMENSION: INCH. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL DIMENSION F MAY NARROW TO 0.76 0 030 WHERE THE LEAD ENTERS THE CERAMIC BOOY 4 DIM A
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BR1334
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Motorola 206
Abstract: No abstract text available
Text: C a s e Outlines 14-P in Packages D SUFFIX PLASTIC SO IC PACKAGE C A SE 751A-03 ISSU E F | ^ l 0.25 0.010 I NOTES: 1. DIMENSIONING AND TOl£RANClNG PER ANSI Y14.5M, 1962. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
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51A-03
DL203
Motorola 206
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motorola varactor
Abstract: PACKAGE DIMENSIONS CASE 751-03 mc12148
Text: MOTOROLA SC LOGIC • J> m bGE b3b?25S □ Ô1T ■ M0T4 T - 5 ~ ô - / 7 MOTOROLA SEMICONDUCTOR TECHNICAL DATA M C 12148 Advance Information Low-Power V oltage Controlled O scillator LOW-POWER VOLTAGE CONTROLLED OSCILLATOR The MC12148 requires an external parallel tank circuit consisting of
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MC12148
700MHz
1100MHz
motorola varactor
PACKAGE DIMENSIONS CASE 751-03
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germanium
Abstract: 74HC244A 74HC589 ALI M 3329 B1 74HC163
Text: High-Speed CMOS Data Function Selector Guide Design Considerations Device Data Sheets [3 Ordering Information [4 W H A T ’S NEW ! DATA SHEETS ADDED DATASHEETS DELETED MC74HCU04A MC54/74HC390A MC54/74HC08 MC54/74HCT541 MC74HC76 MC54/74HC393A MC54/74HC540
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MC74HCU04A
MC54/74HC390A
MC54/74HC08
MC54/74HCT541
MC74HC76
MC54/74HC393A
MC54/74HC540
MC74HC4020
MC54/74HC86A
MC54/74HC533A
germanium
74HC244A
74HC589
ALI M 3329 B1
74HC163
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C12207
Abstract: No abstract text available
Text: MOTOROLA SC LOGIC • bOE D • b3b?25E DOTGTDfl TH3 « H O m MOTOROLA SEMICONDUCTOR TECHNICAL DATA Product Preview M C12207 Serial Input PLL Frequency Synthesizer The MC12207 is a Bipolar single chip serial input PLL synthesizer with pulse-swallow function. Motorola’s advanced Bipolar MOSAIC
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MC12207
14-Bit
C12207
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