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Abstract: No abstract text available
Text: APPLICATION NOTES MOUNTING SURFACE MOUNT TERMINATIONS & ATTENUATORS The low cost and convenience of surface mount components and automated installation is inspiring new surface mount high power devices that have previously required chassis mounting. The design of systems using high power surface mount elements requires careful
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t92 surface mount t92 transistor
Abstract: T95 Diode sprague CWR06 vacuum pump A293D SPRAGUE 047 Vapor Phase Soldering tantalum capacitors 293D 298D 592D
Text: Guidelines for Surface Mounting Vishay Sprague Application Notes Guidelines for Surface Mounting of Tantalum Chip Capacitors INTRODUCTION The increased use of surface mount components has led many users to revise their assembly procedures and specifications for printed circuit boards. This section will
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t92 surface mount t92 transistor
T95 Diode
sprague CWR06
vacuum pump
A293D
SPRAGUE 047
Vapor Phase Soldering tantalum capacitors
293D
298D
592D
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K155 SOT
Abstract: No abstract text available
Text: Practical Considerations for Attaching Surface-Mount Components Mini-Circuits manufactures many RF/IF signal processing components in packages suitable for surface mounting: SURFACE-MOUNT MODELS M ODEL-N O. PREFIXES OF EACH PRODUCT TYPE, AVAILABLE IN THE SURFACEMOUNT CASE STYLES SHOWN
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72-inch
K155 SOT
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weller ec1002
Abstract: EC1002 weller MT1500 weller soldering tip weller soldering wick weller datasheet MT202 Soldering and desoldering
Text: T echnical Note No. 106 Soldering and Desoldering Surface-Mount Chip Components By Ted Iwanowski and Bob Perrin Surface-mounting components is becoming increasingly popular because of the higher electronic speeds possible from shorter delay lines and the facility that surface mounting lends to an automated
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Untitled
Abstract: No abstract text available
Text: Why Surface Mount? Surface Mount Technology is being utilized to offer answers to many problems that have been created in the use of insertion technology and is now the preferred mounting technique for components. Limitations have been reached with insertion packages and
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Untitled
Abstract: No abstract text available
Text: Why Surface Mount? Surface Mount Technology is being utilized to offer answers to many problems that have been created in the use of insertion technology and is now the preferred mounting technique for components. Limitations have been reached with insertion packages and
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Lead Free reflow soldering profile BGA
Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Lead Free reflow soldering profile BGA
HVQFN48
SSOP20
Solder Paste, Indium, Type 3
Cu3Sn
philips pb-free products
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Cu3Sn
Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
AN10365
Cu3Sn
Solder Paste, Indium, Type 3
SSOP20 LAND PATTERN
Solder Paste Indium reflow process control
Solder Paste, Indium 5.1, Type 3
HVQFN48
SSOP20
philips pb-free products
SOT266-1 LAND PATTERN
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Cu3Sn
Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.
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AN10365
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Cu3Sn
HVQFN48
J-STD-020D
SSOP20
Cu6Sn5
Solder Paste, Indium 5.1, Type 3
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT COMPONENTS Introduction Fabrication considerations Surface-mounting of components saves critical space on the circuit board, can result in more reliable circuits and systems, and can reduce the cost of production through automated circuit fabrication. Since circuit
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Untitled
Abstract: No abstract text available
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.4 COMPONENT MOUNTING PROCESS The component mounting process should be designed such that components can be mounted precisely. Because of components’ selfaligning capability, there is a permissible mounting error margin. The mounting process should be so designed as to mount components
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NATU
Abstract: No abstract text available
Text: Surface Mount Aluminum Electrolytic Capacitors NATU Series FEATURES • EXTENDED TEMPERATURE +125OC & LONG LIFE 4,000 HOURS • CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING • DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING • MEETS THE REQUIREMENTS OF AEC-Q200*
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125OC
AEC-Q200*
120Hz/20Â
120Hz
35VDC
10x10
330mm)
380mm)
330mm
NATU
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PSM4-103Z-20T0
Abstract: SSM1-101 PSM4
Text: Surface Mount EMI Filters PSM Series filters are the first surface mount components to effectively filter EMI/RFI on printed circuit boards operating at currents up to 20 Amps. SSM Series filters lend themselves for mounting on densely populated circuit boards where currents of
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Untitled
Abstract: No abstract text available
Text: Surface Mount EMI Filters PSM Series filters are the first surface mount components to effectively filter EMI/RFI on printed circuit boards operating at currents up to 20 Amps. SSM Series filters lend themselves for mounting on densely populated circuit boards where currents of
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Untitled
Abstract: No abstract text available
Text: SURFACE MOUNT COMPONENTS Surface-mounting of components saves critical space on the circuit board, can result in more reliable circuits and systems, and can reduce the cost of production through automated circuit fabrication. And since circuit densities are increasing as more
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SOLDERING REFLOW smt
Abstract: No abstract text available
Text: MOUNTING PROCEDURES FOR SURFACE MOUNT COMPONENTS Pulsar Microwave Corporation recommends that our surface mount SMT components be mounted using a controlled amount of solder with a specific temperature reflow pattern. A common technique used for applying solder is to print a pattern of solder paste on the PC board (called a solder mask).
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Untitled
Abstract: No abstract text available
Text: SPECTRUM CONTROL INC. Surface Mount EMI Filters PSM Series filters are the first surface mount components to effectively filter EMI/RFI on printed circuit boards operating at currents up to 20 Amps. SSM Series filters lend themselves for mounting on densely populated circuit boards where currents of
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Cu3Sn
Abstract: ipc 610 non-wetting
Text: AN10365 Surface mount reflow soldering Rev. 6 — 30 July 2012 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and handling of NXP semiconductor packages.
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Fuses 202
Abstract: No abstract text available
Text: Surface Mount Fuses Subminiature Surface Mount & Dip Types FLAT-PAK Fast Acting Fuse 202 Series ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak® Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting.
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Fuses 202
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003G
Abstract: No abstract text available
Text: SURFACE MOUNT FUSES SUBMINIATURE SURFACE MOUNT & DIP TYPES FLAT-PAK Slo-Blo® Fuse ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting. These fuse
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003G
Abstract: lf2a
Text: Surface Mount Fuses Subminiature Surface Mount & Dip Types FLAT-PAK Slo-Blo® Fuse 203 Series ® ® Fast-Acting and Slo-Blo® Fuse versions of the Flat-Pak Fuse designs are available. Both designs are available in either a gull-wing surface mount package or a DIP configuration for through-hole mounting.
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home appliances with remote control
Abstract: remote control for home appliances aeha GL521 GP1U101X GP1U102X GP1U107X GP1U10X GP1U90X PD49PI
Text: GP1U10X Series GP1U10X Series Compact, Surface Mount and Reflow Soldering Type IR Detecting Unit for Remote Control • Features ■ Outline Dimensions 1. Compact and surface mount type Mounting area : 4/5 compared with GP1U90X (0.9 ) Detector center as a result of adoption of built-in constant voltage circuit
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GP1U10X
GP1U90X)
home appliances with remote control
remote control for home appliances
aeha
GL521
GP1U101X
GP1U102X
GP1U107X
GP1U90X
PD49PI
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GL521
Abstract: GP1U101X GP1U102X GP1U107X GP1U10X GP1U90X PD49PI home appliances with remote control T430
Text: GP1U10X Series GP1U10X Series Compact, Surface Mount and Reflow Soldering Type IR Detecting Unit for Remote Control • Features ■ Outline Dimensions 1. Compact and surface mount type Mounting area : 4/5 compared with GP1U90X (0.9 ) Detector center as a result of adoption of built-in constant voltage circuit
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GP1U10X
GP1U90X)
GL521
GP1U101X
GP1U102X
GP1U107X
GP1U90X
PD49PI
home appliances with remote control
T430
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GL9E04M
Abstract: D 636 R
Text: Surface Mount Type Numeric LED • General Description Sharp's GL8D03M series, GL8D04M series, GL8D56M series are 1-digit, thin package surface mount type numeric LEDs. character height: 8.0/10.16/14.22 mm . It is unnecessary to adjust the mounting height because the thickness of
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GL8D04M
GL8D56M
GL9D04M
GL9D03M
GL9D04M
GL9D56M
GL9E04M
D 636 R
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