MQFP 14X20 Search Results

MQFP 14X20 Result Highlights (5)

Part	Manufacturer	Description
HSP50214BVI	Renesas Electronics Corporation	Programmable Downconverter, MQFP-HS, /Tray
HSP50214BVC	Renesas Electronics Corporation	Programmable Downconverter, MQFP-HS, /Tray
ISL54100CQZ	Renesas Electronics Corporation	TMDS Regenerators with Multiplexers, MQFP, /Tray
ISL54102CQZ	Renesas Electronics Corporation	TMDS Regenerators with Multiplexers, MQFP, /Tray
HSP50415VI	Renesas Electronics Corporation	Wideband Programmable Modulator (WPM), MQFP-HS, /Tray

MQFP 14X20 Price and Stock

Filter by Manufacturer


PEAK electronics GmbH MQFP14X20MM Electronic Component
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
ComSIT USA	MQFP14X20MM		25			1 - 10 - 100 - 1000 - 10000 -	Get Quote
ITW CAMTEX MQFP14X20X20 Electronic Component
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
ComSIT USA	MQFP14X20X20		15			1 - 10 - 100 - 1000 - 10000 -	Get Quote
. MQFP14X20X275 Electronic Component
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
ComSIT USA	MQFP14X20X275		14			1 - 10 - 100 - 1000 - 10000 -	Get Quote

MQFP 14X20 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
MS-022 Abstract: No abstract text available Text: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 SYMBOL 20.000 ±0.100 (E1) 19.870 ±0.100 18.500 REF E1 E 12.500 REF C0.600x0.350	Original	MDP0055 14x20mm MS-022. MS-022	PDF
tip 220 Abstract: MS022 MS-022 r025 14X20MM Text: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 DIMENSIONS (MILLIMETERS) A Max 3.40 20.000 ±0.100 (E1) 19.870 ±0.100	Original	MDP0055 14x20mm MS-022. tip 220 MS022 MS-022 r025	PDF
ipc-SM-782 Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245 Text: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to	Original	AN30000049 ipc-SM-782 14x14-64 MQFP 14X14 AN49 fairchild 245	PDF
ipc-SM-782 Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company Text: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to	Original	AN30000049 ipc-SM-782 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company	PDF
QFP JEDEC tray Abstract: JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard Text: TRAY CONTAINER 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 Applied Package 4.82 6.35 19.6 7.62 135.9 UNIT : mm Quantity (pcs) MQFP 14 × 20 2.7mm Tray Carbon PPE 64-pin Plastic QFP (2.7mm thick)	Original	64-pin 80-pin 100-pin SSD-A-H5899-1 QFP JEDEC tray JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard	PDF
QFP JEDEC tray Abstract: QFP 14 14 tray qfp tray standard Text: 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 4.82 6.35 19.6 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) Tray 64-pin Plastic QFP (2.7mm thick) MAX. 66 Material 80-pin Plastic QFP (2.7mm thick)	Original	64-pin 80-pin 100-pin QFP JEDEC tray QFP 14 14 tray qfp tray standard	PDF
2701 NEC Abstract: nec 2701 Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE ITEM 1. Controlling dimension	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 S80GF-80-3B9-4 2701 NEC nec 2701	PDF
NEC 2701 Abstract: 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524 Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 P80GF-80-3B9-4 SC-581-A NEC 2701 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524	PDF
NEC 2701 Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 SC-582-A P64GF-100-3B8, P64GF-100-3B8 NEC 2701 NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M	PDF
NEC 2701 Abstract: 2701 NEC P100GF-65-3BA1-3 Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S R Q 31 30 100 1 F J G H I M P K M N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 P100GF-65-3BA1-3 NEC 2701 2701 NEC P100GF-65-3BA1-3	PDF
S64GF Abstract: No abstract text available Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 039ch) S64GF-100-3B8, S64GF	PDF
S100GF-65-JBT-1 Abstract: No abstract text available Text: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 detail of lead end C S D R Q 31 30 100 1 F G H I M J K P M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 S100GF-65-JBT-1 S100GF-65-JBT-1	PDF
Untitled Abstract: No abstract text available Text: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 JEDEC Tray MQFP 14x20 2.7mm LA-044A-1 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S Q R 31 30 100 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.15 mm (0.006 inch) of	Original	LA-2244A-1 LA-1244A-1 LA-044A-1 S100GF-65-3BA-3	PDF
microprocessors architecture of 8251 Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200 Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to	Original	CLA200 DS4812 microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251	PDF

zarlink clt Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to	Original	CLA200 DS4812 zarlink clt 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic	PDF
PC MOTHERBOARD ibm rev 1.5 Abstract: rev 1.5 ibm motherboard ibm xt MOTHERBOARD CIRCUIT diagram "LPC I/O" LPC47M172 PC MOTHERBOARD CIRCUIT diagram motherboard ibm rev 1.5 free circuit diagram of motherboard IBM Rev 1.6 MOTHERBOARD CIRCUIT diagram free circuit diagram of pc motherboard pd down Text: LPC47M172 Advanced I/O Controller with Motherboard GLUE Logic Data Brief Product Features 3.3V Operation 5V tolerant LPC Interface − Multiplexed Command, Address and Data Bus − Serial IRQ Interface Compatible with Serialized IRQ Support for PCI Systems	Original	LPC47M172 PC99a/PC2001 PC MOTHERBOARD ibm rev 1.5 rev 1.5 ibm motherboard ibm xt MOTHERBOARD CIRCUIT diagram "LPC I/O" LPC47M172 PC MOTHERBOARD CIRCUIT diagram motherboard ibm rev 1.5 free circuit diagram of motherboard IBM Rev 1.6 MOTHERBOARD CIRCUIT diagram free circuit diagram of pc motherboard pd down	PDF
FPQ 208 0.5 10 Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0 Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch	Original	AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64	PDF
EIA 481 QFN pin 1 Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1 Text: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged	Original	TB347 EIA-481 EIA 481 QFN pin 1 smd transistor 5c sot-23 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1	PDF
tqfp 7X7X1.4mm Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE Text: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged	Original	TB347 EIA-481 NOMINA24) tqfp 7X7X1.4mm 14x14x1.4mm wlcsp inspection MO-169 TQFP 48-1 PACKAGE	PDF
21x21 Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1 Text: 検索ツール 1. ツールバーのアイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して，検索 F をクリックしてください。	Original	P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1	PDF
QFn 64 tape carrier Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN Text: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with	Original	EIA-481 TB347 QFn 64 tape carrier Techwell 7x7x1 MO-169 1748 QFN	PDF
Untitled Abstract: No abstract text available Text: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to	OCR Scan	CLA200 DS4812	PDF
Arm processor vlsi technology Abstract: PC302 QFP 128 bonding Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec	OCR Scan	45-micron Arm processor vlsi technology PC302 QFP 128 bonding	PDF
Untitled Abstract: No abstract text available Text: h a r r H C -5506 i s S E M I C O N D U C T O R Ê ADVANCE INFORMATION È \J DSLIC Dual Subscriber Line Interface Circuit June 1994 Features Description • Integration of Two SLlCs in One Package T h e H C -550 6 is a Dual Subscriber Line Interface Circuit	OCR Scan	5M-1982. 43QE271	PDF

Privacy Settings

MQFP 14X20 Search Results

MQFP 14X20 Result Highlights (5)

MQFP 14X20 Price and Stock

PEAK electronics GmbH MQFP14X20MM

ITW CAMTEX MQFP14X20X20

. MQFP14X20X275

MQFP 14X20 Datasheets Context Search

MS-022

tip 220

ipc-SM-782

ipc-SM-782

QFP JEDEC tray

QFP JEDEC tray

2701 NEC

NEC 2701

NEC 2701

NEC 2701

S64GF

S100GF-65-JBT-1

Untitled

microprocessors architecture of 8251

zarlink clt

PC MOTHERBOARD ibm rev 1.5

FPQ 208 0.5 10

EIA 481 QFN pin 1

tqfp 7X7X1.4mm

21x21

QFn 64 tape carrier

Untitled

Arm processor vlsi technology

Untitled