MO-112
Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,
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MO-112
Abstract: MS-029 MATRIX TRAY MS-022 LD240
Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced
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LD 337
Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material
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MQFP352
Abstract: 81F64842B k9 diode MQFP84
Text: 68 pins MQFPF Multilayer Quad Flat Pack MQFP Package Outlines Code: KM Date: 03/08/95 Rev B – 23-Aug-01 1 MQFP 84 pins MQFPF (0.65 inch square) Code: K6 Date: 20/07/99 2 Rev B – 23-Aug-01 84 pins MQFPF (1.15 inch square) Code: K2 Date: 22/09/98 3 MQFP
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23-Aug-01
19use
MQFP352
81F64842B
k9 diode
MQFP84
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100MA RELAY
Abstract: 9250B M44-3 MAX5913A MAX5913AEMH MAX5914A MAX5914AEMH
Text: 19-3302; Rev 0; 5/04 +48V Quad Hot-Swap Controllers For Power-Over-LAN Ordering Information TEMP RANGE PINPACKAGE PKG CODE MAX5913AEMH -40°C to +85°C 44 MQFP M44-3 MAX5914AEMH* -40°C to +85°C 44 MQFP M44-3 PART *Future product—contact factory for availability.
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MAX5913AEMH
M44-3
MAX5914AEMH*
MAX5913A
MAX5914A
MQFP44
MAX5913A/MAX5914A
100MA RELAY
9250B
M44-3
MAX5913A
MAX5913AEMH
MAX5914A
MAX5914AEMH
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Untitled
Abstract: No abstract text available
Text: 19-3302; Rev 1; 1/11 +48V Quad Hot-Swap Controllers For Power-Over-LAN ♦ On-Chip +12V, 100mA Voltage Relay Drivers Ordering Information TEMP RANGE PIN-PACKAGE MAX5913AEMH+ PART -40°C to +85°C 44 MQFP MAX5913AEMH+T -40°C to +85°C 44 MQFP MAX5914AEMH+
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100mA
MAX5913AEMH+
MAX5913AEMH
MAX5914AEMH+
MAX5914AEMH
MAX5914A.
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dallas date code
Abstract: transistor 9647 CARSEM leadframe materials DS5000 dALLAS MARKING CODE
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: January 20, 1997 Subject: PRODUCT CHANGE NOTICE – A70201 Description: Package Change – 80 Lead MQFP at Carsem and Anam Description of Change: Dallas Semiconductor will change the leadframe material for the 80 lead MQFP built in Carsem and
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A70201
DS5000
DS5001
DS5002
dallas date code
transistor 9647
CARSEM
leadframe materials
DS5000
dALLAS MARKING CODE
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Untitled
Abstract: No abstract text available
Text: 19-3302; Rev 0; 5/04 +48V Quad Hot-Swap Controllers For Power-Over-LAN Ordering Information TEMP RANGE PINPACKAGE PKG CODE MAX5913AEMH -40°C to +85°C 44 MQFP M44-3 MAX5914AEMH* -40°C to +85°C 44 MQFP M44-3 PART *Future product—contact factory for availability.
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MAX5913A/MAX5914A
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Untitled
Abstract: No abstract text available
Text: 44-Lead Metric Quad Flat Pack MQFP 3.2mm Footprint Package Dimensions 44-Lead Metric Quad Flat Pack (MQFP) 3.2mm Footprint Inches Symbol Min. A A1 A2 B C D/E D1/E1 e L N ND α ccc Max. .077 .093 .000 .010 .077 .083 .012 .018 .005 .009 .510 .530 .390 .398
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44-Lead
5M-1982.
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ipc-SM-782
Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
Text: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to
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AN30000049
ipc-SM-782
14x14-64
MQFP 14X14
AN49
fairchild 245
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MT9075BP1
Abstract: MT9075BL1 MT9075BP 24 seconds counter MO-112 MT9075B MT9075BL MT9075BPR PCM30
Text: MT9075B E1 Single Chip Transceiver Data Sheet Features • August 2005 Combined PCM 30 framer, Line Interface Unit LIU and link controllers in a 68 pin PLCC or 100 pin MQFP package Ordering Information MT9075BPR 68 Pin PLCC MT9075BL 100 Pin MQFP MT9075BP
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MT9075B
MT9075BPR
MT9075BL
MT9075BP
MT9075BPR1
MT9075BP1
MT9075BL1
MT9075BP1
MT9075BL1
MT9075BP
24 seconds counter
MO-112
MT9075B
MT9075BL
MT9075BPR
PCM30
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ipc-SM-782
Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
Text: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to
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AN30000049
ipc-SM-782
128 QFP 14x20
footprint jedec mo-108
RAYTHEON
Raytheon Electronics
MQFP 80 PACKAGE
qfp 64 land pattern
qfp land pattern
QFP-10X10-44
Raytheon Company
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JESD51-7
Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Text: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull
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80mmC
JESD51-7
100L
JESD51-2
STATS ChipPAC
Techpoint
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Untitled
Abstract: No abstract text available
Text: 19-2244; Rev 0; 10/01 +48V Quad Hot-Swap Controllers For Power-Over-LAN TEMP. RANGE PIN-PACKAGE MAX5913EMH PART -40°C to +85°C 44 MQFP MAX5914EMH -40°C to +85°C 44 MQFP 34 ON1 RLYON1 DC 36 35 ON2 RLYON2 37 38 39 RLYON4 ON3 RLYON3 40 41 33 2 32 3 31 4 30
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MAX5913/MAX5914
MQFP44
MAX5913/MAX5914
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P-MQFP-144-1
Abstract: P-MQFP144-1 C167 P-MQFP QC160
Text: KONTRON ELEKTRONIK Adapter Set QC160 - P-MQFP144-1 Press On for SAB C167 Top Connection: Quad Connector 160 for SAB C167 Bot tom Connection: CPU SAB C167 P-MQFP-144-1 surface mounted. 11 approx. QC160 Probe or Adapter for C167 Side View: 5 approx. 4 1 QC160- P-MQFP-144-1
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QC160
P-MQFP144-1
P-MQFP-144-1
QC160-
P-MQFP-144-1
C167
P-MQFP
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1013W
Abstract: No abstract text available
Text: 19-2244; Rev 1; 5/02 +48V Quad Hot-Swap Controllers For Power-Over-LAN PART PIN-PACKAGE -40°C to +85°C 44 MQFP MAX5914EMH -40°C to +85°C 44 MQFP 34 ON1 RLYON1 DC 36 35 ON2 RLYON2 37 38 39 RLYON4 ON3 RLYON3 33 2 32 3 31 4 30 5 29 MAX5913 MAX5914 6 7 28
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MAX5913/MAX5914
MAX5913/MAX5914
MQFP44
1013W
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FDT3612
Abstract: MAX5913 MAX5913EMH MAX5914 MAX5914EMH
Text: 19-2244; Rev 2; 11/02 +48V Quad Hot-Swap Controllers For Power-Over-LAN TEMP RANGE PIN-PACKAGE MAX5913EMH PART -40°C to +85°C 44 MQFP MAX5914EMH -40°C to +85°C 44 MQFP 34 ON1 RLYON1 DC 36 35 ON2 RLYON2 37 38 39 RLYON4 ON3 RLYON3 40 41 33 2 32 3 31 4 30
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MAX5913EMH
MAX5914EMH
MAX5913
MAX5914
MQFP44
MAX5913/MAX5914
FDT3612
MAX5913
MAX5913EMH
MAX5914
MAX5914EMH
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C500
Abstract: C501G-L C504-L C511A-R C511-R USART PLCC44 PACKAGING P-MQFP-44
Text: 256 32 – 3 6/2 USART – – – – 1 – – – P-DIP-40 P-LCC-44 P-MQFP-44 512 32 8 / 10 4 12 / 2 USART – – 6-ch – 1 – † † P-MQFP-44 32 – 2 4/2 SSC – – – – 1 – – – – – – – 1 – – – 128 / 256 256 512 Packaging
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P-DIP-40
P-LCC-44
P-MQFP-44
C505-L
16-Bit)
C505L-4E
C513-1R
C513A-L
C500
C501G-L
C504-L
C511A-R
C511-R
USART
PLCC44 PACKAGING
P-MQFP-44
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AN 7823
Abstract: 100L JESD51-2 JESD51-7 Techpoint
Text: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP
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C505CA-4RC
Abstract: C505CA-LM C505 C505CA C505CA-2RM C505CA - 4RC C505C
Text: Microcontrollers Errata Sheet 4 December 2000 / Release 1.0 Device: C505A-4RM, C505CA-2RM / 4RM / LM, C505CA-4RC Stepping Code / Marking: Package: ES-BB, BB P-MQFP-44, Bare Die This Errata Sheet describes the deviations from the current user documentation. The
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C505A-4RM,
C505CA-2RM
C505CA-4RC
P-MQFP-44,
C505A/C505CA
/C505C
C505CA-4RC
505CA-2RM/C505CA-4RM/C505CA-LM/C505CA-4RC
C505CA-LM
C505
C505CA
C505CA - 4RC
C505C
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USS-825
Abstract: FRX05 D735 USS820B
Text: Advisory April 1999 USS-820B/USS-825B USB Device Controller This advisory contains clarifications/changes to the Lucent Technologies Microelectronics Group USS-820/ USS-825 USB Device Controller Data Sheet DS99-069CMPR and applies only to Lucent’s 44-pin MQFP
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USS-820B/USS-825B
USS-820/
USS-825
DS99-069CMPR)
44-pin
USS-820B
48-pin
USS-825B
DS99-069CMPR-03
FRX05
D735
USS820B
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Analog devices code marking AB
Abstract: marking code p14 C505 C505C
Text: Errata Sheet July 07, 1998 / Release 1.0 Device: C505 C505C Stepping Code / Marking: Package: AB P-MQFP-44 This Errata Sheet describes the deviations from the current user documentation. The classification and numbering system is module oriented in a continual ascending sequence
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C505C
P-MQFP-44
004Bh
F702h)
C505C,
Analog devices code marking AB
marking code p14
C505
C505C
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"marking ca"
Abstract: C504-2E marking CA
Text: Microcontrollers Errata Sheet 10 Nov, 1999 / Release 1.3 Device: Stepping Code / Marking: Package: C504-2E CA P-MQFP-44 This Errata Sheet describes the deviations from the current user documentation. The classification and numbering system is module oriented in a continual ascending sequence
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C504-2E
P-MQFP-44
40MHz
C504-2E,
"marking ca"
C504-2E
marking CA
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C504
Abstract: C504-2R C504-L
Text: Microcontrollers Errata Sheet 20 Sept 1999 / Release 1.7 Device: Stepping Code / Marking: Package: C504-L / C504-2R AC MQFP-44 This Errata Sheet describes the deviations from the current user documentation. The classification and numbering system is module oriented in a continual ascending sequence
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C504-L
C504-2R
MQFP-44
C504-2R,
C504
C504-2R
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