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    MR18R162WEG0 Search Results

    MR18R162WEG0 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MR18R162WEG0-CM8 Samsung Electronics (16M x 18) * 32 pcs RIMM Module Based on 288 MBit E-die, 32s Banks, 16k/32 ms Ref, 2.5 V Original PDF

    MR18R162WEG0 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    b41 Marking

    Abstract: No abstract text available
    Text: MR18R162WEG0 Change History Version 0.1 January 2004 * First copy. * Based on the 1.0 ver.(July 2002) 288Mbit D-die 32d RIMM Module Datasheet Version 1.0 (May 2004) * Eliminate "Preliminary" Page 0 Version 1.0 May 2004 MR18R162WEG0 (16Mx18)*32pcs RIMM Module based on 288Mb E-die, 32s banks,16K/32ms Ref, 2.5V


    Original     		PDF MR18R162WEG0 288Mbit 16Mx18) 32pcs 288Mb 16K/32ms b41 Marking

    A76 MARKING CODE

    Abstract: a77 package marking a80 marking code marking A32 marking A45 marking code B38 MR18R162WEG0-CM8 MARKING B17 MARKING CODE B82 marking a86
    Text: Preliminary MR18R162WEG0 Change History Version 0.1 January 2004 * First copy. * Based on the 1.0 ver.(July 2002) 288Mbit D-die 32d RIMM Module Datasheet Page 0 Version 0.1 Jan. 2004 Preliminary MR18R162WEG0 (16Mx18)*32pcs RIMM Module based on 288Mb E-die, 32s banks,16K/32ms Ref, 2.5V


    Original     		PDF MR18R162WEG0 288Mbit 16Mx18) 32pcs 288Mb 16K/32ms A76 MARKING CODE a77 package marking a80 marking code marking A32 marking A45 marking code B38 MR18R162WEG0-CM8 MARKING B17 MARKING CODE B82 marking a86