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    MT4C16257 Search Results

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    MT4C16257 Price and Stock

    Micron Technology Inc MT4C16257DJ-6

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    Bristol Electronics MT4C16257DJ-6 121
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    Quest Components MT4C16257DJ-6 84
    • 1 $7.23
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    MT4C16257DJ-6 32
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    MT4C16257DJ-6 24
    • 1 $7.23
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    Micron Technology Inc MT4C16257DJ-7

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    Bristol Electronics MT4C16257DJ-7 53 1
    • 1 $8.96
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    Quest Components MT4C16257DJ-7 160
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    MT4C16257DJ-7 42
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    MT4C16257DJ-7 29
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    MT4C16257DJ-7 12
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    MT4C16257DJ-7 9
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    MT MT4C16257DJ-70

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    Bristol Electronics MT4C16257DJ-70 20
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    Mitel Networks Corporation MT4C16257Z-7

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    Bristol Electronics MT4C16257Z-7 5
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    Micron Technology Inc MT4C16257DJ-8

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    Quest Components MT4C16257DJ-8 8
    • 1 $11.741
    • 10 $10.4364
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    MT4C16257 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MT4C16257 Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF
    MT4C16257DJ-6 Micron 256K x 16 FPM DRAM Original PDF

    MT4C16257 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MT4C16257DJ-6

    Abstract: MT4C16257 MT4C16257DJ-6 pin out mt4c16257dj
    Text: 256K x 16 FPM DRAM TECHNOLOGY, INC. MT4C16257 DRAM FEATURES • Industry-standard x16 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V ±10% power supply • All inputs, outputs and clocks are TTL-compatible


    Original
    MT4C16257 512-cycle 40-Pin MT4C16257DJ-6 MT4C16257 MT4C16257DJ-6 pin out mt4c16257dj PDF

    TC5118160

    Abstract: msm-561 TMS444000 msm561 M5M418165 M5M418160 tms44c256 TC5117405 HY514264 HY514260
    Text: New Page 1 DRAM 1Meg 1Mx1 256Kx4 FPM FPM Fujitsu MB81C100 MB81C4256 Goldstar GM71C100 GM71C4256 Hitachi HM511000 HM514256 Hyundai HY531000 HY534256 Micron MT4C1024 MT4C4256 Mitsubishi M5M41000 M5M44256 Nec UPD421000 UPD424256 Oki MSM511000 MSM514256 Samsung alt KM41C1000 KM44C256


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    256Kx4 MB81C100 MB81C4256 GM71C100 GM71C4256 HM511000 HM514256 HY531000 HY534256 MT4C1024 TC5118160 msm-561 TMS444000 msm561 M5M418165 M5M418160 tms44c256 TC5117405 HY514264 HY514260 PDF

    am29f010b-70ef

    Abstract: A29010-70F AM29F040B-55JF AM29F040B-90jf Pm25LV512A am29f800bb-70ef S29AL004D55TFI02 AM29F040B-90JI AM29F010B70JF tc55257 cross reference
    Text: Cross Reference Memory IC's and More www.amictechnology.com part number AMIC part number µPD4218165 µPD4218165 µPD424260 µPD431000A µPD43256B µPD441000L-B µPD442000L-B µPD442012L-XB µPD444012L-B A29F002 AM29F002B AM29F002BB-120JF AM29F002BB-55JD AM29F002BB-90EI


    Original
    PD4218165 PD424260 PD431000A PD43256B PD441000L-B PD442000L-B PD442012L-XB PD444012L-B A29F002 am29f010b-70ef A29010-70F AM29F040B-55JF AM29F040B-90jf Pm25LV512A am29f800bb-70ef S29AL004D55TFI02 AM29F040B-90JI AM29F010B70JF tc55257 cross reference PDF

    MT4C16257

    Abstract: No abstract text available
    Text: MT4C16257 L 256KX 16 DRAM (M IC R O N 256K x 16 DRAM DRAM 5V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V +10% power supply*


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    MT4C16257 256KX 375mW 512-cycle 12/9S L1115H7 PDF

    BCM 6302

    Abstract: micron MT4C database for 4081 ic
    Text: OBSOLETE MARCH 1995 D18A 512K X 8, 256K x 16 D R A M D IE I^IICRON 512Kx 8, 256Kx 16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A G EN ERAL PHYSICAL SPECIFICATIONS • Wafer thickness =18.5 mils ±0.5 mils. • The backside wafer surface Is polished bare silicon.


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    114x114 512Kx 256Kx MT4C8512D18A MT4C16257D18A 150mm BCM 6302 micron MT4C database for 4081 ic PDF

    MT4C16257DJ-6

    Abstract: No abstract text available
    Text: 256K X 16 FPM DRAM MICRON I TECHNOLOGY, INC. DRAM MT4C16257 FEATURES • In d u stry -sta n d a rd x l6 p in o u ts, tim ing, functions an d packages • H igh-perform ance CM OS silicon-gate process • Single +5V +10% p o w er su p p ly • All in p u ts, o u tp u ts an d clocks are TTL-com patible


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    MT4C16257 512-cycle 40-Pin MT4C16257DJ-6 PDF

    MT4C16257

    Abstract: No abstract text available
    Text: p iC R MT4C16257 L 256K X 16 DRAM O N DRAM 256K x 16 DRAM 5V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES • In d u stry-stan d ard x l 6 p in o u ts, tim in g , fu n ctio n s an d p ackages • H ig h -p erfo rm a n ce C M O S silico n -g a te p ro cess


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    MT4C16257 512-cy PDF

    Untitled

    Abstract: No abstract text available
    Text: MICRON MT4C16257 256K X 16 DRAM I ,lt— DRAM 256K x 16 DRAM 5V, FAST PAGE M O DE PIN ASSIGNMENT Top View • In d u stry -sta n d a rd x l 6 p in o u ts, tim in g , fu n ctio n s an d packages • H ig h -p erfo rm a n ce C M O S silico n -g ate process


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    MT4C16257 12-cy 40-Pin 00122A2 PDF

    Untitled

    Abstract: No abstract text available
    Text: MICRON SEMICONDUCTOR INC b?E D • b 1 1 1 5 MT 000^7=57 711 ■ MRN OBSOLETE JUNE 94 D18A 512K X 8, 256K X 16 DRAM DIE M IC R O N B SEMiCONO'JCTOa INC. 512Kx8, 256Kx16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A GENERAL PHYSICAL SPECIFICATIONS • • •


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    114x114 512Kx8, 256Kx16 MT4C8512D18A MT4C16257D18A 150mm PDF

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE MICRON MT4LC16257 S I 2256KX 5 6 K X 16 DRAM DRAM 256K x 16 DRAM 3.3V, FAST PAGE MODE, OPTIONAL SELF REFRESH PIN ASSIGNMENT (Top View) • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CMOS silicon-gate process


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    MT4LC16257 256KX 512-cycle MT4LC16257) T4LC16257S) PDF

    Untitled

    Abstract: No abstract text available
    Text: MT2D25632, MT4D51232 256K, 512K x 32 DRAM MODULE MICRON I TECHNOLOGY. INC DRAM MODULE 256K, 512K x 32 1, 2 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT Front View OPTIONS 72-Pin SIMM (DD-5) 256K x 32 (DD-6) 512K x 32 o imïïïïirrffrrmmy^^ 1 PIN#


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    MT2D25632, MT4D51232 72-Pin 41ucts PDF

    Untitled

    Abstract: No abstract text available
    Text: m i t i » MT4C16256/7/8/9 L 256K X 1 6 WIDE DRAM MICRON • SEMICONDUCTOR. MC WIDE DRAM 256KX16DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIGNMENT Top View • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process


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    MT4C16256/7/8/9 256KX16DRAM MT4C16257 MT4C16258/9 512-cycle 500mW T4C1S256/7/VU. PDF

    Untitled

    Abstract: No abstract text available
    Text: '993 Tí* PRELIMINARY MT4C16256/7/8/9 256K X 16 WIDE DRAM MICRON I SCHICONDUCTOR MC WIDE DRAM 256K X 16 DRAM FAST-PAGE-MODE FEATURES OPTIONS PIN ASSIGNMENT Top View 40-Pin SOJ (DC-6) Vcc [ 1 DOl [ 2 D02 E 3 D03 E 4 004 [ 5 • Write Cycle Access _ BYTE or WORD via WE


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    MT4C16256/7/8/9 40-Pin C1993 MT4C162S6/7/V9 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM M IC R O N 256KX16DRAM WIDE DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIG N M EN T Top View OPTIONS • Write Cycle Access BYTE or WORD via WE - (maskable) BYTE or WORD via CÄS (maskable) • Packages


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    MT4C16256/7/8/9 256KX16DRAM 40-Pin MT4C16256/7/8/9L PDF

    Untitled

    Abstract: No abstract text available
    Text: HICR0N TECHNOLOGY INC bOE D • b l l l S H 1! GGObbOl 43b ■ urn PRELIMINARY 256K x 16 DRAM WIDE DRAM FAST-PAGE-MODE SELF REFRESH FEATURES PIN ASSIGNMENT Top View • SELF REFRESH, or "Sleep M ode" • Industry-standard x l6 p inouts, tim ing, functions


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    500mW 512-cycle MT4C16256/7/8/9S MT4C16256/7/8/9 PDF

    MT4C16256DJ-7

    Abstract: No abstract text available
    Text: lU IIÖ Q ö lX I I techno lo g y. iN t MT4CÎ6256/7* 256K X 16 DRAM DRAM 256Kx 16DRAM FAST PAGE MODE FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CMOS silicon-gate process • Single +5V ±10% pow er supply*


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    256Kx 16DRAM 512-cycle MT4C16257 MT4C16256/7 CYCLE24 MT4CI82S4/7 1QT94 QD1111D MT4C16256DJ-7 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY MT4C16256/7/8/9 256KX 16 WIDE DRAM MICRON WIDE DRAM 256K 16 DRAM X FAST-PAGE-MODE FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CM OS silicon-gate process • Single +5V ±10% power supply • Low power, 3mW standby; 500m W active, typical


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    MT4C16256/7/8/9 256KX 512-cycle 40-Pin PDF

    MA4380

    Abstract: DU20
    Text: MT2D25632, MT4D51232 256K. 512K x 32 DRAM M O D U LE M IC R O N 256K, 512K x 32 DRAM MODULE 1 ,2 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT (Front View • JEDEC- and industry-standard pinout in a 72-pin single-in-line m emory module (SIMM) • High-perform ance CM OS silicon-gate process


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    MT2D25632, MT4D51232 72-pin 756mW 512-cycle MT4D51232 T4D51232 MA4380 DU20 PDF

    0Q1335

    Abstract: No abstract text available
    Text: PRELIMINARY M T4C 16256/7/8/9 256K X 16 W IDE DRAM I^IICZROIM 256K X 16 DRAM WIDE DRAM FEATURES PIN ASSIGNMENT Top View • I n d u s try -s ta n d a rd x l6 p in o u ts, tim in g , fu n ctio n s a n d p ack ag e s • H ig h -p e rfo rm a n c e C M O S silicon-gate pro c e ss


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    512-cycle 0Q1335 PDF

    Untitled

    Abstract: No abstract text available
    Text: NI CR ON S F 1 I C C N D U C T O R INC blllS'-H Ü 0 1 0 0 Q Ü 5 b^ • URN bTE i MICRON I M T4 D 51232 5 12 K X 3 2 D R A M M O D U L E sem iconductorm e. DRAM MODULE 512K x 32 DRAM FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View • Industry-standard pinout in a 72-pin single-in-line


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    72-pin 512-cycle 51232M CYCLE20 MT4D51Z32 MT4D51232 PDF

    VG264265B

    Abstract: TC5117405CSJ hyundai cross reference guide TC51V16160 Micron 4MX32 EDO SIMM dram cross reference cross reference tc5117800cft SAMSUNG Cross Reference
    Text: Cross Reference Guide 1.3. Cross Reference Guide 1.3.1. Cross Reference of 256kxl6 DRAM Vendors\Configuration VIS Hitachi Hyundai Micron Motorola NEC Samsung Toshiba TI 256kxl6, 5V, EDO VG264265B HM514265D HY514264B MT4C16270 N/A PD4244265LE KM416C254D TC5144265D


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    256kxl6 256kxl6, VG264265B HM514265D HY514264B MT4C16270 uPD4244265LE KM416C254D TC5144265D TC5117405CSJ hyundai cross reference guide TC51V16160 Micron 4MX32 EDO SIMM dram cross reference cross reference tc5117800cft SAMSUNG Cross Reference PDF

    Untitled

    Abstract: No abstract text available
    Text: M IC S Q N I IIW - 1 W IH • t s em c o n o u c to r MT2D88C25632, MT4D88C5123Z 1MBr 2MB DRAM CARDS n c DRAM CARD 1, 2 MEGABYTES 256K, 512K x 32; 5.0V FAST PAGE MODE FEATURES • Low power • JEDEC-standard 88-pin DRAM card pinout • Polarized receptacle connector


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    MT2D88C25632, MT4D88C5123Z 88-pin MT2DMC25C32. C51232 GD11374 MT4D88C51232 MT20MC2S632. PDF

    Untitled

    Abstract: No abstract text available
    Text: DRAM 256K X 16 DRAM 5V, FAST PAGE MODE IEATURES • Industry-standard xl6 pinouts, timii g, functions and packages • High-performance CMOS silicon-ga e process • Single +5V ±10'^ power supply* • Low power, 3mW standby; 375mW ictive, typical • All device pins are fully TTL-compa ible


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    375mW 512-cycle 40-Pin PDF

    Untitled

    Abstract: No abstract text available
    Text: m ' i PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM MICRON I SEMICONDUCTOR MC WIDE DRAM 256K x 16 DRAM LOW POWER, EXTENDED REFRESH FEATURES • In d u stry -stan d ard x l6 pinouts, tim ing, functions a n d packages • H igh-perform ance CMOS silicon-gate process


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    MT4C16256/7/8/9 T4C16257/9 T4C16258/9 512-cyde 500mW MT4C162S6/7/W PDF