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    MULTICHIP PACKAGES Search Results

    MULTICHIP PACKAGES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    MULTICHIP PACKAGES Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MULTICHIP PACKAGES National Semiconductor Multi-Chip Packages Original PDF

    MULTICHIP PACKAGES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Packaging technology PSGA – an innovative IC package for single and multichip designs More and more applications with multipin ICs or multichip systems require even smaller, flatter and more economical packages. The innovative PSGATM polymer stud grid array package for


    Original     		PDF 232-pin, B-3001 B-8020

    cohesive

    Abstract: No abstract text available
    Text: Fujitsu offers the widest range of multichip module MCM and multichip package (MCP) technology available in the industry today. MCM is a completely custom solution that creates a specialized module. MCP offers multiple chips in a standard package and form factor.


    Original     		PDF

    AD834x

    Abstract: AD77XX AD832x MCP market AD78xx AD92xx AD983x 8B2000 9433 ad9432
    Text: Analog Devices, Inc. MultiChip Products Business Unit MCP High Performance Signal Processing Solutions MultiChip Products Business Unit ADI MCP’s MIXED SIGNAL INTEGRATED CHIP MODULES: Sub-System Solutions for Signal Processing System Integrators who can benefit from Higher Levels of Performance and Density


    Original     		PDF

    PSRAM

    Abstract: M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT M69KB096AM
    Text: M36L0R7060T1 M36L0R7060B1 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (Burst) PSRAM, 1.8 V supply, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash memory


    Original     		PDF M36L0R7060T1 M36L0R7060B1 M36L0R7060T1: 88C4h M36L0R7060B1: 88C5h TFBGA88 PSRAM M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT M69KB096AM

    P113 IR

    Abstract: teseo 2 data output STA8058A 14095 STA8058ATR
    Text: STA8058 TESEO high performance GPS multichip module MCM Data brief − production data Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes.


    Original     		PDF STA8058 STA2058 STA5620 66-MHz P113 IR teseo 2 data output STA8058A 14095 STA8058ATR

    PSRAM

    Abstract: M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT ubp 100
    Text: M36L0R7060T1 M36L0R7060B1 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (Burst) PSRAM, 1.8 V supply, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash memory


    Original     		PDF M36L0R7060T1 M36L0R7060B1 M36L0R7060T1: 88C4h M36L0R7060B1: 88C5h TFBGA88 PSRAM M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT ubp 100

    M36L0T7060B

    Abstract: M36L0T7060 TFBGA88 M69KW096B DSA0042593 flash E2p M58LT128HB M58LT128HT M36L0T7
    Text: M36L0T7060T2 M36L0T7060B2 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (4 Mb x16) PSRAM, multichip package Preliminary Data Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash Memory


    Original     		PDF M36L0T7060T2 M36L0T7060B2 M36L0T7060T2: 88C4h M36L0T7060B2: 88C5h M36L0T7060B M36L0T7060 TFBGA88 M69KW096B DSA0042593 flash E2p M58LT128HB M58LT128HT M36L0T7

    Untitled

    Abstract: No abstract text available
    Text: STA8058 TESEO high performance GPS multichip module MCM Data brief  production data Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes.


    Original     		PDF STA8058 STA2058 STA5620 66-MHz

    M36L0T8060

    Abstract: flash E2p M69KW096B
    Text: M36L0T8060T1 M36L0T8060B1 256 Mbit 16 Mb x16, multiple bank, multilevel, burst Flash memory and 64 Mbit PSRAM, 1.8 V core, 3 V I/O supply, multichip package Features Multichip package • 1 die of 256 Mbit (16 Mb ×16, multiple bank, multilevel, burst) Flash memory


    Original     		PDF M36L0T8060T1 M36L0T8060B1 M36L0T8060T1: 880Dh M36L0T8060B1: 880Eh TFBGA88 M36L0T8060 flash E2p M69KW096B

    P113H

    Abstract: teseo 2 data output ARM7 teseo teseo STA2058 STA8058A STA5620 P113 IR STA8058 5.5MB
    Text: STA8058 TESEO high performance GPS multichip module MCM Data Brief Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes. ■ 66-MHz ARM7TDMI 32 bit processor


    Original     		PDF STA8058 STA2058 STA5620 66-MHz STA8058 17x19 25x25 P113H teseo 2 data output ARM7 teseo teseo STA8058A P113 IR 5.5MB

    Telesis

    Abstract: intellitech teradyne victory 70T3539M corelis jtag AN-411 BC256 IDT70T3539M ontap JTAG Technologies
    Text: JTAG Testing of IDT’s Multichip Modules Application Note AN-411 JTAG TESTING OF MULTICHIP MODULES APPLICATION NOTE AN-411 Introduction The intent of this application note is to provide instruction on how to perform JTAG test pattern generation TPG for IDT’s MCMs on a


    Original     		PDF AN-411 Telesis intellitech teradyne victory 70T3539M corelis jtag AN-411 BC256 IDT70T3539M ontap JTAG Technologies

    M39P0R1080E4

    Abstract: M39P0R9080E4 M58PR001LE M58PR512LE M39P0R09080E4 BCAS SD
    Text: M39P0R9080E4 M39P0R1080E4 512 Mb or 1 Gb x16, multiple bank, multilevel, burst Flash memory 256 Mbit low power SDRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 512 Mbit (32 Mb x16) or 1 Gbit (64 Mb ×16) multiple bank, multilevel, burst)


    Original     		PDF M39P0R9080E4 M39P0R1080E4 TFBGA165 64-bit M39P0R1080E4 M39P0R9080E4 M58PR001LE M58PR512LE M39P0R09080E4 BCAS SD

    Untitled

    Abstract: No abstract text available
    Text: M36W0R6050T1 M36W0R6050B1 64 Mbit 4 Mb x16, multiple bank, burst Flash memory and 32 Mbit (2 Mb ×16) PSRAM, multichip package Features • Multichip package – 1 die of 64 Mbit (4 Mb × 16) Flash memory – 1 die of 32 Mbit (2 Mb × 16) PSRAM ■ Supply voltage


    Original     		PDF M36W0R6050T1 M36W0R6050B1 M36W0R6050T1: 8810h M36W0R6050B1: 8811h

    Untitled

    Abstract: No abstract text available
    Text: M36P0R8070E0 256 Mbit x16, multiple bank, multilevel, burst Flash memory 128 Mbit (burst) PSRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 256 Mbit (16 Mb x 16, multiple bank, multilevel, burst) Flash memory – 1 die of 128 Mbit (8 Mb x16) PSRAM


    Original     		PDF M36P0R8070E0

    M36L0T7050T2

    Abstract: M58LT128HB M58LT128HT M36L0t7050
    Text: M36L0T7050T2 M36L0T7050B2 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 32 Mbit (2 Mb x16) PSRAM, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash Memory – 1 die of 32 Mbit (2 Mb x16) Pseudo SRAM


    Original     		PDF M36L0T7050T2 M36L0T7050B2 M36L0T7050T2: 88C4h M36L0T7050B2: 88C5h M36L0T7050T2 M58LT128HB M58LT128HT M36L0t7050

    Untitled

    Abstract: No abstract text available
    Text: BGA Technology f eatures ▲ JEDEC compliant standard PBGA packages ▲ Extensive experience in mass producing cost-effective & high-volume singlechip and multichip PBGA packages ▲ Tailored to higher I/Os and higher clock frequency designs ▲ Enhanced electrical, mechanical and


    Original     		PDF APT-BGATB-20380-1

    Spansion

    Abstract: S71VS064R S29VS064 NLB056 NS032J S29VS064R VDE044 NSB056 S29NS032J Spansion MCP products, 56
    Text: SPANSION LLC 915 DeGuigne Drive, P.O. Box 3453 Sunnyvale, California 94088-3453, USA September 23, 2009 Obsolescence Notification No: Subject: 2775 Obsolescence of the discrete 110nm CMOS 1.8V NS032J Products & the MultiChip Packages MCP containing 110nm CMOS 1.8V NS032J Products.


    Original     		PDF 110nm NS032J S29NS032J S71NS032J 44-ball VDE044) Spansion S71VS064R S29VS064 NLB056 S29VS064R VDE044 NSB056 S29NS032J Spansion MCP products, 56

    kyocera design guide

    Abstract: dupont 951 Ferro ltcc dupont 943 dupont 951 green tape kyocera design guide ltcc kyocera ceramic package Kyocera Electronic Components
    Text: Uncontrolled copy unless stamped in red. LTCC DIVISION OF KYOCERA AMERICA DESIGN GUIDE ♦HIGH RELIABILITY ♦HIGH INTERCONNECT DENSITY ♦HIGH I/O COUNT ♦EXCELLENT POWER HANDLING ♦LOW-FIRE MATERIAL ♦CUSTOM TRANSMISSION LINES ♦CUSTOM MULTICHIP MODULES


    Original     		PDF 005in. 004in/in. kyocera design guide dupont 951 Ferro ltcc dupont 943 dupont 951 green tape kyocera design guide ltcc kyocera ceramic package Kyocera Electronic Components

    MAX6654MEE

    Abstract: fenwal 110 samsung crt monitor circuit diagram 2N3904 2N3906 CMPT3904 KST3904-TF MAX6654 SMBT3904 SST3904
    Text: 19-1836; Rev 0; 10/00 1°C Accurate Remote/Local Temperature Sensor with SMBus Serial Interface _Applications Desktop Computers Notebook Computers Servers Thin Clients Workstations Test and Measurement Multichip Modules SMBus is a trademark of Intel Corp.


    Original     		PDF 11-Bit, MAX6654MEE MAX6654 MAX6654MEE fenwal 110 samsung crt monitor circuit diagram 2N3904 2N3906 CMPT3904 KST3904-TF MAX6654 SMBT3904 SST3904

    Untitled

    Abstract: No abstract text available
    Text: 19-1836; Rev 1; 9/01 1°C Accurate Remote/Local Temperature Sensor with SMBus Serial Interface _Applications Desktop Computers Notebook Computers Servers Thin Clients Workstations Test and Measurement Multichip Modules SMBus is a trademark of Intel Corp.


    Original     		PDF MAX6654 2N3904 2N3906 MAX6654

    BCR141S

    Abstract: BCR141 BCR141F BCR141L3 BCR141T bcr1 marking code wd
    Text: BCR141. NPN Silicon Digital Transistor • Switching circuit, inverter, interface circuit, driver circuit • Built in bias resistor R1=22kΩ, R2 =22kΩ • BCR141S / U: Two internally isolated transistors with good matching in one multichip package


    Original     		PDF BCR141. BCR141S BCR141/F/L3 BCR141T/W BCR141S/U EHA07184 EHA07174 BCR141 BCR141F BCR141 BCR141F BCR141L3 BCR141T bcr1 marking code wd

    Multi-Chip Modules motorola

    Abstract: No abstract text available
    Text: MOTOROLA SC •CNEI'IORY/ASI L^E D b3t.7ESl □Df iTbtn 053 M N0T3 MOTOROLA SEMICONDUCTOR Order by MCMLiD • TECHNICAL DATA Advance Information APPLICATION SPECIFIC MULTICHIP MODULES MCML SERIES MULTICHIP MODULES CMOS/BICMOS SEMICONDUCTORS This specification defines the product characteristics for the MCML Series of


    OCR Scan     		PDF sma098 110T3 Multi-Chip Modules motorola

    l202

    Abstract: L575
    Text: Discrete LED Sizes and Packages O. « SOT23 SINGLE CHIP SML10 T1-3/4 SINGLE CHIP NARROW BEAM L200 T 1-3/4 6 MULTICHIP L206 SERIES T3/4 SINGLE CHIP L080 T1 -3/4 SINGLE CHIP WIDE BEAM L200 12 MULTICHIP L375 SERIES T1 SINGLE CHIP L120 T 1-3/4 SINGLE CHIP FLAT TOP


    OCR Scan     		PDF SML10 l202 L575

    Untitled

    Abstract: No abstract text available
    Text: PCB LED Sizes & Packages TRI-LEVEL N/A N/A N/A BI-LEVEL m N/A 1 SINGLES m H % li 1 AXIAL SINGLE CHIP SINGLE CHIP SINGLE CHIP DUAL CHIP 6 MULTICHIP


    OCR Scan     		PDF