Crystal oscillator 12 MHz
Abstract: SARONIX nch 1N4148 Saronix NTH Crystal oscillator DIL14
Text: SARONIX B.V. DATA SHEET 9922 515 727. series Crystal Clock Oscillator Type NCC in DIL-14 CMOS Product specification File under SARONIX B.V., SBV2 1998 May 12 SaRonix B.V. Doetinchem, The Netherlands Product specification Crystal Clock Oscillator Type NCC in DIL-14 (CMOS)
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DIL-14
DIL-14
Crystal oscillator 12 MHz
SARONIX nch
1N4148
Saronix NTH
Crystal oscillator DIL14
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SARONIX nch
Abstract: 1N4148 ic 8pin ttl Saronix NTH
Text: SARONIX B.V. DATA SHEET 9922 516 727. series Crystal Clock Oscillator Type NCC in DIL-8 CMOS Product specification File under SARONIX B.V., SBV2 1998 July 14 SaRonix B.V. Doetinchem, The Netherlands Product specification Crystal Clock Oscillator Type NCC in DIL-8 (CMOS)
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BV 726 C
Abstract: BV 726 BV 726 B SARONIX NTC marking ntc 80 SARONIX NTC series ntc 5.0 1004 Crystal oscillator 12 MHz crystal oscillator 32.768 f25 marking code
Text: SARONIX B.V. DATA SHEET 9922 515 726. series Crystal Clock Oscillator Type NTC/NCC 020 in DIL-14 CMOS Product specification File under SARONIX B.V., SBV2 1998 May 12 SaRonix B.V. Doetinchem, The Netherlands Product specification Crystal Clock Oscillator
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DIL-14
DIL-14
BV 726 C
BV 726
BV 726 B
SARONIX NTC
marking ntc 80
SARONIX NTC series
ntc 5.0 1004
Crystal oscillator 12 MHz
crystal oscillator 32.768
f25 marking code
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Untitled
Abstract: No abstract text available
Text: MCH Series Ⅲ Tantalum Chip Ⅲ Surface Mount Ⅲ Automotive Use Ⅲ 125؇C Maximum Temperature Actual Size The MCH series capacitors are the standard tantalum chip capacitors from UCC/NCC that are designed for automotive use. These surface mount capacitors are designed for high reliability and
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35VDC.
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JIS-C-5143
Abstract: mch 210
Text: MCH Series Ⅲ Tantalum Chip Ⅲ Surface Mount Ⅲ Automotive Use Ⅲ 125؇C Maximum Temperature Actual Size The MCH series capacitors are the standard tantalum chip capacitors from UCC/NCC that are designed for automotive use. These surface mount capacitors are designed for high reliability and
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35VDC.
JIS-C-5143
mch 210
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mc 1303 L
Abstract: JIS-C-5143 10MC156MCTER 25MC155MB2TER 20MC684MATER
Text: MC Series Ⅲ Tantalum Chip Ⅲ Surface Mount Ⅲ General Purpose Ⅲ 125؇C Maximum Temperature Actual Size The MC series are the standard general purpose tantalum chip capacitors from UCC/NCC. These capacitors are available in both a ؓ20% or ؓ10% tolerance. Typical applications for the MC series
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50VDC.
mc 1303 L
JIS-C-5143
10MC156MCTER
25MC155MB2TER
20MC684MATER
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mc 1303 L
Abstract: 25MC106MD2TER 16MC106MCTER JIS-C-5143 35MC105MB2TER 16MC225M 35MC685MD2TER 6MC475MBTER 10MC336MDTER 10MC336MD2TER
Text: MC Series Ⅲ Tantalum Chip Ⅲ Surface Mount Ⅲ General Purpose Ⅲ 125؇C Maximum Temperature Actual Size The MC series are the standard general purpose tantalum chip capacitors from UCC/NCC. These capacitors are available in both a ؓ20% or ؓ10% tolerance. Typical applications for the MC series
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50VDC
mc 1303 L
25MC106MD2TER
16MC106MCTER
JIS-C-5143
35MC105MB2TER
16MC225M
35MC685MD2TER
6MC475MBTER
10MC336MDTER
10MC336MD2TER
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JIS-C-5143
Abstract: JISC-5102 MCF 600 United CHEMI-CON
Text: MCF Series Ⅲ Tantalum Chip Ⅲ Surface Mount Ⅲ General Purpose Ⅲ Built-in Fuse Ⅲ 125؇C Maximum Temperature Actual Size The MCF series capacitors are the general purpose tantalum chip capacitors from UCC/NCC with a built-in fuse. The built-in fuse will help protect against a large current that could damage the
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35VDC.
JIS-C-5143
JISC-5102
MCF 600
United CHEMI-CON
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JIS-C-5143
Abstract: 16MCF226MD2TER tantalum capacitors surge current MCF 600
Text: MCF Series Ⅲ Tantalum Chip Ⅲ Surface Mount Ⅲ General Purpose Ⅲ Built-in Fuse Ⅲ 125؇C Maximum Temperature Actual Size The MCF series capacitors are the general purpose tantalum chip capacitors from UCC/NCC with a built-in fuse. The built-in fuse will help protect against a large current that could damage the
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35VDC.
JIS-C-5143
16MCF226MD2TER
tantalum capacitors surge current
MCF 600
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FDC3400
Abstract: fdc-34
Text: FDC3400 STANDARD MICROSYSTEMS CORPORATION, /¿PC FAMILY Floppy Disk Hard Sector Data Handler HSDH FEATURES PIN CONFIGURATION RD C RCK C RDRR C RDE [ RDR C rdlC RD7[ R06C R05 C R04[ RD3C RD2C RD1 C R D I[ NCC NCC nc[ NC[ NC[ Vcc[ 3 6 8 10 11 12 13 14 15 16
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FDC3400
FDC3400
fdc-34
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Untitled
Abstract: No abstract text available
Text: WHITE /MICROELECTRONICS 256Kx4 SRAM WPS256K4V-XRJX ad va n ce d * PLASTIC PLUS FEATURES • Access Times 15,17, 20ns PIN CONFIGURATION TO P VIEW NCC A3Ü A2C A1C AOC e sc 1/01 c vccC vss □ I/ 0 2 C WËE A17C A16C A15C A14C NCC 1 2 3 4 5 6 7 8 g 10 11
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256Kx4
WPS256K4V-XRJX
256Kx
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Untitled
Abstract: No abstract text available
Text: 1/1/HITE /MICROELECTRONICS 1Mx1 SRAM MONOLITHIC WMS1M1-XDEX ADVANCED* FEATURES PIN CONFIGURATION TO P VIEW NCC 4 A13C 5 A14C 6 A15C 7 NCC 8 A16C 9 A 1 7 C 10 A 1 8 C 11 A 1 9 C 12 N C C 13 Q C 14 W E C 15 G N D C 16 A cce ss Times 20, 25, 35ns • M IL-STD -883 Compliant Devices Available
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S1M a4
Abstract: No abstract text available
Text: a W M S1M 1-XD EX I/I/HITE M I C R O E L E C T R O N I C S IM x l SRAM MONOLITHIC ADVANCED* FEATURES • PIN CONFIGURATION TOP VIEW 32 3 VCC A11 C 2 31 D N C A I2 C 3 NCC 4 29 H as 28 D A7 A15C 7 26 D A 5 27 H A6 NCC 8 25 □ A4 A16C 9 A 1 7 C 10 24 H A 3
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Untitled
Abstract: No abstract text available
Text: DS1010 DALLAS SEMICONDUCTOR DS1010 10-Tap Silicon Delay Line FEATURES PIN ASSIGNMENT • All-silicon time delay • 10 taps equally spaced C 1 NcC 2 in • Delays are stable and precise • Leading and trailing edge accuracy ncE 3 TAP 2 [I 4 • Delay tolerance ±5% or ±2 ns, whichever is greater
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DS1010
10-Tap
14-pin
16-pin
DS1010G
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TMS6264L-15
Abstract: tms6264l 0C25 TMS6264L-10
Text: TMS6264L 65,536-BIT LOW POWER STATIC RANDOM-ACCESS MEMORY SEPTEMBER 1988— REVISED DECEMBER 1989 N, NW, AND OH PA CK A G ES TOP VIEW Organization . . . 8K x 8 c ro 00 Single 5-V Power Supply (10% Tolerance) NCC A12C 2 A7C 3 A6C 4 A5Ü 5 All Inputs/Outputs Fully T TL Compatible
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TMS6264L
536-BIT
TMS6264L-10.
TMS6264L-12.
TMS6264L-15.
28-pin
oj039)
TMS6264L-15
0C25
TMS6264L-10
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sharp mask rom 44-pin
Abstract: mask programmable rom sharp mask rom 532595
Text: CMOS 256K 32K x 8 Mask Programmable ROM FEATURES • • • • • • PIN CONNECTIONS 32,768 x 8 bit organization Access time: 28-PIN DIP 28-PIN SOP TOP VIEW - \ 28 □ Vcc f 150 ns (MAX.) NCC 1• A12C 2 27 □ a 7C 3 26 □ Ai3 Operating: 110 mW (MAX.)
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28-PIN
28-pin,
600-mil
450-mil
44-pin,
44-PIN
LH53259
I-------15
sharp mask rom 44-pin
mask programmable rom
sharp mask rom
532595
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Untitled
Abstract: No abstract text available
Text: WHITE MICROELECTRONICS 256Kx4 SRAM WPS256K4-XRJX PRELIMINARY# PLASTIC PLUS FEATURES • Access Times 15,17, 20nS PIN CONFIGURATION TOP VIEW NCC 1 A3 [ I 2 A2 C 3 A ir 4 AOC 5 S5C 6 i/oí C 7 vccC 8 v ss C 9 1/02 d 10 W E □ 11 A17 m 12 A 1 6 d 13 A 1 5 C 14
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256Kx4
WPS256K4-XRJX
256Kx
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LH5164
Abstract: LH 192 lh5164 - 12
Text: CMOS 64K 8K x 8 Static RAM FEATURES PIN CONNECTIONS • 8,192 x 8 bit organization 28-PIN SOP TOP VIEW • Access time: 500 ns (MAX.) NCC 1• •N 28 A12C 2 27 □ a 7[= 3 26 □ c e 2 Agd 4 25 □ Ag ASC a4C 5 24 □ Ag 6 23 □ A i , a 3d 7 22 □ 5 Ë
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28-pin,
450-mil
LH5164ASH
28-pin
28TSOP
LH5164
LH 192
lh5164 - 12
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se micro-electronics da
Abstract: No abstract text available
Text: WME128K8-XDEX WHITE /M IC R O E L E C T R O N IC S 128 Kx 8 CMOS MONOLITHIC EEPROM PRELIMINARY* FEATURES FIG. 1 • Read A ccess Times of 150, 200, 250 and 300nS PIN CO N F IG U R A T IO N TOP VIEW 1 32 □ V cc A16C 2 31 □ w l NCC A15 C 3 30 □ n c A 12 C 4
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WME128K8-XDEX
300nS
IL-STD-883
Typical/80m
Lat08)
se micro-electronics da
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Untitled
Abstract: No abstract text available
Text: TT WS256K8-XCX M/HITE /M ICRO ELECTRO N ICS 256Kx8 SRAM MODULE FEATURES FIG. 1 • A c c e ss T im e s 25 to 45n S PIN CONFIGURATION TOP VIEW NCC A16C A14C A I2 C A7T A6C A5L A4 C A3C A2¿ A1C AO □ i/oor 1/01 c 1/0 2 C Vss Q 1 2 3 4 5 6 7 8 9 10 11 12 13
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WS256K8-XCX
256Kx8
MIL-STD-883
06HXX
07HXX
256Kx
08HXX
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Untitled
Abstract: No abstract text available
Text: XTWhite Technology, Inc. MEMORY PRODUCTS NCC 1 C\J co A16C 2 31 A14C 3 A12Ü 4 A7 E 5 30 □ NC 29 28 □ □ WE A13 A6 C 6 A 5Ü 7 A4E 8 27 □ A8 A3 n 9 A2 C 10 A 1 |I 11 24 □ ÔË 23 □ A10 22 □ c s AO L 12 21 □ I/07 i/o o L 13 1/01 r 14 20 □ I/06
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WS-128K8
02821O
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Untitled
Abstract: No abstract text available
Text: W W hite Technology, Inc. NCC 1 W MEMORY PRODUCTS WS-256K8 CX 32 □ v cc A16C 2 31 □ A15 A14Ü 3 30 H A17 A12Ü 4 29 3 WE A7 C 5 28 □ A13 A6 C 6 27 □ A8 A5 E 7 26 □ A9 A4 C 8 25 □ A11 A3 Ü 9 24 □ OE A2 □ 10 23 □ A10 A1 C 11 22 □ c s A O C 12
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WS-256K8
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Untitled
Abstract: No abstract text available
Text: M/HITE /M IC R O E L E C T R O N IC S 128Kx8 SR A M MODULE WMS128K8U-XCX PRELIMINARY* FEATURES PIN C O N F IG U R A T IO N TOP VIEW NCC 1 A16 C 2 W 32 U Vcc 30 D A12C 4 29 □ w e A7 C 5 28 3 A13 A6C 6 A SC 7 26 3 A9 A 2 C 10 A l C 11 A O C 12 A c c e s s Tim e s 17 and 2 0 n S
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WMS128K8U-XCX
128Kx8
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Z3M Y
Abstract: 69536TQ "Z3M" Z3M 114
Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MCM69Q536 Advance Information 32K x 36 Bit Synchronous Separate I/O SRAM The Motorola M C M 6 9 Q 5 3 6 is a 1 Megabit static random acce ss memory, organized a s 3 2 K w ords of 36 bits. It features separate data input and data output buffers and
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MCM69Q536
MCM69Q536
69Q536
69536TQ
536TQ
69Q536TQ
Z3M Y
"Z3M"
Z3M 114
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