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Memory Protection Devices Inc (MPD) BC1-3N-C-SM BATTERY HOLDER 1/3N SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	BC1-3N-C-SM	Tray	8,828		1	1 $2.56 10 $2.121 100 $2.56 1000 $1.5236 10000 $1.28159	Buy Now
HUBER+SUHNER 33_TNC-SMA-50-1-1--_UE 33_TNC-SMA-50-1/1--_UE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	33_TNC-SMA-50-1-1--_UE	Bulk	8		1	1 $95.13 10 $77.554 100 $68.925 1000 $68.925 10000 $68.925	Buy Now
HUBER+SUHNER 31_BNC-SMB-50-2-1--_UE 31_BNC-SMB-50-2/1--_UE
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DigiKey	31_BNC-SMB-50-2-1--_UE	Bulk	5		1	1 $69.8 10 $54.26 100 $69.8 1000 $69.8 10000 $69.8	Buy Now
HUBER+SUHNER 33_BNC-SMA-50-1-1--_UE 33_BNC-SMA-50-1/1--_UE
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DigiKey	33_BNC-SMA-50-1-1--_UE	Bulk	2		1	1 $94.01 10 $73.122 100 $58.0258 1000 $58.0258 10000 $58.0258	Buy Now
HUBER+SUHNER 34_BNC-SMA-50-2-1--_UE 34_BNC-SMA-50-2/1--_UE
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	34_BNC-SMA-50-2-1--_UE	Bulk	1		1	1 $113.66 10 $92.665 100 $83.7376 1000 $83.7376 10000 $83.7376	Buy Now

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NCSM Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
TI BINARY DATE CODE Abstract: BQ20Z80-V101 BQ2940 Text: bq20z80-V101 www.ti.com SLUS625C – SEPTEMBER 2004 – REVISED JULY 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312 FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology	Original	bq20z80-V101 SLUS625C bq29312 TI BINARY DATE CODE BQ2940	PDF
LGA rework Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules	Original	AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework	PDF
LGA voiding Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style	Original	AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale	PDF
PL10SMS-12C Abstract: 1402ma Text: PL10SMS-12C NON-ISOLATED DC-DC Converter 8.3-14Vin, 0.75- 5.0Vout, 10A INSTALLATION / APPLICATION NOTE PL10SMS-12C Page 1 PL10SMS-12C Content 1. INTRODUCTION 3 2. MODELS 3 3. CONVERTER FEATURES 3 4. GENERAL DESCRIPTION 4.1 Electrical Description 3 3 4.2 Thermal Packaging and Physical Design	Original	PL10SMS-12C 3-14Vin, 010in) PL10SMS-12C 1402ma	PDF
PL20S-W12C Abstract: w12c 14BTYP Fuse 250V T 2,5A PL20SMS-W12C Text: PL20S-W12C, PL20SMS-W12C NON-ISOLATED DC-DC Converter 6.0-14Vin, 0.75- 5.0Vout, 20A INSTALLATION / APPLICATION NOTE PL20S-W12C PL20SMS-W12C PL20S-W12C, PL20SMS-W12C Content 1. INTRODUCTION 3 2. CONVERTER FEATURES 3 3. GENERAL DESCRIPTION 3.1 Electrical Description	Original	PL20S-W12C, PL20SMS-W12C 0-14Vin, PL20S-W12C PL20S-W12C w12c 14BTYP Fuse 250V T 2,5A PL20SMS-W12C	PDF
9416A Abstract: No abstract text available Text: PL16S-12C, PL16SMS-12C NON-ISOLATED DC-DC Converter 9.0-14Vin, 0.75- 5.0Vout, 16A INSTALLATION / APPLICATION NOTE PL16S-12C PL16SMS-12C Page 1 PL16S-12C, PL16SMS-12C Contents 1. INTRODUCTION 3 2. MODELS 3 3. CONVERTER FEATURES 3 4. GENERAL DESCRIPTION 4.1 Electrical Description	Original	PL16S-12C, PL16SMS-12C 0-14Vin, PL16S-12C PL16S 010in) PL16SMS 9416A	PDF
AMD-756 Abstract: AMD-756AC AMD-756AC B Date Code c AMD 1998 AMD-751 Northbridge AMD756AC Text: Preliminary Information Version Created May 11, 2000 AMD-756 TM Peripheral Bus Controller Revision Guide Publication # 22591 Rev: C Issue Date: May 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced	Original	AMD-756 AMD-751TM AMD-756TM AMD-756 AMD-756AC AMD-756AC B Date Code c AMD 1998 AMD-751 Northbridge AMD756AC	PDF
VPOL16A-12-SIP Abstract: No abstract text available Text: VPOL16A-12-SIP Data Sheet Features * Industry standard pin out * High efficiency to 94% * 300 KHz switching frequency * 9.0-14 VDC wide input range * 0.75-5.0 VDC wide output range * Over temperature protection * Continuous short circuit protection * Remote on/off	Original	VPOL16A-12-SIP UL/C-UL60950 VPOL16A-12-SIP	PDF
soc fuse Abstract: SLUS681 Text: bq20z80-V102 www.ti.com SLUS681 – NOVEMBER 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312A FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology Accurately Measures Available Charge in	Original	bq20z80-V102 SLUS681 bq29312A soc fuse SLUS681	PDF
LGA voiding Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D Text: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal	Original	AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D	PDF
BQ20Z80-V101 Abstract: No abstract text available Text: bq20z80-V101 www.ti.com SLUS625D – SEPTEMBER 2004 – REVISED OCTOBER 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312A FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology	Original	bq20z80-V101 SLUS625D bq29312A	PDF
TDA 11136 Abstract: SLUA379 SLUU265A bq20z70-V150 SLUA359 SLUA372 0x2673 TDA 1343 code BQ voltage protection for n cell lion battery SBS 15 battery Text: bq20z70-V150 + bq29330, bq20z75 Technical Reference Manual Literature Number: SLUU265A October 2006 – Revised August 2007 2 SLUU265A – October 2006 – Revised August 2007 Submit Documentation Feedback Contents 1 2 Preface . 7	Original	bq20z70-V150 bq29330 bq20z75 SLUU265A TDA 11136 SLUA379 SLUU265A SLUA359 SLUA372 0x2673 TDA 1343 code BQ voltage protection for n cell lion battery SBS 15 battery	PDF
TDA 12110 Abstract: TDA 3116 BQ20Z65-R1 Text: bq20z60-R1/bq20z65-R1 Technical Reference Literature Number: SLUU386 January 2010 2 SLUU386 – January 2010 Submit Documentation Feedback Copyright 2010, Texas Instruments Incorporated Contents 1 Preface 1.1 1.2 2 . 7	Original	bq20z60-R1/bq20z65-R1 SLUU386 SLUU386 TDA 12110 TDA 3116 BQ20Z65-R1	PDF
BQ20Z80-V101 Abstract: No abstract text available Text: bq20z80-V101 www.ti.com SLUS625D – SEPTEMBER 2004 – REVISED OCTOBER 2005 SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK TECHNOLOGY FOR USE WITH THE bq29312A FEATURES • • • • • • • • • • • • • • • Patented Impedance Track™ Technology	Original	bq20z80-V101 SLUS625D bq29312A	PDF

AN3281 Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style	Original	AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate	PDF
HUmiseal 1B73 Abstract: CLD-AP25 Dow Corning 1-2577 HUmiseal Dow corning 3-1953 nc-smq92 SN62 PB36 ag2 pliobond 1B73 NC-SMQ92J Text: Cree XLamp® LED 焊接和处理 XLamp XP 系列 LED 本应用说明适用于 XLamp XP 系列 LED ： XLamp XP-CXP-E 和 XP-G LED，它们的订购代码格式如下： XPxxxx-xx-xxxx-xxxxxx 此应用说明解释了在制造过程中，应当如何处理 XLamp XP 系列 LED 和含有这些 LED 的组件。	Original	-AP25 CLD-AP25 HUmiseal 1B73 Dow Corning 1-2577 HUmiseal Dow corning 3-1953 nc-smq92 SN62 PB36 ag2 pliobond 1B73 NC-SMQ92J	PDF
NC-SMQ92J solder paste Abstract: NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram Text: Cree XLamp® LED Soldering & Handling XLamp MP-L EasyWhite LEDs This application note applies to XLamp MP-L EasyWhite LEDs which have order codes in the following format: MPLEZW-XX-XXXX-XXXXXXXXX This application note explains how XLamp MP-L EasyWhite LEDs and assemblies	Original	CLD-AP36 NC-SMQ92J solder paste NC-SMQ92J ADHESIVE GAP PAD Loctite 406 mcpcb reflow criteria SN62 MP SN62 PB36 ag2 hydrocarbon polymeric pliobond 20 Ultrasonic cleaner circuit diagram	PDF
HUmiseal 1B73 Abstract: HUmiseal NC-SMQ92J CLD-AP25 1b73 Solder Paste, Indium, Type 3 cree led Cree optics hydrocarbon polymeric arctic silver alumina Text: Cree XLamp® LED Soldering & Handling XLamp XP Family LEDs This application note applies to XLamp XP Family LEDs: XLamp XP-C, XP-E & XP-G LEDs, which have order codes in the following fomat: XPxxxx-xx-xxxx-xxxxxx This application note explains how XLamp XP Family LEDs and assemblies	Original	CLD-AP25 HUmiseal 1B73 HUmiseal NC-SMQ92J 1b73 Solder Paste, Indium, Type 3 cree led Cree optics hydrocarbon polymeric arctic silver alumina	PDF
pliobond 20 Abstract: Dow Corning 1-2577 1B73 Dow corning 3-1953 HUmiseal HUmiseal 1B73 Loctite 4105 NC-SMQ92J Loctite sumo radio shack led Text: Cree XLamp® LED 焊接和处理 XLamp 4550 与 XR 系列 LED 本应用说明适用于 XLamp 4550 与 XR 系列（XR-EXR-C 和 XR）LED，它们的订购代码格式分别如下： XL4550xx-xx-xxxx XR7090xx-xx-xxxx XRCxxx-xx-xxxx-xxxxxx XRExxx-xx-xxxx-xxxxxx	Original	XL4550xx-xx-xxxx XR7090xx-xx-xxxx CLD-AP16 pliobond 20 Dow Corning 1-2577 1B73 Dow corning 3-1953 HUmiseal HUmiseal 1B73 Loctite 4105 NC-SMQ92J Loctite sumo radio shack led	PDF
D2061 transistor Abstract: B1ABCF000176 C1BA00000407 r2003 TRANSISTOR c5536 C1BB00000732 C2068 B0BC7R500001 B1BACD000018 B1AACF000064 Text: ORDER NO. MD0604120A3 DVD Stereo System SA-VK650GCP Colour S . Silver Type Please use this manual together with the service manual for Model No. [SA-VK650GC/GN/GS/GCS/GCT-S, Order No. MD0604118C3]. Specifications n SYSTEM SC-VK650(GCP) Notes: Music Center: SA-VK650 (GCP)	Original	MD0604120A3 SA-VK650GCP SA-VK650GC/GN/GS/GCS/GCT-S, MD0604118C3] SC-VK650 SA-VK650 SB-VK650 SB-WVK650 0A072 F2G0J470A031 D2061 transistor B1ABCF000176 C1BA00000407 r2003 TRANSISTOR c5536 C1BB00000732 C2068 B0BC7R500001 B1BACD000018 B1AACF000064	PDF
Lead Free reflow soldering profile BGA Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181 Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array	Original	EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181	PDF
KVM SWITCH schematic Abstract: iC-XU-PDIP22 motortreiber ic-xu KVM SWITCH IC Text: FEATURES APPLICATIONS ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ 4 independently controllable channels with 8 power output stages Power output stages for 350m A continuous current and high impulse load Integrated free-wheeling diodes Microprocessor-compatible drive circuit for up to 4	OCR Scan	D-55294 KVM SWITCH schematic iC-XU-PDIP22 motortreiber ic-xu KVM SWITCH IC	PDF
Untitled Abstract: No abstract text available Text: C IT I LAN83C175 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION LAN83C175 - EPIC/C Ethernet CARDBUS Integrated Controller With Modem Support FEATURES IEEE 802.3 Com pliant 10/100 Mb/s Ethernet Controller Fully Com pliant Glueless Integrated CardBus Interface	OCR Scan	LAN83C175 LAN83C175 10Base-T 10Mbps	PDF
Untitled Abstract: No abstract text available Text: Technical D ata_ CD54/74AC373, CD54/74AC533 CD54/74ACT373, CD54/74ACT533 D O - 373 533 -0 0 00 0 1 - - Q1 01 02- -02 -03 02 53 -0 4 -0 5 -06 05 56 - 07 5> 0 3 -0 4 -0 5 -0 6 -0 7 -L E - 1	OCR Scan	CD54/74AC373, CD54/74AC533 CD54/74ACT373, CD54/74ACT533 CD54/74AC/ACT373 CD54/74AC/ACT533 92CS-4242I 54/74AC373 CD54/74ACT373	PDF

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NCSM Search Results

NCSM Price and Stock

Memory Protection Devices Inc (MPD) BC1-3N-C-SM

HUBER+SUHNER 33_TNC-SMA-50-1-1--_UE

HUBER+SUHNER 31_BNC-SMB-50-2-1--_UE

HUBER+SUHNER 33_BNC-SMA-50-1-1--_UE

HUBER+SUHNER 34_BNC-SMA-50-2-1--_UE

NCSM Datasheets Context Search

TI BINARY DATE CODE

LGA rework

LGA voiding

PL10SMS-12C

PL20S-W12C

9416A

AMD-756

VPOL16A-12-SIP

soc fuse

LGA voiding

BQ20Z80-V101

TDA 11136

TDA 12110

BQ20Z80-V101

AN3281

HUmiseal 1B73

NC-SMQ92J solder paste

HUmiseal 1B73

pliobond 20

D2061 transistor

Lead Free reflow soldering profile BGA

KVM SWITCH schematic

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