nitto SWT 10
Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Text: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device
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QSP0005
MAS1234AB3
MAS1234AB3xxxxx)
98AA2
MAS9198AA2xxxxx)
nitto SWT 10
nitto SWT-20
W07 sot 23
w04 transistor sot 23
UE-111AJ
W04 sot 23
transistor w07
transistor marking w08
marking W07
transistor marking w04
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Adwill D-175
Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
Text: AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 — 13 January 2009 Application note Document information Info Content Keywords Sawn wafers, UV dicing tape, handling and processing Abstract This application note gives hints and recommendations regarding correct
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AN106920
AN106920lusion
Adwill D-175
UE-111AJ
lintec adwill UV tape D-175
UV tape D-175
adwill
Lintec UV tape
Lintec
nitto UE111AJ
nitto UV tape
D175 lintec
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UE-111AJ
Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Text: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device
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QSP0005
MAS1025AC
MAS1025ACSAxx)
MAS9124AACAxx)
UE-111AJ
nitto SWT-20
transistor marking PB
nitto UE111AJ
ke marking transistor
2091J
Nitto
marking code transistor HK
mas1025
UE111
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Nitto 5015
Abstract: nitto denko adhesive DAC2450CT1 nitto denko 5015 N5015 nitto tape
Text: ANTENNA ELEMENT FOR 2.4 GHz DESCRIPTION The DAC Series is a miniature dielectric antenna element for 2.4 GHz wireless LAN systems. This antenna has vertical polarization characteristics. TOKO's proprietary ceramic dielectric material provides excellent stability
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DAC2450CT1
CF-162-DACDS297
0397O2
Nitto 5015
nitto denko adhesive
DAC2450CT1
nitto denko 5015
N5015
nitto tape
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SMD LED 5680
Abstract: LC-1500 MAX PLUS II free X362 3M reflective tape nitto tape, 500
Text: American Opto Plus LED BL-S3547LW-F 34.7mm x 46.70mm V.A.: 30.74mm x x36.24mm FPC Type White Side-Look LCD Backlight PACKAGE DIMENSIONS Notes: 1. All dimensions are in millimeters monitoring Rev. 1.0 July 2006 2. Not Specified tolerance is ± 0.2mm 3.
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BL-S3547LW-F
LC-1500
SMD LED 5680
LC-1500
MAX PLUS II free
X362
3M reflective tape
nitto tape, 500
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cirocomm gps receiver
Abstract: cirocomm Cirocomm GPS
Text: AP.12B.07.0046A Specification Part No. AP.12B.07.0046A Product Name 12mm Two Stage Active GPS Patch Antenna Feature Ultra Miniature GPS active patch High performance Ultra low power consumption RoHS compliant SPE-11-8-126/B | page 1 of 13 1. Introduction This miniaturised GPS Active Antenna
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SPE-11-8-126/B
cirocomm gps receiver
cirocomm
Cirocomm GPS
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CCL-HL832NX-A
Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize
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CO-029)
CCL-HL832NX-A
Nitto GE100LFCS
Sumitomo G750
GE100LFCS
GE-100-LFC
CCL-HL832NX
GE100LFCS nitto
GE-100LFCS
CCL-HL-832
CCL-HL832
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TSS463
Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Text: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2
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TSS463
TSS461C
TSS461C
TSS463/TSS461C
TS80C31X2/C32X2
Nitto MP8000
MARKING Z86
1000 BASE Isolation Modules 5000V
EOS ESD S 61.1
hmt design data book
MOLDING MATERIAL MP8000
HT Q100
temic gateway
EIA-556-A
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POWER TRANSFORMER E154515
Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Text: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD
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texas instruments packing label
Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make
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7150M
CDC582
CDC586
CDC2582
CDC2586
SN250056
SN74ACT2235-XX
SN74ACT7807-XX
SN74ACT7808-XX
SN10067
texas instruments packing label
SPAD
Eftec 64t
PZT144
CDC582
TEXAS INSTRUMENTS, Mold Compound
EN-4085S2K3
eftec 45
EN-4085S2
eftec+64
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Denko
Abstract: NITTO DENKO H9004 1.5DS 5Cs transistor separator nitto denko GT13S-1S-HU H9004 1.5CS
Text: MITSUMI Film Antenna for Digital Terrestrial Broadcasting Receiver DCA-C01 Telecommunication component OUTLINE This film antenna receives the terrestrial digital broadcast signal. Antenna unit can be mounted on the glass window of the car with ease, and has a built-in
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DCA-C01
14dBi
Recepti50
H9004
GT13S-1S-HU
Denko
NITTO DENKO H9004
1.5DS
5Cs transistor
separator nitto denko
GT13S-1S-HU
H9004
1.5CS
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SMP1302-099
Abstract: No abstract text available
Text: DATA SHEET PIN Diode Chips Supplied on Film Frame Features Designed for high-performance switch and attenuator applications ● Preferred device for module applications ● PIN diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
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SMP1302-099
SMP1304-099
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Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
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SMS392x-099
SMS3926
SMS3927
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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Amkor Wafer level mold compound
Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm
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l2aa
Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement
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CO-029)
l2aa
tepbga-2
CO-029
Amkor mold compound
Amkor Wafer level mold compound
GE-100L
Amkor Technology pbga moisture
GE-100-L
UM2219
mold compound
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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pin diode SMP
Abstract: SMP1302-099
Text: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high
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SMP1302-099
12/02A
pin diode SMP
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MP 130B
Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
Text: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging
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LPV321/358/324
150kHz
LPV321
LPV358
LPV324
SC70-5,
OT23-5
LPV300
150kHz
LPV321/LPV358/LPV324
MP 130B
sumitomo epoxy
LPV324M
MP 130B 02
cf 5097
nitto UV tape
A193K
NSC marking code PB
eme-7351ls
eme marking sot23
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MO-150
Abstract: C194 MP8000AN G600 MO-137 amkor
Text: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller
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MO-150
MO-118
MO-150
C194
MP8000AN
G600
MO-137
amkor
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FTA160709
Abstract: RF160709 perkin Nitto 5701 perkin 160709 RF16070 Nitto nitto tape
Text: DATA SHEET MECHANICAL DATA L C .(G) Tvpe/Lenath of item used 1 Type of Reflector (A) RF160709 2 Type of Tape (B) Aluminium Tape N0833S 3 Type of Shield (C) RS160709 4 Trigger w ire [D = (d 1 /d 2 ,d 3 )] White AW G26(35/11,2)mm 5 Type of Flashtube (E) BGDC 0 007/5701
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RF160709
N0833S
RS160709
AWG26
7782370ely.
FTA160709
RF160709
perkin
Nitto 5701
perkin 160709
RF16070
Nitto
nitto tape
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nitto UV tape
Abstract: C175 c3136 E250D RA226
Text: PART NUMBER REV. L C M - H 12 8 6 4 C G W F / C P1 UNC O N TRO LLED D O C U M EN T REV. FRONT VIEW NUMBER AND REVISION COMMENTS DATE A E.C.N. # 1 0 8 6 6 . B E.C.N. # 1 0 9 7 5 . 5 ,2 0 .0 2 4.B .03 C E.C.N. # 1 1 0 2 0 . 7 ,3 0 .0 3 □ E.C.N, # 1 1 0 4 9 ,
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2864CGWF/C
50LDERINC
nitto UV tape
C175
c3136
E250D
RA226
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Carrollton Semiconductor
Abstract: No abstract text available
Text: 0 .O P IE K Emitter and Photosensor Chips Optek Technology, Inc. is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emitter chips and silicon photosensor chips. In hybrid or other applications, where space forbids use
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Untitled
Abstract: No abstract text available
Text: OPTEK Emitter and Photosensor Chips Optek Technology, Inc. Is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emit ter chips ana silicon photosensor chips. In hybrid or other applications, where space forbids
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