P50E-080S-TG
Abstract: P25E-050S-TG P50E-080P1 DIN-64-CPB-SR1-TR P50E-080P1-S1-TG DIN-64CPB-SR1-TR P25E-080S-TG 9063256 P50E-100S-TG DIN-96CPC-SR1-TR
Text: Robinson Nugent PC Boardmount Connectors and Sockets CPCI PAK-2¨ Connectors Compact PCI Connectors RN PAK-50¨ P25E and P50E Series 50 MIL IDC Sockets Two piece 2 mm ´ 2 mm pin and receptacle connector system. Meets IEC61076-4-101 Level 11 requirements and
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PAK-50
IEC61076-4-101
IE917.
IDH-10LP-S3-TR
IDH-14LP-S3-TR
IDH-16LP-S3-TR
IDH-20LP-S3-TR
IDH-26LP-S3-TR
IDH-34LP-S3-TR
IDH-40LP-S3-TR
P50E-080S-TG
P25E-050S-TG
P50E-080P1
DIN-64-CPB-SR1-TR
P50E-080P1-S1-TG
DIN-64CPB-SR1-TR
P25E-080S-TG
9063256
P50E-100S-TG
DIN-96CPC-SR1-TR
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Untitled
Abstract: No abstract text available
Text: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit
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Robinson Nugent ice
Abstract: Robinson Nugent s2
Text: Board-to-Board Robinson Nugent CPP Series * Variety of pin lengths to meet specific board stacking applications * Mates with both ICE and ICT Series dip sockets * CPP Series consists of .118" profile body How to Order CPP Series CPP Series CPP — XX X Number of Contacts:
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CPP-063-X-X
CPP-083-X-X
CPP-143-X-X
CPP-163-X-X
CPP-183-X-X
CPP-203-X-X
CPP-243-X-X
CPP-246-X-X
CPP-286-X-X
CPP-326-X-X
Robinson Nugent ice
Robinson Nugent s2
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Untitled
Abstract: No abstract text available
Text: FINE PITCH CONNECTORS Introduction to PAK-5 and PAK-8SMT Connectors PAK-5 and PAK-8™ represent the newest high density, SMT fine pitch board to board interconnect system from Robinson Nugent, Inc. As electronic systems continue to downsize and the need for higher pin
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robinson nugent
Abstract: straddle PCMCIA Robinson Nugent socket Robinson Nugent 2.0 Robinson Nugent 2.0 mm Robinson Nugent socket connector
Text: PCMCIA_ SELECTION GUIDE MEMPAK” Receptacles Part Number MCS 068 SM A 1 TP TR30 .Contact Plating TR30-30 microinch ROBEX Memory Card Socket. Number of Contacts. 68 Position Body Style_ SM-Straddle Mount SS-Single sided, Single row SD-Single sided, Dual row
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TR30-30
MCS-068SMA1-TR30
MCS-068SSJ1-TR30
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robinson nugent
straddle PCMCIA
Robinson Nugent socket
Robinson Nugent 2.0
Robinson Nugent 2.0 mm
Robinson Nugent socket connector
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Untitled
Abstract: No abstract text available
Text: DIMMPAK — Introduction to DIMS Robinson Nugent has developed a full range of Dual Inline Memory Sockets DIMSs to support increas ing demands for high density Dual Inline Memory Module (DIMM) technology. Our DIMS product series effectively provides a high density packaging system for designers of high speed, memory intensive
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Untitled
Abstract: No abstract text available
Text: FINE PITCH SOCKETS SOP Sockets REMARKS 1 2) Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow
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Robinson Nugent socket
Abstract: No abstract text available
Text: &QF7. HIGH DENSITY Introduction to DIMS Robinson Nugent has developed a full range of Dual Inline Memory Sockets DIMSs to support increas ing demands for high density Dual Inline Memory Module (DIMM) technology. Our DIMS product series effectively provides a high density packaging system for designers of high speed, memory intensive
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Untitled
Abstract: No abstract text available
Text: DIN CONNECTORS_ Inverse R-Form DIN Solder-to-Board Socket Connectors DIN-RS Series — - 9 PC board mount socket applications include telecom, computer, data process ing, test and measurement and industrial equipment * Standard pin counts: 48, 64, 96,120,
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076\im)
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S3L 54
Abstract: No abstract text available
Text: DIN CONNECTORS_ Standard C-Form DIN Solder-to-Board Socket Connectors DIN-CS Series • Solder terminals for PCB or flexible cable mount • Standard pin counts: 48, 64, 96,120 and 150 • New! .090" terminals for “no clean” solder flux applications
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076\im)
S3L 54
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BT224
Abstract: Robinson Nugent idc Robinson Nugent IDS robinson nugent Robinson Nugent din socket 16 pin
Text: IDC CONNECTORS Sockets .100 X.100 2.54 x 2.54 Grid IDS-NPK/IDS-PK Series • IDS-NPK sockets offer total compatibility to MIL-C-83503 and BT-224 • IDS-PK sockets incorporate center polarization to meet DIN-41651 • For quick disconnect with all .025"
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MIL-C-83503
BT-224
DIN-41651
BT224
Robinson Nugent idc
Robinson Nugent IDS
robinson nugent
Robinson Nugent din socket 16 pin
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Untitled
Abstract: No abstract text available
Text: Sockets HIGH DENSITY_ ^ Pin Grid Array Sockets with Heat Sink Tabs PGHS Series • High temp molded insulator body compatible with IR and vapor phase soldering • Precision screw machine sockets for high reliability • “Ultra Low Force” 6-finger contact
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762pm)
27\im)
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Robinson Nugent
Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Text: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact
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PGHS-179CH3-US-TG
50ninch
PGHS-T79CH3-US-TG
Robinson Nugent
Robinson Nugent SCREW MACHINE SOCKET
Motorola 68040
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Untitled
Abstract: No abstract text available
Text: DIN CONNECTORS_ Standard C-Form DIN Press-fit Backpanel Socket Connectors DIN-CS Series * FLEXPRESS contacts permit solderless mounting * 96 position socket for VME, Multi-Bus II, and VXI Backpanels * Expanded sizes 120 and 150 position
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076\im)
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MO-52
Abstract: No abstract text available
Text: R obinson — N u gen t- Sockets Sockets ELASTIC LEADED CHIP CARRIER SOCKETS PLCC-SMT Series Low profile; .200" maximum height Designed for automatic assembly Socket footprint same as device Open frame allows visual inspection of solder joints
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MO-52
27\im)
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)
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10x10
12x12
15x15
18x18
19x19
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails
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12x12
13x13
14x14
15x15
16x16
17x17
18x18
10x10
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit
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15x15
16x16
18x18
19x19
10x10
SP138
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Untitled
Abstract: No abstract text available
Text: PRODUCTION DIP _ Thin Body Screw Machine Sockets ICT Series * Very low profile options available * Four finger Beryllium Copper contact ac cepts short 1C leads * Pin socket design prevents solder wicking and flux entrapment * Side/end stackable SOCKETS
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SP132
27\im)
E73746
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact
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fUS-XX-TG30
PGA-INT-325AH-XX-TG30
NT-391
AX-XX-TG30
PGA-INT-S03AS-XX-TG30
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Untitled
Abstract: No abstract text available
Text: Dual Read Out DIMM Sockets DIMS Series • Effectively provides double density pack aging in single density footprint * Durability - 60 cycles minimum * Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” • Superior shock and vibration performance
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Untitled
Abstract: No abstract text available
Text: RN ICPAK —Nuaent SOP Sockets REMARKS 1 Use a screen thickness of 0.2mm or 0.3mm during cream solder printing. 2) When infrared reflow soldering the peak surface temperature of the PC board should not exceed 245°C. Recommended conditions for the reflow
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Robinson Nugent socket
Abstract: Robinson Nugent socket 16 pin
Text: D Kl u A ri n IM r « i \ £ 2mm Sockets P2 Series High temp, surface mount compatible Right angle socket offers variable standoff heights and locator posts to address 2.5" disc drive requirements Top and bottom inverse entry option gives greater flexibility for PCB stacking
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Robinson Nugent latching socket
Abstract: Robinson Nugent cable to board
Text: Robinson Nugent 50 mil Connectors — ^P25E Series Socket 9 Accepts 30 AWG, 25 mil flat cable 9 Designed to mate with P50 Series IDC board mount connectors 9 Latching eject mechanism facilitates mating and unmating 9 3-dimensional mating 9 Daisy chain capability
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PAK-50
Robinson Nugent latching socket
Robinson Nugent cable to board
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