51-85062-C
Abstract: package
Text: Package Diagram Shrunk Small Outline Packages 20-Lead 5.3 mm Shrunk Small Outline Package O20 51-85077-*C 1 Package Diagram 24-Lead (5.3 mm) Shrunk Small Outline Package O24 51-85078-* 2 Package Diagram 28-Lead (5.3 mm) Shrunk Small Outline Package O28
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20-Lead
24-Lead
28-Lead
150-Mil)
51-85072-B
34-Pin
51-85083-B
48-Lead
51-85061-C
51-85062-C
package
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34-pin
Abstract: No abstract text available
Text: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Packag O20 1 Package Diagram 28-Lead Shrunk Small Outline Package O28 34-Pin Shrunk Small Outline Package O34 2 Package Diagram 48-Lead Shrunk Small Outline Package O48 56-Lead Shrunk Small Outline Package O56
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20-Pin
28-Lead
34-Pin
48-Lead
56-Lead
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O28 Package
Abstract: small outline
Text: Package Diagram Shrunk Small Outline Packages 20-Pin Shrunk Small Outline Package O20 51-85077-B 1 Package Diagram 28-Lead 210-Mil Shrunk Small Outline Package O28 51-85079-B 28-Lead (150-Mil) Shrunk Small Outline Package O29 51-85072-B 2 Package Diagram
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20-Pin
51-85077-B
28-Lead
210-Mil)
51-85079-B
150-Mil)
51-85072-B
34-Pin
51-85083-B
O28 Package
small outline
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79C0832RP
Abstract: No abstract text available
Text: SPACE ELECTRONICS INC. 8 MEGABIT EEPROM MCM GND I/O15 ADDRESS CE1 73 ADDR07 GND ADDR06 5V ADDR05 ADDR04 ADDR03 79C0832RP ADDR02 ADDR01 ADDR00 GND GND 5V GND GND GND GND GND 5V GND GND I/O16 SPACE PRODUCTS I/O14 1 I/O18 I/O13 I/O19 I/O12 I/O20 I/O11 I/O21 I/O10
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I/O15
ADDR07
ADDR06
ADDR05
ADDR04
ADDR03
79C0832RP
ADDR02
ADDR01
ADDR00
79C0832RP
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Untitled
Abstract: No abstract text available
Text: SPACE ELECTRONICS INC. 8 MEGABIT EEPROM MCM GND I/O15 ADDR07 GND ADDR06 5V ADDR05 ADDR04 ADDR03 ADDR02 ADDR01 79LV0832RP ADDR00 GND 5V GND GND GND GND 5V GND GND GND GND I/O16 SPACE PRODUCTS 73 CE1 I/O17 I/O14 1 I/O18 I/O13 I/O19 I/O12 I/O20 I/O11 I/O21 I/O10
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I/O15
ADDR07
ADDR06
ADDR05
ADDR04
ADDR03
ADDR02
ADDR01
79LV0832RP
ADDR00
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PD6323
Abstract: UPD6323BC uPD6323C NEC FIP 13 Si 1SS53 UPD6323 bc 339 NEC FIP PD7500 diagram SCK 035
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD6323 LATCH and DRIVER for FIP COMOS LSI DESCRIPTION The µPD6323 is a latch and driver CMOS IC for FIP Fluorescent Indicator Panel . For multiplex wiring, the µPD6323 is supplied with the serial interface circuit, 21 bit shift register, 21 bit data latch and 21 outputs. The serial
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PD6323
PD6323
UPD6323BC
uPD6323C
NEC FIP 13
Si 1SS53
UPD6323
bc 339
NEC FIP
PD7500 diagram
SCK 035
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pd6340
Abstract: uPD6340 UPD6340GC IC-2197 upd80c42 di450 pd634 uPD6340G P52GC-100 fip20
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD6340 20 BIT VACUUM FLUORESCENT DISPLAY DRIVER The µPD6340 is 20-bits vacuum Fluorescent display driver constructed with BiCMOS in a single monolithic structure. This device consists of a 20-bit bidirectional shift register of 20-bit serial/4 x 5-bit parallel data input, 20 latches
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PD6340
PD6340
20-bits
20-bit
P52GC-100-AB6-4
uPD6340
UPD6340GC
IC-2197
upd80c42
di450
pd634
uPD6340G
P52GC-100
fip20
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UPD6323BC
Abstract: PD6323 NEC FIP uPD6323 87AD Temperature to voltage converter ic with mil grade PD6323BC PD6323C VO20 2sc9
Text: DATA SHEET MOS INTEGRATED CIRCUIT µPD6323 LATCH and DRIVER for FIP COMOS LSI DESCRIPTION The µPD6323 is a latch and driver CMOS IC for FIP Fluorescent Indicator Panel . For multiplex wiring, the µPD6323 is supplied with the serial interface circuit, 21 bit shift register, 21 bit data latch and 21 outputs. The serial
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PD6323
PD6323
UPD6323BC
NEC FIP
uPD6323
87AD
Temperature to voltage converter ic with mil grade
PD6323BC
PD6323C
VO20
2sc9
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2N7002ELT
Abstract: 2N7002ELT1
Text: WILLAS FM120-M+ 2N7002ELT1 THRU FM1200-M+ Small Signal MOSFET 310 mAmps, 60 Volts 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers
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OD-123+
FM120-M+
2N7002ELT
FM1200-M+
OD-123H
Sili020
FM120-MH
FM130-MH
FM140-MH
FM150-MH
2N7002ELT1
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Untitled
Abstract: No abstract text available
Text: WILLAS FM120-M+ THRU 2N7002DW1T1 FM1200-M+ Small Signal MOSFET 115 mAmps,60 Volts 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V SOD-123+ PACKAGE Pb Free Product Package outline Features • Batch process design, excellent power dissipation offers
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OD-123+
FM120-M+
2N7002DTHRU
FM1200-M+
OD-123H
0197FM120-MH
FM130-MH
FM140-MH
FM150-MH
FM160-MH
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RF sensor
Abstract: PD6323BC
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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O28 Package
Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
Text: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .
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WF2M32-XXX5
2Mx32
150ns
2Mx32
64KBytes
WF2M32U-XG2UX
O28 Package
WF2M32-XXX5
68 lead CQFJ
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WF2M32-XXX5
Abstract: No abstract text available
Text: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 . Commercial, Industrial, and Military Temperature Ranges
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WF2M32-XXX5
2Mx32
150ns
2Mx32
64KBytes
WF2M32U-XG2UX
WF2M32-XXX5
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Untitled
Abstract: No abstract text available
Text: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES • Commercial, Industrial, and Extended Temperature Ranges ■ Access Time of 90, 120, 150ns ■ Packaging: 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .
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2Mx32
150ns
64KBytes
WF2M32-XXX5
WF2M32U-XG2UX
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Untitled
Abstract: No abstract text available
Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
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WF2M32-XXX5
2Mx32
150ns
64KBytes
WF2M32U-XG2UX
64KByte
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O28 Package
Abstract: No abstract text available
Text: WS128K32-15XX 128Kx32 SRAM MODULE ADVANCED* FEATURES • Access Times of 15nS ■ Packaging • 66-pin, PGA Type, 1.075 inch square Hermetic Ceramic HIP Package 400 • 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502), Package to be developed
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WS128K32-15XX
128Kx32
66-pin,
128Kx32;
256Kx16
512Kx8
WS128K32-XG2X
WS128K32-XHX
128Kx32
O28 Package
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WF2M32-XXX5
Abstract: No abstract text available
Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
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WF2M32-XXX5
2Mx32
150ns
64KBytes
2Mx32
64KByte
01HXX*
120ns
WF2M32-XXX5
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sot 23 70.2
Abstract: L2N7002LT1G marking 702 sot23 702 sot 23 L2N7002LT1G SOT-23
Text: LESHAN RADIO COMPANY, LTD. Small Signal MOSFET 115 mAmps, 60 Volts L2N7002LT1G N–Channel SOT–23 • 3 We declare that the material of product are Halogen Free and compliance with RoHS requirements. 1 2 • ESD Protected:1000V CASE 318, STYLE 21 SOT– 23 TO–236AB
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L2N7002LT1G
236AB)
OT-23
sot 23 70.2
L2N7002LT1G
marking 702 sot23
702 sot 23
L2N7002LT1G SOT-23
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Untitled
Abstract: No abstract text available
Text: LESHAN RADIO COMPANY, LTD. Small Signal MOSFET 115 mAmps, 60 Volts L2N7002LT1G S-L2N7002LT1G N–Channel SOT–23 • 3 We declare that the material of product are Halogen Free and compliance with RoHS requirements. 1 • ESD Protected:1000V • S- Prefix for Automotive and Other Applications Requiring
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L2N7002LT1G
S-L2N7002LT1G
236AB)
AEC-Q101
OT-23
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marking 702
Abstract: 2N7002LT ON
Text: WILLAS FM120-M+ THRU 2N7002LT1 FM1200-M+ Small Signal MOSFET 115 mAmps, 60 Volts 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V Pb Free Product SOD-123+ PACKAGE Package outline Features • Batch process design, excellent power dissipation offers
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Original
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OD-123+
FM120-M+
2N7002LT
FM1200-M+
OD-123H
FM120-MH
FM130-MH
FM140-MH
FM150-MH
FM160-MH
marking 702
2N7002LT ON
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MACH211SP
Abstract: mach schematic MACH111SP
Text: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages
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5/10/12/15-ns
5/10/12/14/18-ns
MACH221SP
MACH231
MACH231SP
MACH211
MACH211SP
MACH211SP
mach schematic
MACH111SP
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MACH131SP-5YC-7YI
Abstract: 14051k MACH Programmer PAL 007 PAL 007 A Pal programming MACH111SP MACH211SP mach210 die Vantis macro gates
Text: MACH 1 and 2 CPLD Families High-Performance EE CMOS Programmable Logic FEATURES ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ High-performance electrically-erasable CMOS PLD families 32 to 128 macrocells 44 to 100 pins in cost-effective PLCC, PQFP and TQFP packages
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5/10/12/15-ns
5/10/12/14/18-ns
MACH221
MACH221SP
MACH231
MACH231SP
MACH211
MACH211SP
MACH131SP-5YC-7YI
14051k
MACH Programmer
PAL 007
PAL 007 A
Pal programming
MACH111SP
MACH211SP
mach210 die
Vantis macro gates
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Untitled
Abstract: No abstract text available
Text: USB97C202 USB 2.0 ATA/ ATAPI Controller Datasheet Product Features 2.5 Volt, Low Power Core Operation Double Buffered Bulk Endpoint 3.3 Volt I/O with 5V input tolerance − Bi-directional 512 Byte Buffer for Bulk Endpoint − 64 Byte RX Control Endpoint Buffer
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USB97C202
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Untitled
Abstract: No abstract text available
Text: fax id: 2053 CYPRESS PRELIMINARY C YM 1861V33 2,048K X 32 3.3V Static RAM Module Features • H igh-density 3.3V 64-megabit SRAM module • 32-bit Standard F ootprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs packages mounted on an epoxy laminate substrate. Four chip
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OCR Scan
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PDF
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1861V33
64-megabit
32-bit
CYM1861V33
72-pin
64-pin
CYM1821,
CYM1831,
CYM1836,
CYM1841)
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