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    ANYSOLAR Ltd KXOB101K08F-TR

    SOLAR CELL GEN3 5.53V 179.6MW
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    DigiKey KXOB101K08F-TR Cut Tape 1,147 1
    • 1 $7.51
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    • 100 $5.4059
    • 1000 $4.82
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    KXOB101K08F-TR Digi-Reel 1,147 1
    • 1 $7.51
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    KXOB101K08F-TR Reel 1,000
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    ANYSOLAR Ltd KXOB101K08TF-TR

    SOLAR CELL G3 THIN 5.53V 179.6MW
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    DigiKey KXOB101K08TF-TR Cut Tape 990 1
    • 1 $8.02
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    KXOB101K08TF-TR Digi-Reel 990 1
    • 1 $8.02
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    KXOB101K08TF-TR Reel 1,000
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    • 1000 $4.90031
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    SparkFun Electronics BOB-10124

    SPARKFUN TRANSCEIVER BREAKOUT -
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    DigiKey BOB-10124 Bulk 257 1
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    Mouser Electronics BOB-10124 159
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    Master Electronics BOB-10124 40
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    SparkFun Electronics BOB-10160

    DEADON RTC BREAKOUT
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    DigiKey BOB-10160 Bulk 91 1
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    Mouser Electronics BOB-10160 664
    • 1 $23.39
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    SparkFun Electronics ROB-10189

    SERVOMOTOR RC 6V CONT ROTATION
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    DigiKey ROB-10189 Bulk 43 1
    • 1 $12.95
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    Mouser Electronics ROB-10189
    • 1 $12.5
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    OB101 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    241561

    Abstract: Intel 80386 programming model, memory paging 273206 273214 intel DOC Pentium MMX .25 MICRON 273232 Omega k type thermocouple range
    Text: Extended Temperature Pentium Processor with MMX Technology Advance Information Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.8 V Core Supply for HLPBGA — 2.5 V I/O Interface


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    PDF 32-Bit 64-Bit 166-MHz Core/66-MHz 16-Kbyte 16-Kbyte AP-579: AP-479: AP-480: AP-485: 241561 Intel 80386 programming model, memory paging 273206 273214 intel DOC Pentium MMX .25 MICRON 273232 Omega k type thermocouple range

    pentium MOTHERBOARD CIRCUIT diagram

    Abstract: T40 N03 am24 "pin compatible" processor cross reference intel pentium MMX simd 1997 z02 surface mounted transistor
    Text: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)


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    PDF 32-Bit 64-Bit 166-MHz Core/66-MHz 266-MHz 16-Kbyte 16-Kbyte pentium MOTHERBOARD CIRCUIT diagram T40 N03 am24 "pin compatible" processor cross reference intel pentium MMX simd 1997 z02 surface mounted transistor

    intel packaging handbook 240800

    Abstract: heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759
    Text: A AP-759 APPLICATION NOTE Intel Embedded Processor Module EMBMOD133 Thermal Design Guide December, 1997 Order Number: 273143-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


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    PDF AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759

    Bulk Decoupling 430TX

    Abstract: Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503
    Text: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)


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    PDF 32-Bit 64-Bit 166-MHz Core/66-MHz 266-MHz 16-Kbyte pdf/2000/273209 Bulk Decoupling 430TX Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


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    PDF 93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board

    processor cross reference

    Abstract: APIC D18 ac03 d41 APIC D06 ak02 t04 68 3 pin controller diode u2 a05 t04 68 3 pin diode transistor T04 AN33
    Text: Low-Power Embedded Pentium Processor with MMX Technology 11.0 Low-power Embedded Pentium® Processor with MMX™ Technology Packaging Information 11.1 Differences from Desktop Processors The following features have been eliminated in the low-power embedded Pentium processor with


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    heat sensor with fan cooling working

    Abstract: FUJIKURA fan Sanyo Denki dc fan Thermagon Thermacore sumitomo water sensor FUJIKURA heat pipe heat sensor with fan cooling heat sensor with fan cooling working and elements working stamford voltage regulator
    Text: Intel Pentium® III Processor – Low-Power Module Thermal Design Guide Application Note January 2000 Order Number: 273300-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    sulzer s7

    Abstract: L64364 6903 controller MT41LC256K32D4 sulzer pump CRC10 CRC32 R3000 R4000 1048 air hec nv
    Text: ATMizer L64364 ATM-SAR Chip Technical Manual March 2000 ® Order Number R14008.A II+ This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties without the express written permission of an officer of LSI Logic Corporation.


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    PDF L64364 R14008 DB14-000037-01, L64364 D-33181 D-85540 sulzer s7 6903 controller MT41LC256K32D4 sulzer pump CRC10 CRC32 R3000 R4000 1048 air hec nv

    sulzer s7

    Abstract: tag 8730 NEC 2505 sulzer pump westlake capacitors L64364 LA 4636 NEC 2505 nj CRC32 L64363
    Text: TECHNICAL MANUAL L64364 ATMizer II+ ATM-SAR Chip February 2001 ® R14008.A This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties without the express written permission of an officer of LSI Logic Corporation.


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    PDF L64364 R14008 DB14-000037-02, L64364 D-33181 D-85540 sulzer s7 tag 8730 NEC 2505 sulzer pump westlake capacitors LA 4636 NEC 2505 nj CRC32 L64363

    STI omega

    Abstract: 241561 80386 developers manual ARCHITECTURE OF pentium 2 AC25 AF14 243187 fpu coprocessor 273206 273232-002
    Text: Extended Temperature Pentium Processor with MMX Technology Advance Information Datasheet Product Features • ■ ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.8 V Core Supply for HL-PBGA — 2.5 V I/O Interface


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    PDF 32-Bit 64-Bit 166-MHz Core/66-MHz 16-Kbyte 16-Kbyte AP-579: AP-479: AP-480: AP-485: STI omega 241561 80386 developers manual ARCHITECTURE OF pentium 2 AC25 AF14 243187 fpu coprocessor 273206 273232-002

    tungsten slug glass diode

    Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    OB121

    Abstract: PLC siemens S7-300 cpu 317-2 DP manual OB122 OB80 Example SIMATIC S7 Programming PID function block OB83 6ES7810-4CA10-8BW1 Wiring Diagram s7-300 siemens Wiring Diagram s7-300 siemens cpu 226 6ES7810-4CA10-8BW0
    Text: SIMATIC Programming with STEP 7 Manual This manual is part of the documentation package with the order number: 6ES7810-4CA10-8BW0 05/2010 A5E02789666-01 Introducing the Product and Installing the Software 1 Installation 2 Working Out the Automation Concept


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    PDF A5E02789666-01 6ES7810-4CA10-8BW0 OB121 PLC siemens S7-300 cpu 317-2 DP manual OB122 OB80 Example SIMATIC S7 Programming PID function block OB83 6ES7810-4CA10-8BW1 Wiring Diagram s7-300 siemens Wiring Diagram s7-300 siemens cpu 226 6ES7810-4CA10-8BW0

    intel packaging handbook 240800

    Abstract: hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133
    Text: Intel Embedded Processor Module Thermal Design Guide Application Note June 1998 Order Number: 273143-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    PDF IASK9801 NP970255 intel packaging handbook 240800 hot wire mass airflow sensor heat pipes intel tuflok 43537 data sheet IC 7408 drawn pin configuration of ic 7408 stamford voltage regulator 82439HX EMBMOD133

    D004 power ic

    Abstract: D004 OB10-2 GY87 OB211 KS7221 oa112 OA212 KS7213 KS7306
    Text: KS7306 DIGITAL CAMERA PROCESSOR GENERAL DESCRIPTION 100-QFP-1414 KS7306 is a CCD digital signal processor. The electronic video signal that passed the color filter array CFA pattern of CCD is put to the process of dual correlation sampling and then converted to


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    PDF KS7306 100-QFP-1414 KS7306 VID-97-D004 25Z-2 25Z-1 D004 power ic D004 OB10-2 GY87 OB211 KS7221 oa112 OA212 KS7213

    82443BX Northbridge

    Abstract: heat sensor with fan cooling working t-pli 210 UDQF FUJIKURA fan Sanyo Denki dc fan denso pressure sensor miniature mass air flow sensor Thermacore pentium 4 heat sensor
    Text: Intel Pentium® II Processor – Low-Power Module Thermal Design Guide Application Note February 2000 Order Number: 273216-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    Untitled

    Abstract: No abstract text available
    Text: “Cement-On” Thermocouples ߜ Response Time in Milliseconds ߜ Made from 0.013 mm 0.0005" Foil and 0.25 mm (0.010") Diameter Thermocouple Wire ߜ Very Low Thermal Inertia ߜ Four Calibrations "K", "E", "J" and "T" ߜ Three Styles Ideal for Surface Measurement


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    A5620

    Abstract: 3g call flow Sensor Cement Capacitor CQ DIODE DATABOOK tsop Ir sensor SLOTTED OPTICAL SWITCH inductive displacement sensors Side Brazed Ceramic Dual-In-Line Packages schematic inductive proximity sensor schematic AC inductive proximity sensor
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


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    intel packaging handbook 240800

    Abstract: OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36
    Text: Pentium II Processor – Low Power Thermal Design Guide Application Note September 1999 Order Number: 273254-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    PDF NP970482 NP971803 NP971804 intel packaging handbook 240800 OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36

    EJTAG 1.53

    Abstract: mdu 2656 cw33300 EJTAG SPECIAL2 SDBBP mips risc architecture gerry kane MIPS r3000 EZ4021-FC MIPS16 R3000
    Text: MiniRISC EZ4021-FC EasyMACRO Microprocessor Technical Manual February 2001 ® Order No. R14018.A This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


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    PDF EZ4021-FC R14018 DB15-000163-01, EZ4021-FC EJTAG 1.53 mdu 2656 cw33300 EJTAG SPECIAL2 SDBBP mips risc architecture gerry kane MIPS r3000 MIPS16 R3000

    SK107 TRANSISTOR

    Abstract: lds 7 segment LDS 5161 AK a80502-75 i3 i5 i7 processor Procesor pentium II register organization MEX GPF intel 80386 block diagram Q0601 82489dx t04 68 3 pin diode
    Text: D Pentium Processor Family Developer’s Manual 1997 12/19/96 9:12 AM Front.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    443BX Northbridge

    Abstract: denso "air velocity meter" Cement denso meter stamford voltage regulator Wakefield Thermal Solutions 443BX AP-825 OB-101
    Text: Pentium II Processor Mobile Module: Embedded Module Connector-2 Thermal Design Guide Application Note December 1998 Order Number: 273216-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    D8107G

    Abstract: D8103G d8107 DBS104G OB101Q DBS102G
    Text: BRIDGE RECTIFIERS DIP PACKAGE OPERATING AND STORAGE TEMPERATURE - 55°C to + 1 50°C SURGE PART NUMBER Maximum Peak Reverse ; Voltage Maxim um Average Rectified Current @ Half-W ave Resistive Load PRV V PK io @ A AV OB101Q DB102G D8103G DB104G W DB106G 9 » D8107G


    OCR Scan
    PDF OB101Q DB102G D8103G DB104G DB106G D8107G D8107G d8107 DBS104G DBS102G

    OB30-15

    Abstract: vde 0550 OB30-9 OB14-18 OB24-12 OB18-12 OB26 OB14-5 OB24-9 OB18-18
    Text: • ■— - - — AVEL TECHNICAL INFORMATION SHEET LOW PROFILE TRANSFORMERS INTERNATIONAL APPROVALS UL 506 CSA C 22.2 EN 60/742 SEV 1003 EN 60/950 LOW PROFILE PCB MOUNTED RESIN FILLED UNDER VACUUM 5KV AC FLASH TEST CUSTOM DESIGN AVAILABLE INDUSTRY STANDARD


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    PDF 50/60Hz. 0551IEC DIN/EN60 OB24-6 OB24-9 OB24-12 OB24-15 800mA OB24-18 670mA OB30-15 vde 0550 OB30-9 OB14-18 OB18-12 OB26 OB14-5 OB18-18

    ECJF

    Abstract: oa112 UVI03 Color Filter Array CFA 1025z
    Text: KS7306 DIGITAL CAMERA PROCESSOR GENERAL DESCRIPTION KS7306 is a CCD digital signal processor. The electronic video signal that passed the color filter array CFA pattern of CCD is put to the process of dual correlation sampling and then converted to digital video signal by A/D converter.


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    PDF KS7306 KS7306 100-QFP-1414 ECJF oa112 UVI03 Color Filter Array CFA 1025z