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BOYD Laconia 125800D00000G Heat Sink Passive BGA Anchor
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	125800D00000G		4,572			1 - 10 - 100 $0.2719 1000 $0.2719 10000 $0.173	Buy Now
Hirose Electric Co Ltd IT5HM-100S-BGA(37) High-Speed(25+ Gbps) BGA Mezzanine Connectors
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Onlinecomponents.com	IT5HM-100S-BGA(37)					1 - 10 $25.6 100 $17.56 1000 $17.56 10000 $17.56	Buy Now
Hirose Electric Co Ltd IT5D-100S-BGA(39) High-Speed(25+ Gbps) BGA Mezzanine Connectors
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	IT5D-100S-BGA(39)					1 - 10 $25.6 100 $17.56 1000 $17.56 10000 $17.56	Buy Now
Hirose Electric Co Ltd IT5M-300S-BGA(37) High-Speed(25+ Gbps) BGA Mezzanine Connectors
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	IT5M-300S-BGA(37)					1 - 10 - 100 $40 1000 $37.44 10000 $36.87	Buy Now
Hirose Electric Co Ltd IT3M-200S-BGA(37) High-Speed(10⁺Gbps) BGA Mezzanine Connectors
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	IT3M-200S-BGA(37)					1 $24.83 10 $24.83 100 $18.14 1000 $16.68 10000 $16.68	Buy Now

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Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: OVERVIEW Fujitsu, a world renowned computer and telecommunications company with a monthly production volume in excess of 60 million packages where 2 million are dedicated to BGAs, is offering the widest range of JEDEC/EIAJ compliant MCP and SCP packages. Leveraging our strength and experience in decades of high-end and	Original		PDF
underfill Abstract: cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate Text: Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-mm pitch full-array flip-chip BGAs were developed. These packages vary from 27 to 45 mm in package	Original	12x10-6 17x10-6 6x10-6 underfill cte table flip chip substrate ansys darveaux with or without underfill FR4 substrate height and thickness cte table bga cte table 63Sn37Pb application for bt 151 FR4 substrate	PDF
APW7004 Abstract: MS-013 Text: APW7004 Synchronous-Rectifier PWM Controller for PentiumTM II Microprocessor Features • 6´ 86TM is a trademark of Cyrix Corporation AlphaTM is a trademark of Digital Equipment Corporation K6 TM is a trademark of Advanced Micro Devices, Inc. Pentium TM is a trademark of Intel Corporation	Original	APW7004 APW7004 MS-013	PDF
T405R Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink	Original	WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412	PDF
P2QFP100-GH-1420 Abstract: O2-A2 CQFP44 USART 8251 interfacing with 8051 microcontroller CQFP100 microprocessors interface 8086 to 8251 full 18*16 barrel shifter design P4QFP100-GH-1420 CLA90000 transistors for oscillators Text: CLA90000 Series High Density CMOS Gate Arrays DS5500 ISSUE 2.0 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Zarlink Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This	Original	CLA90000 DS5500 P2QFP100-GH-1420 O2-A2 CQFP44 USART 8251 interfacing with 8051 microcontroller CQFP100 microprocessors interface 8086 to 8251 full 18*16 barrel shifter design P4QFP100-GH-1420 transistors for oscillators	PDF
USART 8251 interfacing with 8051 microcontroller Abstract: full 1816 barrel shifter design 1816 barrel shifter design USART 8251 USART 8251 expanded block diagram 8251 UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER P4QFP100-GH-1420 interfacing 8051 with ppi USART 8251 interfacing M8490 scsi Text: CLA90000 Series High Density CMOS Gate Arrays DS5500 ISSUE 2.0 INTRODUCTZarlinkION BENEFITS The CLA90000 family of gate arrays from Zarlink Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This	Original	CLA90000 DS5500 USART 8251 interfacing with 8051 microcontroller full 1816 barrel shifter design 1816 barrel shifter design USART 8251 USART 8251 expanded block diagram 8251 UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER P4QFP100-GH-1420 interfacing 8051 with ppi USART 8251 interfacing M8490 scsi	PDF
microprocessors interface 8086 to 8251 Abstract: USART 8251 interfacing with 8051 microcontroller to design a full 1816 barrel shifter design USART 8251 1816 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design Text: CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS4375 - 2.0 April 1997 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Mitel Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This	Original	CLA90000 DS4375 microprocessors interface 8086 to 8251 USART 8251 interfacing with 8051 microcontroller to design a full 1816 barrel shifter design USART 8251 1816 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design	PDF
Signal Path Designer Abstract: No abstract text available Text: COMMON DESIGN PROBLEM JTAG/EJTAG DEVICES INTRODUCTION In 1990, the Institute of Electrical and Electronics Engineers IEEE adopted a method of testing deeply integrated circuits and complete boards. This resolution, IEEE 1149.1-1990 was brought about by the industry looking for a method of testing	Original	RC32355 Signal Path Designer	PDF
AN-1205 Abstract: CM12 Signal Path Designer Text: National Semiconductor Application Note 1205 August 2001 INTRODUCTION This note is a snapshot of electrical performance of National’s IC packages. It is provided to help designers get an idea about electrical parasitics associated with the package, and help them compare the electrical performance of different	Original	AN-1205 AN-1205 CM12 Signal Path Designer	PDF
RAM16X8 Abstract: verilog hdl code for triple modular redundancy 37101 verilog/verilog code for lvds driver xc2v3000fg sot 23-5 marking code H5 BT 342 project xc2v250cs144 XC2V3000FF1152 fpga JTAG Programmer Schematics Text: Virtex-II Platform FPGA Handbook R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. The shadow X shown above is a trademark of Xilinx, Inc. "Xilinx" and the Xilinx logo are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved.	Original	XC2064, XC3090, XC4005, XC5210 RAM16X8 verilog hdl code for triple modular redundancy 37101 verilog/verilog code for lvds driver xc2v3000fg sot 23-5 marking code H5 BT 342 project xc2v250cs144 XC2V3000FF1152 fpga JTAG Programmer Schematics	PDF
matrix 2088ab Abstract: 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB Text: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 5, January−2007 SCILLC, 2007 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of	Original	January-2007 matrix 2088ab 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB	PDF
2088AB* led matrix Abstract: led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311 Text: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 3, May−2006 SCILLC, 2006 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of	Original	May-2006 2088AB* led matrix led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311	PDF
wireless power transfer using em waves matlab simulink Abstract: PCB mounted 230 V relay Virtex-II FF1152 Prototype Board sot 23-5 marking code H5 BT 342 project Chirp modulation ber performance vhdl code for TRAFFIC LIGHT CONTROLLER using stat Motorola diode SMD code B13 xilinx vhdl code for 555 timer MARKING SMD IC CODE 8-pin Text: Virtex-II Pro Platform FPGA Handbook UG012 v1.0 January 31, 2002 R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. The shadow X shown above is a trademark of Xilinx, Inc. "Xilinx" and the Xilinx logo are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved.	Original	UG012 XC2064, XC3090, XC4005, XC5210 B-1972 wireless power transfer using em waves matlab simulink PCB mounted 230 V relay Virtex-II FF1152 Prototype Board sot 23-5 marking code H5 BT 342 project Chirp modulation ber performance vhdl code for TRAFFIC LIGHT CONTROLLER using stat Motorola diode SMD code B13 xilinx vhdl code for 555 timer MARKING SMD IC CODE 8-pin	PDF
AN-1126 Abstract: AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement Text: Table of Contents Introduction . 2 Package Overview . 3	Original	AN-1126 AN-1126 AN-1205 land pattern BGA 0.75 TMCL ACLV MO-151 fbga Substrate design guidelines bga Shipping Trays pcb warpage after reflow Epoxy, glass laminate gold embrittlement	PDF

c 6090 Abstract: cte table epoxy substrate TMS320VC549 TMS320VC549GGU package cte Text: Application Report SPRA471C - April 2003 High-Density Design With MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications ABSTRACT The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real	Original	SPRA471C c 6090 cte table epoxy substrate TMS320VC549 TMS320VC549GGU package cte	PDF
APL5331 Abstract: TO-252-5 Package APM2300 J-STD-020A DSA0033039 L5331 Text: APL5331 3A Bus Termination Regulator Features General Description Cont. • On-chip thermal shutdown provides protection against any combination of overload that would create excessive junction temperature. The output voltage of APL5331 track the voltage at VREF pin. A resistor	Original	APL5331 APL5331 O-252 TO-252-5 Package APM2300 J-STD-020A DSA0033039 L5331	PDF
disposable camera Abstract: Wireless Camera transmitter wireless camera circuit of wireless camera glucometer of glucometer Text: mpt_2 26/10/04 5:38 PM Page 32 INNER SPACE Medical technology goes sci-fi with the introduction of new ultra low-power wireless medical devices, writes Francois Pelletier of Zarlink Semiconductor. Swallowable camera capsules, communicating medical implants, gizmos	Original		PDF
cte table bga Abstract: datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow Text: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate	Original	SPRA471A cte table bga datasheet of BGAS package cte cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU tms320 solder reflow	PDF
texas instruments reliability report Abstract: cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU Text: Application Report SPRA471A High-Density Design with MicroStar BGAs Gerald Capwell Fixed-Point DSP Applications Abstract The consumer electronics industry constantly faces new challenges to design their solutions smaller and less expensive. One of the industry’s most limiting design factors is board real estate	Original	SPRA471A texas instruments reliability report cte table epoxy substrate SPRA471A TMS320 TMS320VC549 TMS320VC549GGU	PDF
LAYOUT GUIDELINES Abstract: LG jtag MSX532 I-CUBE SDYA011 Text: Technical Note MSX532 Layout Guidelines 1.0 Introduction The MSX532 is packaged in a 792-ball plastic BGA package, and is an SRAM-based bit-oriented switching device offering flow-through NRZ datarates of 300Mbps and registered clock frequencies of 200MHz. The 532	Original	MSX532 792-ball 300Mbps 200MHz. inte8800, MKT-MSX532-LG LAYOUT GUIDELINES LG jtag I-CUBE SDYA011	PDF
Indium Tac Flux 020 Abstract: CU-106A CU-106A shelf life of BGAS DALE SOMC k type thermocouple utl USR(pet) gold embrittlement Text: APPENDIX A Surface Tension and the Self-Centering of BGAs ITS PHYSICS ARE REVIEWED T O G E TH E R W I T H SOLDER TYPE, TEM PERATURE A N D THE PRESENCE OF C O N T A M I N A T E S A N D H O W THEY IN F LU E N C E By Steve G r e a t h o u s e THE S E L F - A L I G N I N G M O V E M E N T OF DEVICES D U R I N G	OCR Scan		PDF
Untitled Abstract: No abstract text available Text: Interconnect Processing Group • Free Micro, SMT and Edge Mount board processing consulting service • Help lower total applied cost of boards • Help improve overall processing and manufacturability of boards • Help resolve complex interconnect processing issues of concern	OCR Scan		PDF
TL 1838 Abstract: ITT 2222 A Mitel Semiconductor process flow to design a full 1816 barrel shifter design pic 1840 ATS 16Mhz MITEL CLA full 1816 barrel shifter design Text: CLA90000 SERIES j j j j ivilTEL HIGH DENSITY CMOS GATE ARRAYS s b m Sc o n â î c t o r DS4375 - 2.0 April 1997 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Mitel Sem icon ductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This	OCR Scan	CLA90000 DS4375 84-ACB-2828 144-ACB-4040 208-ACB-4545 209-ACB-4545 TL 1838 ITT 2222 A Mitel Semiconductor process flow to design a full 1816 barrel shifter design pic 1840 ATS 16Mhz MITEL CLA full 1816 barrel shifter design	PDF
ITT 2222 A Abstract: itt 2222 Text: Si GEC P L E S S E Y APRIL 1997 S E M I C O N D U C T O R S CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION BENEFITS The CLA90000 family of gate arrays from GEC Plessey Semiconductors GPS consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million	OCR Scan	CLA90000 84-ACB-2828 144-ACB-4040 208-ACB-4545 209-ACB-4545 ITT 2222 A itt 2222	PDF

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OF BGAS Search Results

OF BGAS Price and Stock

BOYD Laconia 125800D00000G

Hirose Electric Co Ltd IT5HM-100S-BGA(37)

Hirose Electric Co Ltd IT5D-100S-BGA(39)

Hirose Electric Co Ltd IT5M-300S-BGA(37)

Hirose Electric Co Ltd IT3M-200S-BGA(37)

OF BGAS Datasheets Context Search

Untitled

underfill

APW7004

T405R

P2QFP100-GH-1420

USART 8251 interfacing with 8051 microcontroller

microprocessors interface 8086 to 8251

Signal Path Designer

AN-1205

RAM16X8

matrix 2088ab

2088AB* led matrix

wireless power transfer using em waves matlab simulink

AN-1126

c 6090

APL5331

disposable camera

cte table bga

texas instruments reliability report

LAYOUT GUIDELINES

Indium Tac Flux 020

Untitled

TL 1838

ITT 2222 A