OM6254U Search Results

OM6254U Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
OM6254U		NXP Semiconductors	fine-pitch land grid array package; 274 lands		Original	PDF

OM6254U Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Bare die outline WLCSP9: wafer level chip-size package; 9 bumps; 1.26 x 1.89 x 0.22 mm OM6254U D e e1 y e2 E x 0,0 X Y 2 P1 P2 A1 detail X A2 A Dimensions Unit(1) mm A A1 A2 max nom 0.215 0.015 0.2 min D(1) E(1) detail Y e e1 1.26 1.89 1.05 0.22 P1 e2 0.9	Original	PDF	OM6254U PC8564A-1 om6254u

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: Bare die outline WLCSP9: wafer level chip-size package; 9 bumps; 1.26 x 1.89 x 0.22 mm OM6254U D e e1 y e2 E x 0,0 X Y 2 P1 P2 A1 detail X A2 A Dimensions Unit(1) mm A A1 A2 max nom 0.215 0.015 0.2 min D(1) E(1) detail Y e e1 1.26 1.89 1.05 0.22 P1 e2 0.9

Original

PDF

OM6254U PC8564A-1 om6254u