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    OUTLINE OF THE HEAT SINK FOR JEDEC Search Results

    OUTLINE OF THE HEAT SINK FOR JEDEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    OUTLINE OF THE HEAT SINK FOR JEDEC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PDF PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747

    MO-166

    Abstract: powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt
    Text: APPLICATION NOTE A New High Power IC Surface Mount Package: PowerSO-20 Power IC Packaging from Insertion to Surface Mounting by P. Casati and C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration


    Original     		PDF PowerSO-20TM MO-166. PowerSO-20 MO-166 MO-166 powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt

    HI-8592

    Abstract: outline of the heat sink for JEDEC HI-3584
    Text: HI-8592, HI-8593, HI-8594 February, 2011 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


    Original     		PDF HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 whi03 outline of the heat sink for JEDEC HI-3584

    Untitled

    Abstract: No abstract text available
    Text: HI-8592, HI-8593, HI-8594 June, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


    Original     		PDF HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594

    arinc 429 serial transmitter

    Abstract: HI-8592 HI-8593PS AN-300 HI-3584 HI-8570 HI-8571 SOIC-8 8593 8594C
    Text: HI-8592, HI-8593, HI-8594 October, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


    Original     		PDF HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 ver76) arinc 429 serial transmitter HI-8593PS AN-300 HI-3584 HI-8570 HI-8571 SOIC-8 8593 8594C

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    HI-8592

    Abstract: HI-8593PS TA 1753 T INVERTER CIRCUITS DS8592 AN-300 arinc 429 serial transmitter HI-3584 HI-8570 HI-8571 HI-8592P
    Text: HI-8592, HI-8593, HI-8594 July, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


    Original     		PDF HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 versio76) HI-8593PS TA 1753 T INVERTER CIRCUITS DS8592 AN-300 arinc 429 serial transmitter HI-3584 HI-8570 HI-8571 HI-8592P

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


    Original     		PDF

    124 008r

    Abstract: B13W
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 March 2007 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 124 008r B13W

    124 008r

    Abstract: B13W ESD 138C
    Text: HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 September 2007 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382


    Original     		PDF HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 HI-3184, 124 008r B13W ESD 138C

    k0319

    Abstract: HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182
    Text: HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 March 2008 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382


    Original     		PDF HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 HI-3184, k0319 HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182

    Holt an-300

    Abstract: 05-BOTTOM
    Text: HI-8592, HI-8593, HI-8594 November, 2012 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


    Original     		PDF HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 Holt an-300 05-BOTTOM

    MS-034 1152 BGA

    Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 AGX52014-1
    Text: 14. Package Information for Arria GX Devices AGX52014-1.1 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


    Original     		PDF AGX52014-1 EP1AGX35 EP1AGX50 EP1AGX20 EP1AGX90 FBGA35 152-pin MS-034 1152 BGA FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


    Original     		PDF

    FBGA-484 datasheet

    Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
    Text: 14. Package Information for Arria GX Devices AGX52014-1.0 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


    Original     		PDF AGX52014-1 EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX90 EP1AGX60 152-pin FBGA-484 datasheet 84 FBGA outline FBGA-484 asme y14.5m MS 034 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152

    HI8585PSIN

    Abstract: HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8585 HI-8586 HI-8588 HI-8585PSI-N INTERFACE TECHNOLOGY ARINC 429
    Text: HI-8585, HI-8586 ARINC 429 Line Driver June 2009 DESCRIPTION PIN CONFIGURATION The HI-8585 and HI-8586 are CMOS integrated circuits designed to directly drive the ARINC 429 bus in an 8-pin package. Two logic inputs control a differential voltage between the output pins producing a +10 volt One, a


    Original     		PDF HI-8585, HI-8586 HI-8585 HI-8586 381min) HI8585PSIN HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8588 HI-8585PSI-N INTERFACE TECHNOLOGY ARINC 429

    Untitled

    Abstract: No abstract text available
    Text: HI-8592, HI-8593, HI-8594 September, 2013 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


    Original     		PDF HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 24-PIN

    FBGA-484 datasheet

    Abstract: arria MS-034 AGX52014-1
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF 152-pin FBGA-484 datasheet arria MS-034 AGX52014-1

    78L05 equivalent

    Abstract: TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A
    Text: FEATURES ABSOLUTE MAXIMUM RATINGS • OUTPUT CURRENT UP TO 100mA . NO EXTERNAL COMPONENTS • INTERNAL THERMAL OVERLOAD PRO­ TECTION . INTERNAL SHORT CIRCUIT CURRENT LIMITING • AVAILABLE IN JEDEC TO-92 ANO LOW PROFILE TO-39 PACKAGES . OUTPUT VOLTAGES OF 2.6V, 5V, 6.2V,


    OCR Scan     		PDF 100mA 78L00-AC) 78L00C) 78L05 equivalent TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A

    Untitled

    Abstract: No abstract text available
    Text: u OM9022SC QM9023SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline Low Thermal Resistance


    OCR Scan     		PDF OM9022SC QM9023SC OM9024SC OM9Q25SC MQ-078AA M0-078AA

    Untitled

    Abstract: No abstract text available
    Text: OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM526QSA/RA/DA HERMETIC JEDEC TO-254AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER FEATURES • • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-254AA Outline


    OCR Scan     		PDF OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM526QSA/RA/DA O-254AA MIL-S-19500, appli00° OM5257XX OM5258XX

    Untitled

    Abstract: No abstract text available
    Text: OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC OM526QSC/RC/DC HERMETIC JEDEC TO-258AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER FEATURES • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-258AA Outline


    OCR Scan     		PDF OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC OM526QSC/RC/DC O-258AA MIL-S-19500, OM5257XX OM5258XX OM5259XX

    Untitled

    Abstract: No abstract text available
    Text: OM9Û22SC OM9Q23SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE 10 Amp, 50 To 200 Volts, 35 ns trr FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline


    OCR Scan     		PDF OM9Q23SC OM9024SC OM9Q25SC MQ-078AA M0-078AA

    SF1154

    Abstract: A430 A430A A430B A437A A437B A570 A570A A570B A596
    Text: RECTIFIERS 183 750 TO 1500 AMPERES GE TYPE JEDEC SPECIFICATIONS_ . Max. average forward current FM A V (1 phase operation) (A) A437 A 596 A430 A 540 A 696 A 570 A 640 - - - - - - - 750 1000 1000 1000 1500 1500 65 126 100 - 80 80 750 -j >T c - (°C)


    OCR Scan     		PDF A437A A430A A570A A437B A430B A570B A437C A430C A570C A437D SF1154 A430 A570 A570B A596