OZ 9966 Search Results
OZ 9966 Datasheets Context Search
Catalog Datasheet |
Type |
Document Tags |
PDF |
|---|---|---|---|
|
Contextual Info: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper |
Original |
SN74LS12 C36000 ASTM-B16085 MIL-P-81728 QQN-290. | |
|
Contextual Info: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper |
Original |
SN74LS12 C36000 ASTM-B16085 MIL-T-10727 MIL-P-81728 QQ-N-290. | |
OZ 9966Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000 |
Original |
C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 | |
|
Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. | |
75als162
Abstract: OZ 9966 18071
|
Original |
24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 18071 | |
|
Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000 |
Original |
C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. | |
|
Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
MC68HC11E9 C36000 ASTM-B16-00. SAEAMS-QQ-N-290. | |
MC68HC11E9Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
MC68HC11E9 C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. | |
|
Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000 |
Original |
C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. | |
sdip-29
Abstract: amp plcc socket dsip
|
Original |
MC68HC11E9 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. sdip-29 amp plcc socket dsip | |
|
Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. | |
|
Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. | |
|
Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper |
Original |
MC145158-2 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. 20-301550-X0 1112610-T 1112578-T 1112610-T | |
|
Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000 |
Original |
C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. | |
|
|
|||
|
Contextual Info: 4121-106-18-N 64 PIN .5MM TQFP TO .65MM QFP ADAPTER FEATURES: • A cost effective means of upgrading without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
4121-106-18-N C36000 ASTM-B16085 MIL-P-81728 QQN-290. | |
sdip-29Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
MC68HC11E9 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. sdip-29 | |
|
Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper |
Original |
MC145158-2 C36000 ASTM-B-16-00. SAE-AMS-QQ-N-290. 20-301550-X0 1112610-T 1112578-T 1112610-T | |
|
Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000 |
Original |
C36000 ASTM-B-16-00. SAE-AMS-QQ-N-290. | |
OZ 9966Contextual Info: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper |
Original |
1111841-X C36000 ASTM-B16085 MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 | |
|
Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. |
Original |
MC145158-2 C36000 ASTM-B-16-85. MIL-P-81728 QQN-290. 20-301550-X0 1109639-T 1109901-T | |
OZ 9966
Abstract: QQN-290
|
Original |
1111841-X C36000 ASTM-B16085 MIL-P-81728 QQN-290. OZ 9966 QQN-290 | |
OZ 9966
Abstract: MC12009
|
Original |
MC12009 C36000 ASTM-B-16-85. MIL-P-81728 QQ-N-290. OZ 9966 | |
Aromat hb2e
Abstract: hb2e AROMAT HB2E RELAY aromat
|
Original |
C36000 ASTM-B16085 MIL-P-81728 QQN-290. Aromat hb2e hb2e AROMAT HB2E RELAY aromat | |
hb2e
Abstract: Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT
|
Original |
C36000 ASTM-B16085 MIL-P-81728 QQN-290. hb2e Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT | |