bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
|
Original
|
|
PDF
|
PQFP 176
Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●
|
Original
|
144-Pin
100-Pin
256-Pin
780-Pin
256-Pin
68-Pin
PQFP 176
240 pin rqfp drawing
EP3C5E144
EP1K50-208
processor cross reference
EP3C16F484
MS-034 1152 BGA
84 FBGA thermal
TQFP 144 PACKAGE DIMENSION
FBGA 1760
|
PDF
|
ep600i
Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)
|
Original
|
|
PDF
|
240 pin rqfp drawing
Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)
|
Original
|
7000B,
7000AE,
240 pin rqfp drawing
BGA sumitomo
724p
EP1C12
Altera pdip top mark
epm7032 plcc
FBGA672
192 BGA PACKAGE thermal resistance
|
PDF
|
EP4CE6 package
Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
|
Original
|
DS-PKG-16
EP4CE6 package
EP4CE40
Altera EP4CE6
EP4CE55
5M240Z
5M1270Z
QFN148
5m570z
5M40
5M80
|
PDF
|
EP4CE15
Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead
|
Original
|
DS-PKG-16
EP4CE15
MS 034
BGA and QFP Altera Package mounting
Altera pdip top mark
jedec package MO-247
SOIC 20 pin package datasheet
QFN "100 pin" PACKAGE thermal resistance
Theta JC of FBGA
QFN148
EP4CE22
|
PDF
|
K8D3216UBC-pi07
Abstract: K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm
Text: Product Selection Guide Memory and Storage April 2005 MEMORY AND STORAGE SECTION A DRAM DDR2 SDRAM DDR SDRAM SDRAM RDRAM NETWORK DRAM MOBILE SDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND, OneNAND, NOR FLASH NAND FLASH ORDERING INFORMATION SRAM
|
Original
|
BR-05-ALL-002
K8D3216UBC-pi07
K5E5658HCM
KAD070J00M
KBH10PD00M
K5D1257ACM-D090000
samsung ddr2 ram MTBF
KBB05A500A
K801716UBC
k5d1g13acm
k5a3281ctm
|
PDF
|
A3PE1500
Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Text: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .
|
Original
|
208-Pin
A3PE600
IO112PDB6V1
IO85NPB5V0
A3PE1500
A3PE3000
IO23PDB0V2
IO23NDB0V2
IO30PDB1V1
IO05PDB0V0
IO06PDB0V1
IO32PDB1V1
IO10PDB0V1
IO283PDB7V1
|
PDF
|
K5W1G
Abstract: KMCME0000M-B998 k9hbg08u1m K9MCG08U5M K5E1257ACM MC4GE04G5APP-0XA b998 KMCME0000M hd161hj K5D1G
Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage August 2007 MEMORY AND STORAGE DRAM DDR3 SDRAM DDR2 SDRAM DDR SDRAM SDRAM MOBILE SDRAM RDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND FLASH NAND FLASH ORDERING INFORMATION
|
Original
|
BR-07-ALL-001
K5W1G
KMCME0000M-B998
k9hbg08u1m
K9MCG08U5M
K5E1257ACM
MC4GE04G5APP-0XA
b998
KMCME0000M
hd161hj
K5D1G
|
PDF
|
schematic diagram online UPS for high frequency
Abstract: ag19
Text: v3.3 ProASICPLUS TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-based CMOS Process
|
Original
|
|
PDF
|
APA750
Abstract: GL25 4kx8 sram
Text: v3 .4 PLUS ProASIC TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-based CMOS Process
|
Original
|
|
PDF
|
samsung ddr3 ram MTBF
Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks
|
Original
|
BR-12-ALL-001
samsung ddr3 ram MTBF
KLM2G1HE3F-B001
KLM4G1FE3B-B001
KLMAG2GE4A-A001
k4B2G1646
KLMAG
KLM8G2FE3B-B001
K4B2G0446
klm8g
k4x2g323pd
|
PDF
|
APA150 -TQ1001 datasheet
Abstract: ProASICPLUS Flash Family FPGAs v4.0 APA1000 624 CCGA AA23 APA075 APA150 APA300 APA450 APA600
Text: ProASICPLUS Flash Family FPGAs Package Pin Assignments 100-Pin TQFP 1 100 100-Pin TQFP v4.0 2-1 ProASICPLUS Flash Family FPGAs 100-Pin TQFP 100-Pin TQFP 100-Pin TQFP Pin Number APA075 Function APA150 Function Pin Number APA075 Function APA150 Function Pin
|
Original
|
100-Pin
APA075
APA150
APA150 -TQ1001 datasheet
ProASICPLUS Flash Family FPGAs v4.0
APA1000
624 CCGA
AA23
APA075
APA150
APA300
APA450
APA600
|
PDF
|
1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
|
Original
|
60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
|
PDF
|
|
|
729-Pin
Abstract: Axcelerator FPGAs AX125 IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
Text: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at
|
Original
|
180-Pin
AX125
IO32NB3F3
IO59NB5F5
729-Pin
Axcelerator FPGAs
IO126PB3F11
AG18
FBGA 896
896-Pin
Axcelerator Family FPGAs
|
PDF
|
ProASIC PLUS v0.1
Abstract: No abstract text available
Text: v3.5 ProASICPLUS TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 Million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-Based CMOS Process
|
Original
|
|
PDF
|
capacitor 104 m30
Abstract: No abstract text available
Text: v3.5 ProASICPLUS TM Flash Family FPGAs Features and Benefits • • High Capacity I/O • • • • • 75,000 to 1 Million System Gates 27k to 198kbits of Two-Port SRAM 66 to 712 User I/Os Reprogrammable Flash Technology • • • • 0.22µ 4LM Flash-Based CMOS Process
|
Original
|
|
PDF
|
A3PE600L
Abstract: 896-Pin FBGA 896 A3PE3000L A3P1000 IO283PDB7V1 ACTEL FBGA 144 ProASIC3 EL B17 AF29
Text: Military ProASIC3/EL Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .
|
Original
|
208-Pin
A3P1000
IO199PDB3
IO162RSB2
A3PE600L
896-Pin
FBGA 896
A3PE3000L
IO283PDB7V1
ACTEL FBGA 144
ProASIC3
EL B17
AF29
|
PDF
|
RISC-Processor s3c2410
Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd sp0411n K9W8G08U1M sandisk micro SD Card 2GB arm9 s3c2440 K9F1G08U0A K6X8008C2B
Text: A Section MEMORY Table of Contents SECTION A PAGE DRAM SDRAM 3a – 4a DDR SDRAM 5a – 6a DDR2 SDRAM 7a RDRAM 8a NETWORK DRAM 8a MOBILE SDRAM 9a GRAPHICS DDR SDRAM 10a DRAM ORDERING INFORMATION 11a –13a NAND FLASH COMPONENTS, SMART MEDIA, COMPACT FLASH
|
Original
|
BR-04-ALL-005
BR-04-ALL-004
RISC-Processor s3c2410
MR16R1624DF0-CM8
arm9 samsung s3c2440 architecture
chip 3351 dvd
sp0411n
K9W8G08U1M
sandisk micro SD Card 2GB
arm9 s3c2440
K9F1G08U0A
K6X8008C2B
|
PDF
|
PCN0712
Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array
|
Original
|
PCN0712
CEL-9750ZHF10AKL
GE-100LFCS
GE-100LFCS
PCN0712
GE100LFCS
SUMITOMO EME G770
Hitachi CEL-9750ZHF10AKL
nitto GE
sumitomo g770
EME-G770
Nitto GE100LFCS
Nitto GE 100
|
PDF
|
K4X2G323PD8GD8
Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from
|
Original
|
BR-12-ALL-001
K4X2G323PD8GD8
K9HFGY8S5A-HCK0
K4H511638JLCCC
samsung eMMC 5.0
KLMBG4GE2A-A001
K9K8G08U0D-SIB0
K4X51163PK-FGD8
KLMAG2GE4A
k4h561638n-lccc
K4G10325FG-HC03
|
PDF
|
AX125
Abstract: FBGA 896 896-Pin
Text: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View Note For Package Manufacturing and Environmental information, visit Resource center at
|
Original
|
180-Pin
AX125
IO32NB3F3
IO59NB5F5
FBGA 896
896-Pin
|
PDF
|
CCGA
Abstract: 896-Pin 624 CCGA AD 149 AE9 FBGA 63 AX125 FBGA 896
Text: Axcelerator Family FPGAs Package Pin Assignments 180-Pin CSP A1 Ball Pad Corner 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P Figure 3-1 • 180-Pin CSP Bottom View v2.3 3-1 Axcelerator Family FPGAs 180-Pin CSP 180-Pin CSP AX125 Function Pin Number
|
Original
|
180-Pin
AX125
IO32NB3F3
IO59NB5F5
CCGA
896-Pin
624 CCGA
AD 149 AE9
FBGA 63
FBGA 896
|
PDF
|
7214F
Abstract: SDA 9360 VR5ER127214FBS VR5ER287214EBP VR5ER567214FBP vr5er567214e VR5ER127214FBW X2-25 U1-U18
Text: DDR2 PC2-xx00 ECC REGISTERED DIMM VR5Exxx7214xxx Module Configuration V/I Part Number VR5ER287214EBP VR5ER287214EBS VR5ER287214EBW VR5ER287214EBZ VR5ER287214EBY VR5ER567214EBP VR5ER567214EBS VR5ER567214EBW VR5ER567214EBZ VR5ER567214EBY VR5ER567214FBP VR5ER567214FBS
|
Original
|
PC2-xx00
VR5Exxx7214xxx
VR5ER287214EBP
VR5ER287214EBS
VR5ER287214EBW
VR5ER287214EBZ
VR5ER287214EBY
VR5ER567214EBP
VR5ER567214EBS
VR5ER567214EBW
7214F
SDA 9360
VR5ER127214FBS
VR5ER287214EBP
VR5ER567214FBP
vr5er567214e
VR5ER127214FBW
X2-25
U1-U18
|
PDF
|