SMD BOOK
Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK
Text: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD
|
Original
|
P-DIP-40
20B40
P-LCC-28-1
P-LCC-44-1
P-LCC-68
P-LCC-84-2
P-MQFP-44-2
P-MQFP-44-4
P-MQFP-80
P-MQFP-100-2
SMD BOOK
smd 842
SMD Packages
TQFP Package 44 lead
P-MQFP-44-2
P-MQFP-144-1
SMD Devices
smd transistor marking 26
MARKING BOOK
|
PDF
|
huawei microwave Antennas
Abstract: HUAWEi antenna IP clock* huawei Huawei MW Antenna
Text: HUAWEI MG323-B GSM LCC Module Hardware Guide Issue 04 Date 2012-07-02 Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters. Huawei Technologies Co., Ltd.
|
Original
|
MG323-B
huawei microwave Antennas
HUAWEi antenna
IP clock* huawei
Huawei MW Antenna
|
PDF
|
tray 20 x 14
Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type
|
Original
|
E04102
tray 20 x 14
BGA 31 x 31 tray
bga trays
tray bga 17
bga tray
|
PDF
|
CERAMIC CHIP CARRIER LCC 68 socket
Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a
|
Original
|
|
PDF
|
philips diode PH 33J
Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY
Text: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without
|
Original
|
10-BIT
QS3L384)
QS3L2384
QS3L384
QS3L2384
philips diode PH 33J
UM61256FK-15
sem 2106 inverter diagram
IDT7024L70GB
um61256
UM61256ak sram
um61256fk15
HIGH VOLTAGE ISOLATION DZ 2101
C5584
IDT74LVC1G07ADY
|
PDF
|
UM61256FK-15
Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
Text: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch
|
Original
|
74F257,
74FCT257,
74FCT257T
QS32257
QS3257
QS32257
UM61256FK-15
YD 6409
philips diode PH 33J
um61256
um61256ak-15
PZ 5805 PHILIPS
UM6164
KM6264BLS-7
UM61256ak sram
IDT8M624
|
PDF
|
LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
|
Original
|
|
PDF
|
TSOP 56 socket
Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the
|
Original
|
68-Pin
iMC00XFLKA
iNC110XX
TSOP 56 socket
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC LEADLESS CHIP CARRIER
ic packages
QFP 64 Cavity dip
QFP 64 Cavity package
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
80SM
50 mil pitch ceramic package
240817
|
PDF
|
intel packaging
Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than
|
Original
|
CH01WIP
intel packaging
CERAMIC PIN GRID ARRAY CPGA lead frame
CERAMIC CHIP CARRIER LCC 68 socket
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
PLCC 68 intel package dimensions
68 CERAMIC LEADLESS CHIP CARRIER LCC
INTEL CDIP 40 PIN
INTEL PLCC 68 dimensions tape
tsop Shipping Trays
QFP Shipping Trays
|
PDF
|
5962-9076502MFA
Abstract: DS96F174 96F174
Text: DS96F172M/DS96F174C/DS96F174M EIA-485/EIA-422 Quad Differential Drivers General Description Features The DS96F172 and the DS96F174 are high speed quad differential line drivers designed to meet EIA-485 Standards. The DS96F172 and the DS96F174 offer improved performance due to the use of L-FAST bipolar technology. The use
|
Original
|
DS96F172M/DS96F174C/DS96F174M
EIA-485/EIA-422
DS96F172
DS96F174
EIA-485
5962-9076502MFA
96F174
|
PDF
|
LM324 PINOUT DIAGRAM
Abstract: LM124j
Text: LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers General Description Advantages The LM124 series consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single
|
Original
|
LM124/LM224/LM324/LM2902
LM124
30-Nov-2000
6-Dec-2000]
0209/5962R9950401VDA
LM324 PINOUT DIAGRAM
LM124j
|
PDF
|
LED Lamp Driver circuit diagrams
Abstract: LM324 ic LM224 spice model DS009299-2 tube 0B2 5962R9950401QCA RETS124X
Text: LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers General Description Advantages The LM124 series consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single
|
Original
|
LM124/LM224/LM324/LM2902
LM124
30-Nov-2000
6-Dec-2000]
0209/5962R9950401QCA
LED Lamp Driver circuit diagrams
LM324 ic
LM224 spice model
DS009299-2
tube 0B2
5962R9950401QCA
RETS124X
|
PDF
|
Untitled
Abstract: No abstract text available
Text: LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers General Description Advantages The LM124 series consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single
|
Original
|
LM124/LM224/LM324/LM2902
LM124
30-Nov-2000
6-Dec-2000]
0209/5962R9950401VCA
|
PDF
|
Motorola SMD code
Abstract: PSB21525-N
Text: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672
|
OCR Scan
|
P-LCC-44-1
P-MQFP-44-2,
P-TQFP-64-1
Q67100-H6672
Q67100-H6671
Q67101-H6733
P-LCC-44-1
P-MQFP-44-2
P-TQFP-64-1
FP-64-1
Motorola SMD code
PSB21525-N
|
PDF
|
|
|
d021
Abstract: No abstract text available
Text: KA3032 CDP PRODUCTS 5-CH MOTOR DRIVER 48QFP-1010E The KA3032 is a m onolithic integrated circuit suitable for a 5-ch m otor d river w hich drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray m otor of the CDP system . FEATURES
|
OCR Scan
|
KA3032
48QFP-1010E
KA3032
d021
|
PDF
|
74 CDP
Abstract: 1010E KA3032 KSB772
Text: KA3032 CDP PRODUCTS 5-CH MOTOR DRIVER 48QFP-1010E The KA3032 is a m onolithic integrated circuit suitable for a 5-ch m otor d river w hich drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray m otor of the CDP system . FEATURES
|
OCR Scan
|
KA3032
KA3032
48QFP-1010E
48-QFP-1010E
74 CDP
1010E
KSB772
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SIEM EN S Device Specifications C501 10 Device Specifications 10.1 Absolute Maximum Ratings Ambient temperature under bias TA . - 40 to 85 °C Storage temperature (rstg) .- 65 °C to 150 °C
|
OCR Scan
|
P-LCC-44
8235b05
P-MQFP-44
C501G-L
C501G-1R
GPM05Ã
A235bD5
|
PDF
|
1R40
Abstract: C501
Text: Device Specifications SIEM EN S Absolute Maximum Ratings Ambient temperature under bias f A . Storage temperature ( r ST). - 40 to + 85 ‘C - 6 5 to + 150 'C Voltage on Vcc pins with respect to ground (Vss)
|
OCR Scan
|
condi44X
P-MQFP-44
C501G-L
C501G-1R
fl23SbOS
00fi2M4fc.
1R40
C501
|
PDF
|
KA3031
Abstract: KSB772 transistor d032
Text: CDP PRODUCTS KA3031 6-CH MOTOR DRIVER The KA3031 is a monolithic integrated circuit suitable for a 6-ch motor driver which drives the tracking actuator, focus actuator, sled motor, tray motor, change motor and spindle motor of the CDP/CAR-CD systems. FEATURES
|
OCR Scan
|
KA3031
KA3031
48-QFPH-1414
KSB772
transistor d032
|
PDF
|
CP-52
Abstract: No abstract text available
Text: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CCI Circuit Components Inc. MicroiQ 3500SM Decoupling Capacitors Micro/Q 3500SM decoupling capacitors are specifically designed to be surface mounted under plastic leaded chip carrier PLCC packages. By residing under the PLCC/LCC, Micro/Q 3500SM capacitors increase board density by eliminating the
|
OCR Scan
|
3500SM
3500SM
|
PDF
|
TL8023
Abstract: ICL8023
Text: IR" . . :9S2 TL 8023 Triple OP AMP GENERAL DESCRIPTION FEATURES The TL 8023 includes three internally compen sated low power operational amplifiers in a sin gle 16 pin package. • Replaces ICL8023 ■ Low noise ■ Input current relatively independent of tem
|
OCR Scan
|
|
PDF
|
TL103
Abstract: LM103 packages case to 18
Text: MAR % C ]9§2 TL103 Voltage Reference GENERAL DESCRIPTION FEATURES The TL 103 is a precision monolithic two-terminal fixed voltage reference. The TL 103 comes in volt ages ranging from 4.0V to 5.6V. It is available in a variety of standard packages and in die form.
|
OCR Scan
|
TL103
LM103
TL103
LM103
packages case to 18
|
PDF
|
fairchild 45g
Abstract: No abstract text available
Text: CDP PRODUCTS KA3031 6-CH MOTOR DRIVER The KA3031 is a m onolithic integrated circuit suitable for a 6-ch m otor d river w hich drives the tracking actuator, focus actuator, sled m otor, tray motor, change m otor and spindle m otor of the C D P /C A R -C D system s.
|
OCR Scan
|
KA3031
KA3031
fairchild 45g
|
PDF
|
