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    PACKAGE 559 Search Results

    PACKAGE 559 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE 559 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data MC145170-2/D Rev. 5, 1/2005 MC145170-2 Package Information P Suffix SOG Package Case 648 MC145170-2 PLL Frequency Synthesizer with Serial Interface SCALE 2:1 Package Information D Suffix Plastic DIP Package Case 751B


    Original     		PDF MC145170-2/D MC145170-2 MC145170P2 MC145170D2 SOG-16 TSSOP-16 MC145170-2 MC145170-1.

    AN1207

    Abstract: AN1671/d 948C MC145170-1 MC145170-2 MC145170D2 MC145170DT2 MC145170P2 TSSOP-16 SOG-16
    Text: Freescale Semiconductor Technical Data MC145170-2/D Rev. 5, 1/2005 MC145170-2 Package Information P Suffix SOG Package Case 648 MC145170-2 PLL Frequency Synthesizer with Serial Interface SCALE 2:1 Package Information D Suffix Plastic DIP Package Case 751B


    Original     		PDF MC145170-2/D MC145170-2 MC145170-2 MC145170-1. AN1207 AN1671/d 948C MC145170-1 MC145170D2 MC145170DT2 MC145170P2 TSSOP-16 SOG-16

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    F3000

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 30 PIN PLASTIC To Top / Package Lineup / Package Index FPT-30P-M01 30-pin plastic SOP Lead pitch 0.80 mm Package width 14.00 mm Lead shape Gullwing Sealing method Plastic mold FPT-30P-M01 30-pin plastic SOP


    Original     		PDF FPT-30P-M01 30-pin FPT-30P-M01) F30002S-4C-4 F3000

    atmel 518

    Abstract: CERAMIC LEADLESS CHIP CARRIER quad flat j-leaded package 0502a J-Lead, plcc MS-011-AC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20P3 40D6 MS-001
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP) .7-4


    Original     		PDF

    20P3

    Abstract: MS-001 MS-011 MS-016 MS-018
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).7-4


    Original     		PDF 28-Lead, 20-Lead, 20P3 MS-001 MS-011 MS-016 MS-018

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package 2 D PAK Package Weight mg 1700 Product Group Type No. SB820D –SB8200D SB820DC –SB8200DC SB1020D –SB10200D SB1020DC –SB10200DC SB1620D –SB16200D SB1620DC –SB16200DC


    Original     		PDF SB820D SB8200D SB820DC SB8200DC SB1020D SB10200D SB1020DC SB10200DC SB1620D SB16200D

    MIL-STD-1835

    Abstract: 20P3 40D6 MS-011 MS-018
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).8-4


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBPM Package Weight mg 1700 Product Group Type No. KBP005M – KBP10M KBP150G – KBP1510G 2KBP005M – 2KBP10M KBP200G – KBP2010G Component Die Doped Silicon* Die Attach


    Original     		PDF KBP005M KBP10M KBP150G KBP1510G 2KBP005M 2KBP10M KBP200G KBP2010G 2011/65/EU.

    98ARL10519D

    Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
    Text: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


    Original     		PDF AN2409 98ARL10519D JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8

    MC144111P

    Abstract: MC144110-MC144111 MC144111DW MC144111 MC144110 MC144110DW MC144110P
    Text: Freescale Semiconductor Technical Data MC144110/D Rev. 2, 1/2005 MC144110 MC144110 and MC144111 Package Information P Suffix Plastic DIP Case 707 Package Information DW Suffix SOG Package Case 751D MC144111 Digital-to-Analog Converters with Serial Interface


    Original     		PDF MC144110/D MC144110 MC144110 MC144111 MC144111 MC144111P MC144110-MC144111 MC144111DW MC144110DW MC144110P

    JEDEC JESD51-8 BGA

    Abstract: JESD51-8 jesd51 8 JESD51-5 G38-87 800E-02 JESD51-7 JEDEC JESD51-8 QFN PACKAGE thermal resistance AN2388
    Text: Freescale Semiconductor Application Note AN2388 Rev. 1.0, 12/2005 Heatsink Small Outline Package HSOP 1.0 Purpose This document is intended to provide information on Heatsink Small Outline Package (HSOP) and it’s process. The package related information includes:


    Original     		PDF AN2388 JEDEC JESD51-8 BGA JESD51-8 jesd51 8 JESD51-5 G38-87 800E-02 JESD51-7 JEDEC JESD51-8 QFN PACKAGE thermal resistance AN2388

    MC144110P

    Abstract: MC144111P MC144111
    Text: Freescale Semiconductor Technical Data MC144110/D Rev. 2, 1/2005 MC144110 MC144110 and MC144111 Package Information P Suffix Plastic DIP Case 707 Package Information DW Suffix SOG Package Case 751D MC144111 Digital-to-Analog Converters with Serial Interface


    Original     		PDF MC144110/D MC144110 MC144110 MC144111 MC144111 MC144110P MC144111P

    coin operated battery charger

    Abstract: CEA-936-A GSM modem M10 MAPBGA-247 MC13783 spi CONTROLLED KEYPAD SCAN IC 4513 display driver K3LV
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC13783 Rev. 3.5, 7/2009 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management


    Original     		PDF MC13783 MC13783 MAPBGA-247 coin operated battery charger CEA-936-A GSM modem M10 MAPBGA-247 spi CONTROLLED KEYPAD SCAN IC 4513 display driver K3LV

    K9LBG08U0M

    Abstract: K9LAG08u0m k9lbg08 K9LBG IMx32 "NAND Flash" k9f2g08 K9LAG08 mx372 K9LAG08U
    Text: i.MX Platform PDK 1.4 Advanced Toolkit ATK Standard Package Release Notes This document contains important information about the package contents, supported features, and known issues/limitations for this release. Contents 1 2 3 4 Standard Release Package Contents.2


    Original     		PDF

    CEA-936-A

    Abstract: CEA-936 Todai Electric RS232 bus audio signal switcher body marking MCL coin operated battery charger GSM modem M10 handset charger circuit diagram M5 DIODE 22-35
    Text: Freescale Semiconductor Technical Data Document Number: MC13783/D Rev. 3.4, 3/2007 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management


    Original     		PDF MC13783/D MC13783 MC13783 MAPBGA-247 CEA-936-A CEA-936 Todai Electric RS232 bus audio signal switcher body marking MCL coin operated battery charger GSM modem M10 handset charger circuit diagram M5 DIODE 22-35

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MC13783/D Rev. 3.4, 3/2007 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management


    Original     		PDF MC13783/D MC13783 MAPBGA-247 MC13783

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package KBP Package Weight mg 1700 Product Group Type No. KBP150 – KBP1510 KBP200 – KBP2010 Component Material Doped Silicon* Die Attach Solder Alloy Copper Alloy Plating Matte Tin


    Original     		PDF KBP150 KBP1510 KBP200 KBP2010 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC13783 Rev. 3.5, 7/2009 MC13783 Package Information Plastic Package 10 x 10 mm package MC13783 Power Management and Audio Circuit 1 Introduction The MC13783 is a highly integrated power management


    Original     		PDF MC13783 MC13783 MAPBGA-247

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    mc13718

    Abstract: Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR MC13717 Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight
    Text: Freescale Semiconductor Advance Information MC13790/D Rev. 1.1, 11/2004 MC13790 Package Information QFN Package Case 1506-01 QFN–76 MC13790 Ordering Information Integrated Power Management IC Device Operating Temperature Range Package MC13790 TA = –20°C to 70°C


    Original     		PDF MC13790/D MC13790 MC13790 MC13717 MC13790application, MC13790/D mc13718 Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight

    MO-142

    Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,


    Original     		PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide

    DB2211

    Abstract: S5591 S5590-01
    Text: HAMAMATSU TWO-DIMENSIONAL PSDs S5990-01, S5991 -01 Surface mount type PSDs pin-cushion types FEATURES •Large active area 55990-01: 4 x 4 mm 55991-01: 9 x 9 mm •C h ip carrier package for surface mounting (automatic mounting with solder reflow) thin package: 1.26 mmt


    OCR Scan     		PDF S5990-01, S5991 S5990, S5991) D-B2211 91882MassyCedex, MiddlesexEN27JA, gen12 SE-17141 20020Arese DB2211 S5591 S5590-01