JESD51-2
Abstract: JESD-51 JESD51-9 JESD51-6 G30-88 JESD51-3 JESD51 thermal resistance jesd51 6 SAMSUNG TSOP
Text: Thermal Characteristics Information 1 Samsung Proprietary • Definition of Thermal Resistance ○ In general, thermal performance of electronic package is represented by two kinds of thermal resistance,θja and θjc. ○ Heat dissipation path in a package and the equivalent thermal resistance
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JESD51-2
JESD51-6
G30-88
JESD51-3/7
JESD51-9
JESD51-2
JESD-51
JESD51-9
JESD51-6
G30-88
JESD51-3
JESD51
thermal resistance
jesd51 6
SAMSUNG TSOP
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FG676
Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
TQ100
TQ128
TQ144
TQ176
VQ100
FG676
PCB footprint cqfp 132
741 smd ic
cb228 footprint
PCB footprint cqfp 100
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Untitled
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
BF957
BG225
BG256
BG352
BG432
BG492
BG560
BG575
BG728
MS-034-AAn-1
ak 957
MS-034 1152 BGA
BGA 31 x 31 mm
MO-047
MS026-ACD
MO-113-AA-AD
MS-034-AAU-1
MO-151 AAL-1
OPD0002
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EIA-556-A
Abstract: xilinx packaging label polystyrene EIA-556A
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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equipmQ100
TQ144
VQ100
EIA-556-A
xilinx packaging label
polystyrene
EIA-556A
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ipc-sm-786A
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
J-STD-020
ipc-sm-786A
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EFTEC-64
Abstract: OPQ0014
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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HQ160
HQ208
HQ240
HQ304
MO-108DDI
OPQ0021
143-FA
OPQ0020
MO-143-GA
EFTEC-64
OPQ0014
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reflow soldering profile BGA
Abstract: FC-5312
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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FC5312
reflow soldering profile BGA
FC-5312
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Untitled
Abstract: No abstract text available
Text: R Q1-2002 DataSource CD-ROM More Information Packages and Thermal Characteristics Packages and Thermal Characteristics Package Drawings Table of Contents Links to individual package drawings Testing, Quality Assurance, and Reliability Quality Assurance and Reliability
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Q1-2002
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hot wire anemometer
Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
Text: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance
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"Audio Power Amplifiers"
Abstract: darlington transistor for audio power application Germanium Power Diodes thermal resistance TO metal package aluminum kovar darlington power transistor power led heat sink
Text: PACKAGE INFORMATION THERMAL DESIGN FOR PLASTIC ICs THERMAL DESIGN FOR PLASTIC INTEGRATED CIRCUITS Proper thermal design is essential for reliable operation of many electronic circuits. Under severe thermal stress, leakage currents increase, materials decompose, and components drift in value or fail.
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AUGAT DIP SOCKETS
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not
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AUGAT DIP SOCKETS
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shim
Abstract: CR-15 gold embrittlement
Text: CR-15 Package Handling and Mounting Procedure Introduction Mounting Cavity Design The CR-15 is a high frequency, low thermal resistance package, which should be given special attention during cavity design and package mounting, to insure proper electrical and thermal performance.
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CR-15
shim
gold embrittlement
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Untitled
Abstract: No abstract text available
Text: PACKAGE INFORMATION THERMAL DESIGN FOR PLASTIC INTEGRATED CIRCUITS Proper thermal design is essential for reliable operation of many electronic circuits. Under severe thermal stress, leakage currents increase, materials decompose, and components drift in value or fail.
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T03A
Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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transistor BC 458
Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and
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INTEL740
Abstract: GPI04 md44 MD56 MD57 AB22-AB23 AB24-AB25
Text: Electrical, Pinout, and Package Information intei Electrical, Pinout, and Package Information This chapter contains Intel740 graphics accelerator absolute maximum ratings, thermal characteristics, and DC characteristics. Pinout and package information are also provided.
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Intel740â
INTEL740
GPI04
md44
MD56
MD57
AB22-AB23
AB24-AB25
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UCSP
Abstract: APP3924 MAX9701 MAX9705 MAX9712 MAX9716 MAX9717 MAX9718 MAX9719
Text: Maxim > App Notes > AUDIO CIRCUITS Keywords: UCSP, Output Power, Thermal Limit, Thermal Shutdown, audio, amplifier Oct 15, 2007 APPLICATION NOTE 3924 Thermal Considerations for a UCSP Package Abstract: The amount of power that an audio amplifier will dissipate is primarily limited by its package and
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MAX9701:
MAX9705:
MAX9712:
MAX9716:
MAX9717:
MAX9718:
MAX9719:
MAX9773:
AN3924,
APP3924,
UCSP
APP3924
MAX9701
MAX9705
MAX9712
MAX9716
MAX9717
MAX9718
MAX9719
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ASYNC SRAM
Abstract: CY7C1020 CY7C1021 CY7C1021B CY7C1049 CY7C1049B CY7C109 CY7C109B CY7C185 CY7C199
Text: Thermal Characteristics of SRAMs Introduction This application note introduces thermal characteristics of SRAMs and also provides the thermal values for most of the current SRAMs shipped by Cypress Semiconductor. Thermal resistance is a measure of the ability of a package
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SZZA003
Abstract: thermal resistance of low power semiconductor
Text: Package Thermal Characterization Methodologies Application Report 1999 Printed in U.S.A 0399 SZZA003 Package Thermal Characterization Methodologies SZZA003 March 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products
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SZZA003
MIL-STD-883
SCAA022A
SZZA003
thermal resistance of low power semiconductor
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ocs4
Abstract: No abstract text available
Text: M80C186EB PACKAGE INFORMATION This section describes the pins, pinouts, and thermal characteristics for the M80C186EB PGA package. For complete package specifications and informa tion, see the Intel Packaging Outlines and Dimen sions Guide Order Number: 231369 .
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M80C186EB
M80C186EB
M80C186EB.
ocs4
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Untitled
Abstract: No abstract text available
Text: Ecliptek Thermal Resistance - Frequently Asked Questions Rev A 1. What is the definition of 'thermal resistance' of an oscillator package? Thermal resistance is defined as the temperature difference that occurs between the semiconductor element within the package and the package's surface or ambient atmosphere when the device consumes 1 watt [W] of
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TEN10-000-012
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BGA reflow guide
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives
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XAPP415
J-STD-020
BGA reflow guide
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"exposed pad" PCB via
Abstract: No abstract text available
Text: Application Note, Rev. 1.0, November 2008 Thermal Evaluation: Comparison of Standard and Exposed Pad DSO Package Example of SPOC Devices BTS5682E, BTS5672E, BTS5662E Automotive Division by U. Fröhler H. Hopfgartner M. Walder Thermal Evaluation: Standard vs. Exposed Pad DSO Package
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BTS5682E,
BTS5672E,
BTS5662E
"exposed pad" PCB via
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