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    PACKAGING DIAGRAMS Search Results

    PACKAGING DIAGRAMS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGING DIAGRAMS Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Packaging Diagrams Microchip Technology Packaging - Outlines and Parameters Original PDF

    PACKAGING DIAGRAMS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    sm58a

    Abstract: DO215AA EIA 481-C RGP10E DO-221
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel


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    DO-214AA /DO-215AA DO-218AB DO-218AB, 481-C 08-Aug-12 sm58a DO215AA EIA 481-C RGP10E DO-221 PDF

    Untitled

    Abstract: No abstract text available
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PREFERRED PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel


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    DO-214AA /DO-215AA DO-218AB DO-218AB, 481-C 02-Mar-15 PDF

    EIAJ-ETX-7001

    Abstract: TE-17 RB731XN T106 T108 T110 T116 T146 T148 RoHM TE25 tape reel
    Text: Packaging specifications Diodes Packaging specifications surface mounting type zTaping Code Taping Code Package Package Specification Packaging Style, Direction T2R T2R T2L TE61 TL VMN2 VMD2 VMD3 EMD2 EMD3 EMD4 EMD5 TEMD5 EMD6 Embossed tape Embossed tape


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    00ipment EIAJ-ETX-7001 TE-17 RB731XN T106 T108 T110 T116 T146 T148 RoHM TE25 tape reel PDF

    EIAJ-ETX-7001

    Abstract: T106 T108 T110 T116 T146 T148 TE-17 RoHM TE25 tape reel
    Text: Packaging specifications Diodes Packaging specifications surface mounting type zTaping Code Ordering Unit (pcs/reel) Taping Code Package Package Specification Packaging Style, Direction T2R T2R T2R T2L TE61 TL GMD2 VMN2 VMD2 VMD3 EMD2 EMD3 EMD4 EMD5 TEMD5


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    PDF

    intel packaging handbook 240800

    Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
    Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and


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    CH08WIP intel packaging handbook 240800 Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging PDF

    Untitled

    Abstract: No abstract text available
    Text: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 52, 52T P 2D P 2E 2M 2N 53 54 P 5A, 5AT P 5B, 5BT P 5CA P 57, 57T P 6A P 6B P 9A, 9AT P 61, 61T


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    DO-214AA /DO-215AA DO-218AB 481-C 18-Mar-14 PDF

    sm58a

    Abstract: GL348 PKG65 tvs, DO214 PKG56 TVS SMA CM RGP10E DO-214 SMA ea DO-213AA DO-214BA
    Text: Packaging Information Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PACKAGE CODE PREFERRED PACKAGE CODE 51 52, 52T 2A 2C 2D 2E 2G 2KA 2M 53 54 4E 4F 4G 4H 55 5A, 5AT 5B, 5BT 5CA 56 57T 58 59 9AT 9C 60 61, 61T 62 63


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    06-Oct-09 DO-214/215AA DO-218AB ano30 481-C sm58a GL348 PKG65 tvs, DO214 PKG56 TVS SMA CM RGP10E DO-214 SMA ea DO-213AA DO-214BA PDF

    MMST4401

    Abstract: MMST4403 SST4401 SST4403 T116 T146
    Text: SST4401 / MMST4401 Transistors NPN Medium Power Transistor Switching SST4401 / MMST4401 zDimensions (Unit : mm) zFeatures 1) BVCEO>40V (IC=1mA) 2) Complements the SST4403 / MMST4403. SST4401 zPackage, marking, and packaging specifications Part No. Packaging type


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    SST4401 MMST4401 SST4403 MMST4403. SST4401 MMST4401 MMST4403 T116 T146 PDF

    Untitled

    Abstract: No abstract text available
    Text: SST4401 / MMST4401 Transistors NPN Medium Power Transistor Switching SST4401 / MMST4401 zDimensions (Unit : mm) zFeatures 1) BVCEO>40V (IC=1mA) 2) Complements the SST4403 / MMST4403. SST4401 zPackage, marking, and packaging specifications Part No. Packaging type


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    SST4401 MMST4401 SST4403 MMST4403. SST4401 MMST4401 PDF

    Untitled

    Abstract: No abstract text available
    Text: SSTA06 / MMSTA06 Transistors NPN General Purpose Transistor SSTA06 / MMSTA06 zDimensions Unit : mm zFeatures 1) BVCEO < 80V ( IC=1mA) 2) Complements the SSTA56 / MMSTA56. SSTA06 zPackage, marking and packaging specifications Part No. SSTA06 MMSTA06 Packaging type


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    SSTA06 MMSTA06 SSTA56 MMSTA56. SSTA06 PDF

    part r1G

    Abstract: MMSTA06 MMSTA56 SSTA06 SSTA56 T116 T146
    Text: SSTA06 / MMSTA06 Transistors NPN General Purpose Transistor SSTA06 / MMSTA06 zDimensions Unit : mm zFeatures 1) BVCEO < 80V ( IC=1mA) 2) Complements the SSTA56 / MMSTA56. SSTA06 zPackage, marking and packaging specifications Part No. SSTA06 MMSTA06 Packaging type


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    SSTA06 MMSTA06 SSTA56 MMSTA56. SSTA06 part r1G MMSTA06 MMSTA56 T116 T146 PDF

    UMT222A

    Abstract: TRANSISTOR 1P transistors marking 1p BC847B BC857B MMST2222A PN2222A T116 B128D MARKING 5D NPN
    Text: BC847B Transistors NPN General Purpose Transistor BC847B zExternal dimensions Unit : mm zFeatures 1) BVCEO < 45V (IC=1mA) 2) Complements the BC857B. 2.9±0.2 0.95 +0.2 −0.1 1.9±0.2 zPackage, marking, and Packaging specifications Packaging type SST3 Marking


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    BC847B BC857B. UMT222A TRANSISTOR 1P transistors marking 1p BC847B BC857B MMST2222A PN2222A T116 B128D MARKING 5D NPN PDF

    Untitled

    Abstract: No abstract text available
    Text: BC847B Transistors NPN General Purpose Transistor BC847B zExternal dimensions Unit : mm zFeatures 1) BVCEO < 45V (IC=1mA) 2) Complements the BC857B. 2.9±0.2 0.95 +0.2 −0.1 1.9±0.2 zPackage, marking, and Packaging specifications Packaging type SST3 Marking


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    BC847B BC857B. BC847B PDF

    Untitled

    Abstract: No abstract text available
    Text: CBS05F30 Schottky Barrier Diode Silicon Epitaxial CBS05F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.38 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode


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    CBS05F30 PDF

    Untitled

    Abstract: No abstract text available
    Text: CBS10S40 Schottky Barrier Diode Silicon Epitaxial CBS10S40 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(2) = 0.48 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode


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    CBS10S40 PDF

    Untitled

    Abstract: No abstract text available
    Text: CBS05F30 Schottky Barrier Diode Silicon Epitaxial CBS05F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.38 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode


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    CBS05F30 PDF

    Untitled

    Abstract: No abstract text available
    Text: CBS10S40 Schottky Barrier Diode Silicon Epitaxial CBS10S40 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(2) = 0.48 V (typ.) (2) Thin and compact packaging: Height = 0.40mm(max) 3. Packaging and Internal Circuit 1: Cathode


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    CBS10S40 PDF

    carrier chiller

    Abstract: BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook
    Text: CASERM/D Rev. 0, Sep-2000 Semiconductor Packaging and Case Outlines ON Semiconductor Reference Manual and Design Guide Semiconductor Packaging and Case Outlines Reference Manual and Design Guide CASERM/D Rev. 0, Sep–2000  SCILLC, 2000 “All Rights Reserved’’


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    Sep-2000 r14525 carrier chiller BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook PDF

    68L SOT 353

    Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
    Text: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58


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    DS00049R-page 68L SOT 353 tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm PDF

    Untitled

    Abstract: No abstract text available
    Text: 27C512A 512K 64K x 8 CMOS EPROM TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for


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    27C512A DS11173D-page PDF

    200B

    Abstract: 27C512-12 27C512-15 27C512A
    Text: 27C512A 512K 64K x 8 CMOS EPROM PACKAGE TYPES TSOP 27C512A A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC, VSOP, TSOP or SOIC packaging is available. Tape or reel packaging is also available for


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    27C512A DS11173E-page 200B 27C512-12 27C512-15 27C512A PDF

    Motorola MPC556

    Abstract: mpc556 MPC555 AN-485-1 AAN52
    Text: SECTION 2 SIGNAL DESCRIPTIONS 2.1 Packaging and Pinout Descriptions Figure 2-1 gives the case configuration and packaging information for the MPC555 / MPC556. Figure 2-2 gives the MPC555 / MPC556 pinout data. Table 2-1 gives an overview of the pins on the MPC555 / MPC556.


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    MPC555 MPC556. MPC556 MPC556 Motorola MPC556 AN-485-1 AAN52 PDF

    MPC555

    Abstract: MPC556
    Text: SECTION 2 SIGNAL DESCRIPTIONS 2.1 Packaging and Pinout Descriptions Figure 2-1 gives the case configuration and packaging information for the MPC555 / MPC556. Figure 2-2 gives the MPC555 / MPC556 pinout data. Table 2-1 gives an overview of the pins on the MPC555 / MPC556.


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    MPC555 MPC556. MPC556 MPC556 PDF

    SMR5010C-E

    Abstract: SMR5016C-E SMR5016C Fujisoku Corporation Fujisoku 16 position rotary switch fujisoku CI 7478 SMR5010C SMR5000 rotary coded switch
    Text: FUJISOKU CORPORATION 1/ 10 SPECIFICATIONS ROTARY CODED SWITCH SMR5000 1 . GENERAL SPECIFICATIONS 1 Part number designation S M R 5 1 0 C — E Forni of packaging Blank : Tray packaging E : Taping (Reel) Number of steps_ 10 : 10 steps 16 : 16 steps


    OCR Scan
    SMR5000 SMR5010C-E SMR5110C-E SMR5016C-E SMR5116C-E 500pcs SMR50I0C SMR5110C SMR5G16C SMR5116C SMR5016C Fujisoku Corporation Fujisoku 16 position rotary switch fujisoku CI 7478 SMR5010C SMR5000 rotary coded switch PDF