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    PAD DIMENSION Search Results

    PAD DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    V36BEZ02307000T Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version Visit Amphenol Communications Solutions
    NDHN3B7 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating Visit Amphenol Communications Solutions
    NDHN3B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    NDHN6B2 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating Visit Amphenol Communications Solutions
    MSPEP6P22A0 Amphenol Communications Solutions SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.138in to 0.252in, 3 Grommets Visit Amphenol Communications Solutions

    PAD DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: C18 Pad 1 Bonding Pad 4 Pls 16 [0.406] 14 [0.356] SQ. 1 [0.025] Bond only on crosshatched area Pad 2 Pad 3 Pad 4 6 [0.152] 4 [0.102] Back Contact Dimensions in mils [mm] Give us a call at 888-641-SEMI 7364 web: http://www.aeroflex.com/metelics, email: metelics-sales@aeroflex.com


    Original     		PDF 888-641-SEMI

    USE8530DT23SLF

    Abstract: uselectronics
    Text: U.S.Electronics Inc. USE8530DT23SLF Magnetic Transducer DIMENSIONS Dummy Pad 8.70 6.60 3.00 4-1.05 8.50 3.25 2.75 Polarity Pad - 1.20 8.50 Polarity pad (+) 3.50 0.80 Sound Emmision Hole 1.20 PAD LAYOUT 1.70 6.20 1.70 3.10 ELECTRICAL SPECIFICATIONS Model NO


    Original     		PDF USE8530DT23SLF USE-8530DT23SLF USE8530DT23SLF uselectronics

    QSMO-4610

    Abstract: QSMO-4620
    Text: SURFACE MOUNT CRYSTAL CLOCK OSCILLATOR QSMO - 4600 SERIES Hy-Q International 5.0 4 CARRIER TAPE AND REEL DIMENSIONS 0.95 1.0 2.54 3 13.5 2.0 TYP. 3.2 1.5 MARKING 2.0 2.0 1 2 Ø21 1.0 PAD CONNECTIONS PAD 1: E/D PAD 2: Vss PAD 3: OUT PAD 4: VDD 120.0˚ 1.4 Ø80


    Original     		PDF 10mSec. QSMO-4610 QSMO-4620

    hy-q

    Abstract: No abstract text available
    Text: SURFACE MOUNT CRYSTAL OSCILLATOR QSMO - 4700 Hy-Q International CARRIER TAPE AND REEL DIMENSIONS 3.2 1.2 1.2 3 4 2 1 MARKING 2.5 9.0 2.0 TYP. 2.0 0.7 2.0 Ø21 1.3 0.4 PAD CONNECTIONS PAD 1: E/D PAD 2: Vss 1.3 120.0˚ 1.3 Ø80 Ø180 1.3 PAD 3: OUT PAD 4: VDD


    Original     		PDF 100ppm 10mSec. hy-q

    USEDST-16C3S

    Abstract: USE-DST-16C3
    Text: U.S.Electronics Inc. USEDST-16C3S Magnetic Transducer DIMENSIONS Dummy Pad 8.80 6.60 1.80 4-1.10 4-0.80 0.53 1.0 6.5 10.0 3.25 3.25 2.5 Polarity Pad - 1.20 8.50 Polarity pad (+) 3.0 0.40 Sound Emmision Hole 0.87 PAD LAYOUT 1.70 4.80 ELECTRICAL SPECIFICATIONS


    Original     		PDF USEDST-16C3S 314-423-75503S USEDST-16C3S USE-DST-16C3

    USEDST-16C3S-ALF

    Abstract: No abstract text available
    Text: U.S.Electronics Inc. USEDST-16C3S-ALF Magnetic Transducer DIMENSIONS Dummy Pad 8.80 6.60 0.53 4-0.80 1.80 4-1.10 6.5 10.0 1.0 2.5 Polarity Pad - 1.20 8.50 Polarity pad (+) 0.40 3.0 Sound Emmision Hole 0.87 PAD LAYOUT 1.70 5.80 ELECTRICAL SPECIFICATIONS


    Original     		PDF USEDST-16C3S-ALF USEDST-16C3S USEDST-16C3S-ALF

    J412

    Abstract: TELEDYNE RELAYS j412 j422d J412D J411T ER422DD ER412DD ER134 J116C J422
    Text: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®


    Original     		PDF ER411T ER412, ER412D, ER412DD 712TN, RF300, RF310, RF320 ER420, ER422D, J412 TELEDYNE RELAYS j412 j422d J412D J411T ER422DD ER134 J116C J422

    J412

    Abstract: ER432T J412D j422d ER412T ER134D er411d j412dd J114D J134
    Text: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®


    Original     		PDF ER411T ER412, ER412D, ER412DD 712TN, RF300, RF310, RF320 ER420, ER422D, J412 ER432T J412D j422d ER412T ER134D er411d j412dd J114D J134

    13,56 MHz RFID antenna

    Abstract: RFID power supply mini laptop 13.56 MHz RFID tag rfid 13.56 MHz RFID specifications RFID Tracking Pad how to design 13.56 MHz RFID tag mini usb RFID interface
    Text: Mini RFID Tracking Pad 3M Mini RFID Tracking Pad The 3M Mini RFID Tracking Pad is the latest RFID Tracking Pad from 3M. Designed ™ for compatibility, the mini tracking pad will work with systems that already have a 3M tracking pad. With enhanced aesthetics, the new mini tracking pad looks great


    Original     		PDF 200mW 225-4N-14 13,56 MHz RFID antenna RFID power supply mini laptop 13.56 MHz RFID tag rfid 13.56 MHz RFID specifications RFID Tracking Pad how to design 13.56 MHz RFID tag mini usb RFID interface

    ADN2845

    Abstract: 18-PAD
    Text: a 18-Pad Bare Die Dimensions shown in micrometers and millimeters 1 ADN2845 PAD PITCH: 200␮m DIE SIZE: 1140␮m ؎20␮m ؋ 1340␮m (؎20␮m) DIE THICKNESS: 0.25mm SINGLE PAD SIZE: 92␮m ؋ 92␮m DOUBLE PAD SIZE: 151␮m ؋ 92␮m 1140␮m (؎20␮m)


    Original     		PDF 18-Pad ADN2845 1140m 1340m ADN2845

    16.8Mhz oscillator

    Abstract: "Crystal Oscillator" 4mhz CRYSTAL 8MHZ
    Text: Hy-Q International 7.0 1.0 1.7 4 5.0 VOLTAGE CONTROLLED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR VCTCXO QSMO - 5100 3 3 2 1.2 4 MARKING 1 6.0 2 1 2.54 0.8 1.5 SUGGESTED PAD LAYOUT PAD CONNECTIONS PAD 1: Vcontrol PAD 3: OUTPUT PAD 2: GROUND PAD 4: VCC Ø1.5 TYP.


    Original     		PDF 13MHz, 20MHz //10pF 15ppm 16.8Mhz oscillator "Crystal Oscillator" 4mhz CRYSTAL 8MHZ

    MRGF

    Abstract: LP73 UR73D LA73 LT73 NT73 RF73 RK73 RN73 SG73
    Text: Appendix E pad dimensions standard soldering pad dimensions The optimum soldering pad dimensions may differ depending on soldering conditions, however, the following land dimensions are generally recommended. WK73 RK73 SG73 RN73 RN73H SR73 LT73 NT73 PT72 LA73


    Original     		PDF RN73H SDT73 MRGF LP73 UR73D LA73 LT73 NT73 RF73 RK73 RN73 SG73

    4510

    Abstract: HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540
    Text: SURFACE MOUNT CLOCK OSCILLATOR QSMO - 4500 Hy-Q International 3.2 MAX 5.08±0.2 14.0 MAX 4 9.8 MAX 1.2±0.1 TYP. 3 3 5.08±0.2 6.2±0.2 MARKING 1 SUGGESTED PAD LAYOUT TOP VIEW 4 2 1 2 3 4 5.08 ±0.2 PAD CONNECTIONS 1 SERIES NUMBER PAD 1 PAD 2 PAD 3 PAD 4


    Original     		PDF QSMO-4510 QSMO-4530 QSMO-4540 QSMO-4520 4510 HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540

    CTC 1351

    Abstract: CTC 1351 transistor transistor ctc 1351 CTC 1351 data sheet smooth l725 Oriole Alcoa full tension sleeve STR S 6531 L726 P724
    Text: BURNDY Transmission TABLE OF CONTENTS ACSR Conductor Accessories Deadends Single Pad . . . . . . . . . . . . . . . . . . I-3 Deadends Double Pad . . . . . . . . . . . . . . . . . I-4 Deadends Single Pad EHV . . . . . . . . . . . . . . I-5 Deadends Double Pad EHV . . . . . . . . . . . . . I-6


    Original     		PDF

    QSMO-6110

    Abstract: QSMO-6120 QSMO-6130 QSMO-6140 QSMO-6150
    Text: SURFACE MOUNT VOLTAGE CONTROLLED CRYSTAL OSCILLATOR VCXO QSMO - 6100 SERIES Hy-Q International 7.5 5 6 5.0 1.8 4 MARKING 1 2 SUGGESTED PAD LAYOUT 1.4 TYP. 1.9 4 3 6 1 5 2 2.6 2.0 TYP. 3 4.2 PAD CONNECTIONS PAD 3: VSS PAD 1: Vcont PAD 2: E/D or NC PAD 4: OUT


    Original     		PDF QSMO-6110 QSMO-6120 QSMO-6130 QSMO-6140 QSMO-6150 52MHz 25ppm 50ppm 36MHz QSMO-6150

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pads and Kits DF1 PAD 0.020" Typ. 0.015" Typ. SF1 PAD 0.015" Typ. 0.020" Typ. 0.015" Typ. 0.078" 0.035" DF2 PAD 0.035" 0.035" 0.026" Typ. 0.026" TFR1 PAD 0.010" SF2 PAD 0.030" 0.026" Typ. 0.026" Typ. 0.026" Typ. 0.010" 0.108" 0.075" 0.050" 0.050"


    Original     		PDF

    TLM563D

    Abstract: No abstract text available
    Text: Package Details - TLM563D Mechanical Drawing Lead Code: Reference individual device data sheet. Part Marking: 2-3 Character Alpha/Numeric Code *Exposed pad P1 common to pin 6 *Exposed pad P2 common to pin 3 Mounting Pad Geometry Dimensions in mm Central


    Original     		PDF TLM563D EIA-481-1-A 20x18x5 23x23x13 23x23x23 21x9x9 53x23x23 27x9x17 69x23x43 TLM563D

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Geometries Dimensions in mm. DPAK Cuitral Mmleandaccor Corp. b— 420 H Mounting Pad Geometries (Dimensions in mm.) HD DIP PAD GEOM 421 Central Mounting Pad Geometries (Continued) (Dimensions in mm.) SMA * 2 .0 ► \_ I -i-


    OCR Scan     		PDF OD-323 OT-143 OT-223

    FR4 SUBSTRATE SHEET

    Abstract: 0343
    Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES


    OCR Scan     		PDF

    DS1822X

    Abstract: No abstract text available
    Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES


    OCR Scan     		PDF DS1822X DS1822X

    0660H

    Abstract: No abstract text available
    Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD


    OCR Scan     		PDF 175-O 41-A9502-000 IE/06/1999 DS9502X DS9502X 0660H

    Untitled

    Abstract: No abstract text available
    Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. U N D ER FILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. NUMBER LAND PAD CONNECTIONS AND CENTER COORDINATES


    OCR Scan     		PDF DS1820X DS1820X

    DS2430AX

    Abstract: FR4 substrate 0537
    Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS


    OCR Scan     		PDF DS2430AX IS2430AX 022GE DS2430AX FR4 substrate 0537

    FR4 SUBSTRATE SHEET

    Abstract: DS75X 3ao2
    Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X


    OCR Scan     		PDF DS75X DS75X FR4 SUBSTRATE SHEET 3ao2