1206 pads layout
Abstract: No abstract text available
Text: TECHNICAL INFORMATION SOLDER PAD GEOMETRY STUDIES FOR SURFACE MOUNT OF CHIP CAPACITORS* Kent Wicker & John Maxwell AVX Corporation Corporate Research Laboratory P.O. Box 867 Myrtle Beach, SC 29577 Abstract: Solder pad geometry for surface mounting chip capacitors were
|
Original
|
PDF
|
S-PGSM00M301-R
1206 pads layout
|
1206 pads layout
Abstract: 1812 pads layout IPC-SM-782
Text: TECHNICAL INFORMATION SOLDER PAD GEOMETRY STUDIES FOR SURFACE MOUNT OF CHIP CAPACITORS* Kent Wicker & John Maxwell AVX Corporation Corporate Research Laboratory P.O. Box 867 Myrtle Beach, SC 29577 Abstract: Solder pad geometry for surface mounting chip capacitors were
|
Original
|
PDF
|
S-PGSM00M301-R
1206 pads layout
1812 pads layout
IPC-SM-782
|
SPRAGUE 047
Abstract: 572D 591D 592D 594D 595D 597D 695D 194D 195D
Text: VISHAY SPRAGUE Capacitors Application Note Pad Guidelines for Conformal Coated Tantalum Capacitors PAD DIMENSIONS in inches [millimeters] B C B A CASE CODE WIDTH A PAD METALLIZATION (B) SEPARATION (C) A B C D R S X Y 0.075 [1.9] 0.118 [3.0] 0.136 [3.5] 0.180 [4.6]
|
Original
|
PDF
|
19-Aug-08
SPRAGUE 047
572D
591D
592D
594D
595D
597D
695D
194D
195D
|
CWR11
Abstract: t95 f T95B
Text: VISHAY SPRAGUE Capacitors Application Note Pad Guidelines for High-Rel COTS Solid Tantalum Capacitors PAD DIMENSIONS in inches [millimeters] B C B A CASE CODE WIDTH A PAD METALLIZATION (B) SEPARATION (C) T95 B C D R S V X, Y, Z 0.120 [3.0] 0.136 [3.5] 0.180 [4.6]
|
Original
|
PDF
|
CWR06/CWR16
CWR11
26-Jun-08
CWR11
t95 f
T95B
|
EIA-RS-198
Abstract: No abstract text available
Text: Surface Mounting Guide MLC Chip Capacitors Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave
|
Original
|
PDF
|
MIL-STD202
EIA-RS-198.
EIA-RS-198
|
Untitled
Abstract: No abstract text available
Text: Recommended Mounting Pad Dimensions for U Series Capacitors These diagrams show the recommended pad layout dimensions for the AVX U series range of RF/Microwave capacitors. D2 D1 D3 D4 D5 Dimensions in millimeters inches Case Size 0402 0603 0805 1210 D1
|
Original
|
PDF
|
S-PDUS00M107-C
|
so8 pcb pattern
Abstract: 1206-8 chipfet layout vishay so-8 pin dimensions
Text: AND8237/D Low VCE sat BJT in 1206A ChipFETt Package Recommended Pad Pattern and Thermal Performance http://onsemi.com APPLICATION NOTE INTRODUCTION Basic Pad Patterns The basic pad layout with dimensions is shown in Figure 2. This is sufficient for low VCE(sat) BJT applications,
|
Original
|
PDF
|
AND8237/D
so8 pcb pattern
1206-8 chipfet layout
vishay so-8 pin dimensions
|
293D
Abstract: CTC3 793DX 593D 893D 0346 793DE
Text: VISHAY SPRAGUE Capacitors Application Note Molded Pad Guidelines for Tantalum Capacitors PAD DIMENSIONS in inches [millimeters] B D C A CASE CODE A MIN. B (NOM.) C (NOM.) D (NOM.) 293D - 593D - 893D - TR3 - TH3 - TF3 - TP3 - 793DE/793DX/CTC3/CTC4 A 0.071 [1.80]
|
Original
|
PDF
|
793DE/793DX/CTC3/CTC4
40123D
25-Jun-08
293D
CTC3
793DX
593D
893D
0346
793DE
|
AVX film chip capacitors
Abstract: capacitor .23 pf NOJA106M010RWJ NOSC107M006R0150 w2f 46 w2f 83 NOJA106M006RWJ nojb336m006rwj NOJB226M010RWJ
Text: 1766-2012.qxp:QuarkCatalogTempNew 9/17/12 5:50 PM Page 1766 Ceramic and Niobium Oxide Chip Capacitors W2F/W3F Series Ceramic Feedthru Capacitors ENCLOSURES W H Common Ground Feedthru Feedthru Pad C Pad L A L T BL W W1 Cost versus Performance is a key requirement for consumer electronic products. A new solid electrolyte capacitor OxiCap
|
Original
|
PDF
|
QM036D106MAT2A
QM054D226MAT2A
QM05YD106KAT2A
AVX film chip capacitors
capacitor .23 pf
NOJA106M010RWJ
NOSC107M006R0150
w2f 46
w2f 83
NOJA106M006RWJ
nojb336m006rwj
NOJB226M010RWJ
|
HC9S08JMxx
Abstract: maxTouch MC9S08JM60 SMD-49 daishinku pc game pad usb diagram MC9S08JM60CLDE auto pf power wizard 1.0 module for generator MC9S08JM60 c code example sot23-5 SMD CODE E5 cdc SMD
Text: Freescale Semiconductor Application Note Document Number: AN3761 Rev. 0, 11/2008 Using Freescale Devices for Contactless Touch Applications Touch Pad Demonstrator Board by: Luděk Šlosarčík Rožnov Czech System Center Czech Republic The touch pad demonstrator board is a development
|
Original
|
PDF
|
AN3761
MPR084,
MC9S08JM60.
MPR084.
HC9S08JMxx
maxTouch
MC9S08JM60
SMD-49 daishinku
pc game pad usb diagram
MC9S08JM60CLDE
auto pf power wizard 1.0 module for generator
MC9S08JM60 c code example
sot23-5 SMD CODE E5
cdc SMD
|
LDR 10mm
Abstract: pwmcm
Text: TAS5122 www.ti.com SLES088A − AUGUST 2003 − REVISED SEPTEMBER 2003 30ĆW STEREO DIGITAL AMPLIFIER POWER STAGE FEATURES D 2 x 30 W BTL Into 6 Ω at 1 kHz (DFD Pad-Up Package) − DCA Package (Pad-Down) Recommended for Lower-Power Applications APPLICATIONS
|
Original
|
PDF
|
TAS5122
SLES088A
TAS5122
TAS50XX)
LDR 10mm
pwmcm
|
ARM SRAM compiler
Abstract: poly silicon resistor 2P3M CMOS Process Family polysilicon resistor 6T SRAM SST superflash NMOS-2 BSIM3V3 0.25-um standard cell library
Text: 0.25 µm CMOS Process Family FC025 0.25 µm CMOS process for 2.5V logic and mixed-signal applications Main Process Features with 3.3V or 5V I/O Single Poly and up to 5 Metal Layers FC025 Process section Pad Well Architecture: Retrograde Twin Well Nitride Pad
|
Original
|
PDF
|
FC025
FC025
ARM SRAM compiler
poly silicon resistor
2P3M
CMOS Process Family
polysilicon resistor
6T SRAM
SST superflash
NMOS-2
BSIM3V3
0.25-um standard cell library
|
4-Pin, Microtech connector
Abstract: endevco accelerometer triaxial accelerometer sensor accelerometer endevco 2560 4-Pin Microtech connector 4-Pin, Microtech connector, endevco 3027AM4 CALIBRATOR ENDEVCO 28959 F current output accelerometer accelerometer endevco
Text: ISOTRON Seat Pad Accelerometer ENDEVCO MODEL 2560 Model 2560 • Triaxial Seat-Pad Accelerometer • Low-Impedance Output • High Output 100 mV/g , High Resolution (Milli-g) • Ideal for Whole Body Motion per ISO 2631 and ISO 7096 • Removable Triaxial
|
Original
|
PDF
|
|
AES17
Abstract: DFB1310A SMAJ28A TAS5010 TAS5026 TAS5122 TAS5122DCA TAS5122DFD eg g wakefield engineering 16 pin Audio processor ic for 5.1 home theatre
Text: TAS5122 www.ti.com SLES088C − AUGUST 2003 − REVISED NOVEMBER 2003 30ĆW STEREO DIGITAL AMPLIFIER POWER STAGE FEATURES D 2 x 30 W BTL Into 6 Ω at 1 kHz (DFD Pad-Up Package) − DCA Package (Pad-Down) Recommended for Lower-Power Applications APPLICATIONS
|
Original
|
PDF
|
TAS5122
SLES088C
TAS5026)
TAS5122
TAS50XX)
AES17
DFB1310A
SMAJ28A
TAS5010
TAS5026
TAS5122DCA
TAS5122DFD
eg g wakefield engineering
16 pin Audio processor ic for 5.1 home theatre
|
|
|
SLAA117
Abstract: No abstract text available
Text: TAS5122 www.ti.com SLES088 − AUGUST 2003 30ĆW STEREO DIGITAL AMPLIFIER POWER STAGE FEATURES D 2 x 30 W BTL Into 6 Ω at 1 kHz (DFD Pad-Up Package) − DCA Package (Pad-Down) Recommended for Lower-Power Applications APPLICATIONS D DVD Receiver D Home Theatre
|
Original
|
PDF
|
TAS5122
SLES088
TAS5122
TAS50XX)
SLAA117
|
bonding
Abstract: VG-50
Text: Application Note for Dual-Gate FETs Bonding Diagram bonding wires are 1-mil diameter Au wires Drain Bonding Wire "Gate 2" Bonding Wires (2 plcs, 1 wire per pad) Source Bonding Wires (2 plcs, 2 wires per pad) Gate Bonding Wire Single Bias Configuration Dual Bias Configuration
|
Original
|
PDF
|
|
SA3410GEVK
Abstract: wireless hearing aid hear Aid based Circuit Diagram SA3410GEVB circuit diagram of digital hearing aid hearing instrument WDRC DSP
Text: AYRE SA3291 Pre-configured Wireless DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 2 1 http://onsemi.com 32 PAD HYBRID CASE TBD PAD CONNECTION 20 1 VIN1 N/C GND VIN2 2 TIN N/C MGND 3 VREG 4
|
Original
|
PDF
|
SA3291
SA3291/D
SA3410GEVK
wireless hearing aid
hear Aid based Circuit Diagram
SA3410GEVB
circuit diagram of digital hearing aid
hearing instrument WDRC DSP
|
hearing instrument WDRC DSP
Abstract: No abstract text available
Text: AYRE SA3291 Preconfigured Wireless DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2014 April, 2014 − Rev. 4 1 http://onsemi.com 32 PAD HYBRID CASE TBD PAD CONNECTION 20 1 VIN1 N/C GND VIN2 2 TIN N/C MGND 3 VREG 4 VC
|
Original
|
PDF
|
SA3291
SA3291
SA3291/D
hearing instrument WDRC DSP
|
circuit diagram of digital hearing aid
Abstract: SA3400GEVB hearing instrument WDRC R3910-CFAB-E1B Hearing Aid Circuit Diagram hearing aid device specification PACK500 Hearing aids dsp musical fidelity e1 dsp hearing aid
Text: RHYTHM R3910 Pre-configured DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 1 1 http://onsemi.com 25 PAD HYBRID CASE TBD PAD CONNECTION 17 18 VIN1 1 VREG TIN 16 19 N/C 2 MGND DAI 15 20 N/C 3
|
Original
|
PDF
|
R3910
R3910/D
circuit diagram of digital hearing aid
SA3400GEVB
hearing instrument WDRC
R3910-CFAB-E1B
Hearing Aid Circuit Diagram
hearing aid device specification
PACK500
Hearing aids dsp
musical fidelity e1
dsp hearing aid
|
Untitled
Abstract: No abstract text available
Text: RHYTHM R3910 Preconfigured DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2014 April, 2014 − Rev. 6 1 http://onsemi.com 25 PAD HYBRID CASE TBD PAD CONNECTION 17 18 VIN1 1 VREG TIN 16 19 N/C 2 MGND DAI 15 20 N/C 3 GND
|
Original
|
PDF
|
R3910
R3910
R3910/D
|
Untitled
Abstract: No abstract text available
Text: RHYTHM R3910 Pre-configured DSP System for Hearing Aids Description Semiconductor Components Industries, LLC, 2013 October, 2013 − Rev. 5 1 http://onsemi.com 25 PAD HYBRID CASE TBD PAD CONNECTION 17 18 VIN1 1 VREG TIN 16 19 N/C 2 MGND DAI 15 20 N/C 3
|
Original
|
PDF
|
R3910
R3910
R3910/D
|
Untitled
Abstract: No abstract text available
Text: Application Information on Solder Pad Design for Surface Mount Chip Capacitor ◄- T - ► TOTAL LENGTH I £9 I_ _ _ L (LENGTH) (SEPARATION) (LENGTH) Recommended Pad Dimensions Dimensions (inches) Chip Size T ffl'ifi Wy! i
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Application Information on Solder Pad Design for Surface Mount Chip Capacitor •4 - T -► TOTAL LENGTH I I L (LENGTH) (SEPARATION) (LENGTH) Recommended Pad Dimensions Dimensions (inches) L W s 0402* 0.021 0.022 0.017 0.059
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Application Information on Solder Pad Design for Surface Mount Chip Capacitor A^XvA TOTAL LENGTH L s L (LENGTH) (SEPARATION) (LENGTH) Recommended Pad Dimensions Dimensions (inches) Chip Size L W s T 0402* 0.021 0.022 0.017 0.059 0504* 0.035 0.050 0.020 0.090
|
OCR Scan
|
PDF
|
|
