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    ML26AA

    Abstract: 532702B02500G ML26AAG 533902B02554G
    Text: TO-220 Heat Sinks Grease & Epoxy page112 Extruded heat sink with radial fins ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient—°C Extruded heat sink with radial fins and channel clip attach feature make device attachment easy. Includes clip and two solderable


    Original     		PDF O-220 page112 533902B02554G 533802B02554G ML26AA 532702B02500G ML26AAG 533902B02554G

    577002B04000G

    Abstract: In-Sil-8 577202B00000G 577102B04000G
    Text: TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink featuring recessed lower fins Air Velocity—Feet Per Minute 400 200 600 800 1000 10 Mounting Surface Temp Rise Above Ambient—°C 100 Channel style heat sink features recessed lower fins to allow closer component spacing and longer upper fins for


    Original     		PDF O-220 page112 590102B03600G 577202B04000G 4000G 577002B04000G In-Sil-8 577202B00000G 577102B04000G

    BW38-2G

    Abstract: 513002b02500g BW50-2G BW-50 heat sink to220 513201b02500g heat sink for TO220
    Text: TO-220 & TO-218 & TO-247 Heat Sinks Grease & Epoxy page112 Air Velocity—Feet Per Minute 400 200 600 800 100 Wide extruded heat sink with unequal channel widths on front and back can accommodate a TO-220, TO-218, or TO-247 device. Includes two solderable mounting pins which permit


    Original     		PDF O-220 O-218 O-247 page112 O-220, O-218, 513301B02500G O-247 BW38-2G 513002b02500g BW50-2G BW-50 heat sink to220 513201b02500g heat sink for TO220

    7022PBG

    Abstract: 7022BG
    Text: Grease & Epoxy page112 Channel style heat sink with folded back fins 200 Air Velocity—Feet Per Minute 400 600 800 Mounting Surface Temp Rise Above Ambient—°C 5 80 4 60 3 40 2 20 1 4 Channel style heat sink with folded back fins for increased cooling surface area. Available


    Original     		PDF page112 7022BG 551002B00000G 551002B0 7022PBG 7022BG

    507222B00000G

    Abstract: heat sink to220 5070
    Text: Grease & Epoxy page112 5069, 5070, 5071, 5072 Hat section style heat sink FIGURE A FIGURE B ø 3.66 0.144 THRU 17.78 (0.700) 13.46 (0.530) Mounting Kits page 99 ø 3.66 (0.144) THRU TYP 2 CL 37.34 (1.470) 10.16 (0.400) CL 13.59 (0.535) "A" Hat section style heat sinks are low


    Original     		PDF page112 O-220 507222B00000G heat sink to220 5070

    592502U03400G

    Abstract: 542502D00000G 592502B03400G heat sink for TO220 PAGE-112
    Text: Grease & Epoxy page112 Space saving staggered fin heat sink ORDERING INFORMATION Mounting Surface Temp Rise Above Ambient—°C Space saving staggered fin heat sink for vertical mounting TO-220 devices. Features integrated solderable mounting tabs that can be twisted for


    Original     		PDF page112 O-220 542502B00000G 592502B03400G O-220 592502U03400G 542502D00000G 592502B03400G heat sink for TO220 PAGE-112

    6399B

    Abstract: 6400B-G 6381B 6400B-P2G 6396B-P2G 6399BG 6396BG 6396b 6400BG 6399B-P2G
    Text: TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks Grease & Epoxy page112 High power extruded heat sink with large radial fins Mounting Surface Temp Rise Above Ambient—°C 5 80 4 60 3 40 2 20 1 High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical


    Original     		PDF O-220 O-218 O-247 page112 O-220, O-218, O-247and 6399B 6400B-G 6381B 6400B-P2G 6396B-P2G 6399BG 6396BG 6396b 6400BG 6399B-P2G

    NT5CB256M16bP-DI

    Abstract: NT5CB256M16 NT5CC512M8BN NT5CB512M8BN-CGI NT5CB512M8BN-DI NT5CB256M16BP-DII NT5CB256M16B T14C NT5CC512M8 NT5CC256M16BP
    Text: NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP Speed Bins -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Units tCK Parameter Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Clock Frequency


    Original     		PDF NT5CB512M8BN NT5CB256M16BP NT5CC512M8BN NT5CC256M16BP DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 NT5CB256M16bP-DI NT5CB256M16 NT5CB512M8BN-CGI NT5CB512M8BN-DI NT5CB256M16BP-DII NT5CB256M16B T14C NT5CC512M8 NT5CC256M16BP

    Untitled

    Abstract: No abstract text available
    Text: 32-bit TX System RISC TX03 Series TMPM330FYWFG Rev 1.02 Semiconductor & Storage Products Company 2013-08-05 Table of Contents Table of Contents. i


    Original     		PDF 32-bit TMPM330FYWFG Page457

    NT5CB256M16

    Abstract: NT5CC256M16 4Gb DDR3 SDRAM nanya ddr3 DDR3 DIMM SPD JEDEC
    Text: 4Gb DDR3 SDRAM B-Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min. Max. Min.


    Original     		PDF NT5CB512M8BN NT5CB256M16BP NT5CC512M8BN NT5CC256M16BP DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 NT5CB256M16 NT5CC256M16 4Gb DDR3 SDRAM nanya ddr3 DDR3 DIMM SPD JEDEC

    ADM660

    Abstract: ADM8660 ADM8828 ADM8829 ADP3603 ADP3604 ADP3605 ADP3607
    Text: POWER MANAGEMENT: DC to DC Converter, Switched Capacitor Model Vdc Input Volts Iq mA Isdown mA Switch Freq KHz Output Ripple mV Output Resistance Ohms Vout Volts Vout Accuracy Iout mA Load Reg mV/mA Price # Pins NOTES 100's FAX CODE Unregulated Switched Cap Voltage Converter


    Original     		PDF ADM660 ADM8660 ADM8828 ADM8829 130mV@ ADP3603 12ohmm/25mV ADP3604 ADM660 ADM8660 ADM8828 ADM8829 ADP3603 ADP3604 ADP3605 ADP3607

    LMG5278XUFC-00T

    Abstract: LMG5278XUFC-00T backlight LMG5278XUFC-00T-2 Y648 Y646 Hitachi DSA0046 2708L
    Text: RECORD OF REVISION DATE SHEET No. SUMMARY MAR.27.’98 7B64PS 2710CHANGE: LMG5278XUFC-00T-2 CONTRAST IRREGULARITY SPOT IS CHANGED. PAGE 10-3/5 Sh. KAOHSIUNG HITACHI DATE MAR.27.’98 7B64PS 2702-LMG5278XUFC-00T-2 PAGE 2-1/1 No. ELECTRONICS CO.,LTD. 3. MECHANICAL DATA


    Original     		PDF 7B64PS 2710CHANGE: LMG5278XUFC-00T-2 2702-LMG5278XUFC-00T-2 LMG5278XUFC-00T 2713-LMG5278XUFC-00T-2 PAGE13-1/1 LMG5278XUFC-00T LMG5278XUFC-00T backlight Y648 Y646 Hitachi DSA0046 2708L

    7141DG

    Abstract: 504102B00000G 50410-2 507302B00000
    Text: TO-220 Heat Sinks Copper narrow channel style heat sink with integrated clip 80 8 60 6 40 4 Case Temp Rise Above Ambient—°C 2 1 2 3 Heat Dissipated—Watts 4 16.51 0.650 3.05 (0.120) 5.72 (0.225) 5 Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION


    Original     		PDF O-220 7141DG 7141DG 504102B00000G 50410-2 507302B00000

    NT5CB256M16

    Abstract: NT5CC256M16CP-DI NT5CB256M16CP NT5CB256M16CP-DI NT5CC512M8 NT5CB512M8CN-CG NT5CC256M16 wrs4 NT5CB512M8CN NT5CB256
    Text: 4Gb DDR3 SDRAM C-Die NT5CB1024M4CN / NT5CB512M8CN / NT5CB256M16CP NT5CC1024M4CN / NT5CC512M8CN / NT5CC256M16CP Feature  VDD = VDDQ = 1.5V ± 0.075V JEDEC Standard  8n-bit prefetch architecture Power Supply  Output Driver Impedance Control VDD = VDDQ = 1.35V -0.0675V/+0.1V


    Original     		PDF NT5CB1024M4CN NT5CB512M8CN NT5CB256M16CP NT5CC1024M4CN NT5CC512M8CN NT5CC256M16CP NT5CB256M16 NT5CC256M16CP-DI NT5CB256M16CP-DI NT5CC512M8 NT5CB512M8CN-CG NT5CC256M16 wrs4 NT5CB256

    NT5CB256M16

    Abstract: NT5CB256m16bp NT5CB512M8BN-DII NT5CC256
    Text: 4Gb DDR3 SDRAM B-Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min. Max. Min.


    Original     		PDF NT5CB512M8BN NT5CB256M16BP NT5CC512M8BN NT5CC256M16BP DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 NT5CB256M16 NT5CB512M8BN-DII NT5CC256

    MOSFET-48V

    Abstract: powr607 emmc schematic 4700uF mosfet-n EIA96 ISPPAC-POWR607 eMMC DC-DC 5V-3,3V ISPPAC-POWR1014
    Text: Power 2 You 電源管理・制御の完全ガイド ボードレベルの電源管理機能 学習できるハウツーには以下が含まれます： »» 電源管理コストの低減 »» システムの信頼性を向上 »» 回路基板を改版するリスクの軽減


    Original     		PDF HS-12V MOSFET8sec32sec 12VNMOSFET 12V12V page-126- 32sec2sec ispPAC-POWR1220AT8 AldecActive-HDLHDL9-10 MOSFET-48V powr607 emmc schematic 4700uF mosfet-n EIA96 ISPPAC-POWR607 eMMC DC-DC 5V-3,3V ISPPAC-POWR1014

    NT5CB256M16CP

    Abstract: NT5CC256M16CP NT5CC256M16CP-DI NT5CC512M8CN DDR3-2133-CL14 NT5CB512M8CN NT5CC512M8CN-DII NT5CB512M8CN-CG NT5CB256M16 NT5CC256M16CP-DII
    Text: 4Gb DDR3 SDRAM C-Die NT5CB512M8CN / NT5CB256M16CP NT5CC512M8CN / NT5CC256M16CP CAS Latency Frequency -BE* -CG* -DI/DII* -EK* -FL* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL13 DDR3-2133-CL14 Speed Bins Units tCK Parameter Min. Max. Min. Max.


    Original     		PDF NT5CB512M8CN NT5CB256M16CP NT5CC512M8CN NT5CC256M16CP DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL13 DDR3-2133-CL14 NT5CC256M16CP NT5CC256M16CP-DI NT5CC512M8CN-DII NT5CB512M8CN-CG NT5CB256M16 NT5CC256M16CP-DII

    NT5CB256M16BP-CG

    Abstract: NT5CB256M16BP-DI
    Text: 4Gb DDR3 SDRAM B­Die NT5CB512M8BN / NT5CB256M16BP NT5CC512M8BN / NT5CC256M16BP CAS Latency Frequency -BE* -CG/CGI* -DI/DII* -EJ* -FK* DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 Speed Bins Units tCK Parameter Min.


    Original     		PDF NT5CB512M8BN NT5CB256M16BP NT5CC512M8BN NT5CC256M16BP DDR3/L-1066-CL7 DDR3/L-1333-CL9 DDR3/L-1600-CL11 DDR3-1866-CL12 DDR3-2133-CL13 NT5CB256M16BP-CG NT5CB256M16BP-DI

    SW25-4G

    Abstract: 529702B02500G SW38-4G SW63
    Text: TO-220 & TO-218 & TO-247 Heat Sinks 80 8 60 6 40 4 20 2 2 SW25 SW38 4 6 Heat Dissipated—Watts 8 Air Velocity—Feet Per Minute 400 200 600 800 100 1000 10 8 60 6 40 4 20 2 2 4 6 Heat Dissipated—Watts 8 ORDERING INFORMATION “A” Dim 34.50 1.358 2.00


    Original     		PDF O-220 O-218 O-247 SW25-2G page112 SW25-4G 529702B02500G SW38-4G SW63

    T10X5X5

    Abstract: EER54 EE55B
    Text: Magnetic Material Ind . Co., LTD Introduction & Characteristics of MnZn Ferrite cores Page1-12 Mnzn Power Material EER,ETD,RM,UYF,EP,EPC,UY,EFD,LP Page13-18 PQ,URS,UF&UI,ED,T,EI,EE Page19-26 Mnzn High Permeability Material EE,EI,EP,FT&ET,UF&UI,T,RM, Common mode choke cores applied in EMS,ET


    Original     		PDF Page1-12 Page13-18 Page19-26 Page27-33 Page34-37 Page38-43 Page43-47 Page47-54 Page55-59 T10X5X5 EER54 EE55B

    ABB inverter motor fault code

    Abstract: PT100 temperature sensor ABB motor 3AFE68735190 ACS350 ABB ACS350 3AFE68586704 ACS350 drives 3AFE68591091 03X-12A5-4 3AFE68591082
    Text: ACS350 User’s Manual ACS350 Drives 0.37…22 kW, 0.5…30 HP ACS350 drive manuals OPTION MANUALS (delivered with optional equipment) FCAN-01 CANopen Adapter Module User’s Manual 3AFE68615500 (EN) FDNA-01 DeviceNet Adapter Module User’s Manual 3AFE68573360 (EN)


    Original     		PDF ACS350 ACS350 FCAN-01 3AFE68615500 FDNA-01 3AFE68573360 FMBA-01 3AFE68586704 FPBA-01 ABB inverter motor fault code PT100 temperature sensor ABB motor 3AFE68735190 ABB ACS350 3AFE68586704 ACS350 drives 3AFE68591091 03X-12A5-4 3AFE68591082

    LT 7659

    Abstract: lin bus example C codes HG123 TMXF281553BAL-2-DB SDH 209 GR-253-CORE JT-G704 JT-G706 TMXF28155 TR-62411
    Text: Preliminary Data Sheet May 2001 TMXF28155 Super Mapper 155/51 Mbits/s SONET/SDH x28/x21 DS1/E1 1 Features • ■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications. Implementation supports both linear 1 + 1, unprotected and ring (UPSR) network topologies.


    Original     		PDF TMXF28155 x28/x21 GR-253-CORE, GR-499, TR-62411, JT-G704, JT-G706, JT-G707, JT-I431-a, DS01-167PDH LT 7659 lin bus example C codes HG123 TMXF281553BAL-2-DB SDH 209 GR-253-CORE JT-G704 JT-G706 TR-62411

    LT 7659

    Abstract: Lucent SLC 2000 installation LTE DL Channel Encoder transistor fcs 9012 GR-253-CORE JT-G704 JT-G706 TMXF28155 TR-62411 21153 specification update
    Text: Preliminary Data Sheet May 2001 TMXF28155 Super Mapper 155/51 Mbits/s SONET/SDH x28/x21 DS1/E1 1 Features • ■ Versatile IC supports 155/51 Mbits/s SONET/SDH interface solutions for T3/E3, DS2, T1/E1/J1, and DS0/E0/J0 applications. Implementation supports both linear 1 + 1, unprotected and ring (UPSR) network topologies.


    Original     		PDF TMXF28155 x28/x21 GR-253-CORE, GR-499, TR-62411, JT-G704, JT-G706, JT-G707, JT-I431-a, DS01-167PDH LT 7659 Lucent SLC 2000 installation LTE DL Channel Encoder transistor fcs 9012 GR-253-CORE JT-G704 JT-G706 TR-62411 21153 specification update

    plx 9054

    Abstract: plxtechnology tp 9054 333CJ PLX PCI9054 eeprom d4x MPC8S PC19054 pci 9054 RELAY lad1
    Text: PCI 9054 PCI I/O Accelerator November 1998 Version 1.0 l20 Compatible, CompactPCI Hot Swap Friendly PCI Bus Master Interface Chip _ for Adapters and Embedded Systems FEA TU R E S • 3.3V, 5V tolerant PCI and Local signaling supports Universal PCI Adapter designs, 3.3V core, lowpower CMOS in 176-pin PQFP and 225-pin PBGA


    OCR Scan     		PDF 32-bit, 33-MHz 32-bit 176-pin 225-pin 9054-AA50PI 225-pin 9054-AA50BI plx 9054 plxtechnology tp 9054 333CJ PLX PCI9054 eeprom d4x MPC8S PC19054 pci 9054 RELAY lad1