Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PAN1104081 Search Results

    PAN1104081 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is to aid thermal conductivity from the chip to the PCB to lower the thermal resistance


    Original     		PAN1104081 8-Apr-2011 QFN-16L 100mW. 100mW PDF