lcd-displays
Abstract: No abstract text available
Text: Series 317 / 350 PCB connectors 1.778 and 1.8 mm Single row Solder tail Receptacles and pin connectors, solder tail With reduced grid spacing 1.778 and 1.8 mm Platings 91 93 97 99 10 90 Sleeve 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb Clip 0,25 µm Au
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317-91-1xx-41-005
317-93-1xx-41-005
317-97-1xx-41-005
317-99-1xx-41-005
350-10-1xx-00-012
350-90-1xx-00-012
lcd-displays
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FPC copper alloy
Abstract: EC10
Text: FPC Connector EC-10 Series 1.0mm Spacing Easy Flip Lock Type ● CFP84 - 3 Finish x×× Contact Soldering Mechanical locking system of FPC 0 : With 5 : Without ＊ （ No. of Pins 極数 Au Sn Au Sn-Pb 52F 91F 51G 70G Au Sn Sn-Pb Sn-Pb ） A+8.6=B × FPC / FFC Connectors
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EC-10
CFP84
ACDC50V
DC500V
AC500V
15min
FPC copper alloy
EC10
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PCB connectors 2.54
Abstract: Preci-Dip UM 72 PROFILE
Text: Series 311 / 411 / 315 / 415 PCB connectors 2.54 mm Single row / double row Solder tail Receptacles, solder tail Accept pins ∅ 0.40–0.56 mm For corresponding pin connectors see pages 43 to 46 Platings 91 93 97 99 Sleeve 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb
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411-91-2xx-41-001
311-91-1xx-41-001
311-93-1xx-41-001
311-99-1xx-41-001
411-91-2xx-41-001
411-93-2xx-41-001
411-99-2xx-41-001
315-91-1xx-41-003
315-93-1xx-41-003
315-97-1xx-41-003
PCB connectors 2.54
Preci-Dip
UM 72 PROFILE
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Untitled
Abstract: No abstract text available
Text: Solid tantalum capacitors - For power supplies and converters Molded cases SMD - Surface mount Sn-Pb or Sn plated - Polarized types Molded cases SMD - Surface mount Sn-Pb or Sn Plated - Polarized types STANDARD RATINGS - ELECTRICAL CHARACTERISTICS ELECTRICAL AND ENVIRONMENTAL CHARACTERISTICS
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Original
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500kHz
DCTC21.
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6 pin. 1 single row receptacle
Abstract: Preci-Dip
Text: Series 310 / 410 PCB connectors 2.54 mm Single row / double row Solder tail 36 Receptacles, solder tail Accept pins ∅ 0.40–0.56 mm For corresponding pin connectors see pages 43 to 46 Platings 13 91 93 97 99 Sleeve 0.25 µm Au 5 µm Sn Pb 5 µm Sn Pb 5 µm Sn Pb
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410-91-2xx-41-001
310-13-1xx-41-001
310-91-1xx-41-001
310-93-1xx-41-001
310-97-1xx-41-001
310-99-1xx-41-001
410-13-2xx-41-001
410-93-2xx-41-001
410-97-2xx-
6 pin. 1 single row receptacle
Preci-Dip
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CFP64
Abstract: No abstract text available
Text: FPC Connector EC-05 Series 0.5mm Spacing Easy Flip Lock Type ● CFP64 - 3 Finish Mechanical locking system of FPC 0 : With 5 : Without 52F 51G 70G Contact Soldering Au Au Sn-Pb Au Sn-Pb Sn-Pb FPC / FFC Connectors No. of Pins • Features 1. The wire-fixation lever is of our own easy flip lock
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EC-05
CFP64
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Pb and Pb-free Reflow Soldering Temperature Profiles
Abstract: TB493 JEP-140
Text: Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min TSMIN 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX)
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PDF
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1-888-INTERSIL
TB493
Pb and Pb-free Reflow Soldering Temperature Profiles
JEP-140
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet MP200 December-2011 PRODUCT DESCRIPTION MP200 provides the following product characteristics: Technology Application Solder paste Sn/Pb soldering MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both
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MP200
December-2011
MP200
200mms-1
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F1206SB5000V032
Abstract: marking p-8a F1206SB4000V032 F1206SB2000V063 EIA1206 slow blow glass fuses
Text: Rev. Oct. 08 SolidMatrix 1206 Slow Blow Surface Mount Fuses Sn/Pb Terminations Features: • • • • • • High inrush current withstanding capability Multilayer monolithic structure with glass ceramic body and silver fusing element Silver termination with nickel and Sn/Pb solder plating, providing
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EIA1206/EIAJ3216
F1206SB5000V032
marking p-8a
F1206SB4000V032
F1206SB2000V063
EIA1206
slow blow glass fuses
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8240-0287
Abstract: No abstract text available
Text: REVISIONS REV. 01 PART NUMBER SOLDER CONTENT 824-00287 Sn/Pb 824-00287F Sn/Ag/Cu WARNING ! DESCRIPTION ECN NO. DATE N/A 09/08/04 FIRST RELEASE PART DESCRIPTION TITLE TRANSFORMER, 100BASE-T, DUAL, SOIC, 40 PIN Standard version, containing lead Lead Pb -Free version
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824-00287F
100BASE-T,
100kHz,
1-100MHz
1-30MHz
40MHz
50MHz
60-80MHz
8240-0287
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1754-3
Abstract: No abstract text available
Text: Mini-Circuits - Specification for Power Splitter - SBTCJ-1W Power Splitter Notes: • Power Input as splitter 0.5W max. • Internal Dissipation 0.125W max. • Reflow Solder Assembly Silver-bearing solder (Sn/Pb/Ag 62/36/2%) is recommended; however, tin-lead eutectic (Sn/Pb 63/37%) may be used.
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AN-40-004.
Way-180°
1754-3
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499-93-216-10-003
Abstract: PCB connectors 2.54
Text: Series 399 / 499 PCB connectors 2.54 mm Single row / double row Solder tail Right angle receptacles, solder tail Receptacles accept pins ∅ 0.40–0.56 mm For corresponding connectors see pages 43 to 46 Platings 91 93 Sleeve 5 µm Sn Pb 5 µm Sn Pb Clip 0,25 µm Au
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PDF
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499-93-2xx-10-003
399-91-1xx-10-003
399-93-1xx-10-003
499-91-2xx-10-003
499-93-216-10-003
PCB connectors 2.54
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Untitled
Abstract: No abstract text available
Text: 75 Amp Ultrafast Rectifier UFRG75120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry
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OCR Scan
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PDF
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UFRG75120
Sn/15
Sn/37
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Untitled
Abstract: No abstract text available
Text: 30 Amp Ultrafast Rectifier UES3005S - UES3015S Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog
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OCR Scan
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PDF
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UES3005S
UES3015S
Sn/15
Sn/37
UES3010S
UES3005S
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|
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Untitled
Abstract: No abstract text available
Text: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry
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OCR Scan
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PDF
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UFRG30120
Sn/15
Sn/37
UFRG301
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Untitled
Abstract: No abstract text available
Text: 30 Amp Ultrafast Rectifier UFRG30120 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 3 00 —800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry
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OCR Scan
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PDF
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UFRG30120
Sn/15
Sn/37
UFRG301
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SSUM75120
Abstract: No abstract text available
Text: 75 Amp Ultrasoft Rectifier SSUM751 20 Dim. Inches Millimeter Minimum Maximum Minimum Maximum Notes Gd | - R C (A ) ^ 1 -8 Lead frame plating — 85%Sn/15%Pb, 300—800 micro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry
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OCR Scan
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PDF
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SSUM751
Sn/15
Sn/37
SSUM75120
1200ORADO
SSUM75120
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XO-105
Abstract: UF8025 FSM700
Text: 80 Amp Ultrafast Rectifier UF8025 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 3 00 —800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry P art Number Working Peak Reverse Voltage UF8025 250V
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UF8025
Sn/15
Sn/37
XO-105
UF8025
FSM700
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Untitled
Abstract: No abstract text available
Text: 30 Amp U ltraso ft Rectifier SSUM301 20 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number Working Peak Reverse Voltage SSUM30120
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PDF
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SSUM301
Sn/15
Sn/37
SSUM30120
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Untitled
Abstract: No abstract text available
Text: 75 Amp U ltraso ft Rectifier SSUM751 20 Dim. Inches Minimum C (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number Working Peak Reverse Voltage SSUM75120
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OCR Scan
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PDF
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SSUM751
Sn/15
Sn/37
SSUM75120
SSUM75'
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CFC-PW001ME3-50
Abstract: No abstract text available
Text: MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. PLATING CONTACT: UNDERPLATED: 50 u” MIN Ni. CONTACT AREA: SELECT GOLD OVER Ni PLATED. SOLDER TAIL: 100 u” MIN Sn/Pb OVER Ni PLATED. PED: 100 u’ MIN Sn/Pb OVER 50 u" MIN Ni PLATED.
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138ln.
167ln.
197ln.
CFC-PW001ME3-50
CFC-PW001ME3-50
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Untitled
Abstract: No abstract text available
Text: MATERIAL HOUSING: HIGH TEMPERATURE THERMOPLASTIC. CONTACT: COPPER ALLOY. PED: BRASS. PLATING CONTACT: UNDERPLATED: 50 u" MIN Nl. CONTACT AREA: SELECTED GOLD OVER Ni PLATED. SOLDER TAIL 100 u’ MIN Sn/Pb OVER Ni PLATED. PED: 100 u’ MIN Sn/Pb OVER 50 u” MIN Ni PLATED.
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CFC-PW001ME4-50
138ln.
167ln.
197ln.
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200UA
Abstract: SSUM10060
Text: 100 Amp U ltrafast Rectifier SSUM10 0 6 0 Dim. Inches M illim eter Minimum A (A) Lead fram e plating — 85%Sn/15%Pb, 300—800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry Part Number SSUM10060 Working Peak
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SSUM10060
Sn/15
Sn/37
200UA
SSUM10060
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200UA
Abstract: SSUM10060
Text: 100 Amp Ultrafast Rectifier SSUM10 0 6 0 Dim. Inches Minimum A (A) Lead fram e plating — 85%Sn/15%Pb, 3 00 —800 m icro inches Leads solder dipped with 63%Sn/37%Pb solder. Microsemi Catalog Number Industry P art Number Working Peak Reverse Voltage SSUM10060
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SSUM10060
Sn/15
Sn/37
200UA
SSUM10060
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