nitto GE-100L
Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA
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NXR-1400
Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s
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AN1231/D
AN1231
AN1231/D*
NXR-1400
nicolet nxr1400
reballing
Air-Vac Engineering Company
830B
A112
AN1231
JESD22
MPC105
OMPAC
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transistor nec 8772
Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s
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AN1231/D
AN1231
transistor nec 8772
nec 7912
nec 8772
motorola 7912
1764 676
kapton
NXR-1400
2SB444
8772 P
bga dye pry
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Intel reflow soldering profile BGA
Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
Text: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular
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CH14WIP
Intel reflow soldering profile BGA
socket s1 REFLOW PROFILE
intel topside mark
outline of the heat slug for JEDEC
heat pipes intel
pbga package weight
BGA OUTLINE DRAWING
intel mother board circuit
land pattern BGA 0,50
324 bga thermal
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nitto GE
Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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dpm001
Abstract: N203 zl50018 PMS-100 MFU C0 37 PMS01
Text: ZL50018 2 K Digital Switch with Enhanced Stratum 3 DPLL Data Sheet Features Ordering Information ZL50018GAC 256 Ball PBGA Trays ZL50018QCC 256 Lead LQFP Trays ZL50018GAG2 256 Ball PBGA* Trays *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output
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ZL50018
GR-1244-CORE
ZL50018GAC
ZL50018QCC
ZL50018GAG2
dpm001
N203
PMS-100
MFU C0 37
PMS01
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dpm001
Abstract: No abstract text available
Text: ZL50022 Enhanced 4 K Digital Switch with Stratum 4E DPLL Data Sheet Features Ordering Information ZL50022GAC 256 Ball PBGA ZL50022QCC 256 Lead LQFP ZL50022GAG2 256 Ball PBGA* *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output streams Trays
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ZL50022
GR-1244-CORE
ZL50022GAC
ZL50022QCC
ZL50022GAG2
dpm001
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Philips FA 145
Abstract: FLR13 VCT 492 x GR-1244-CORE ZL50021 ZL50021GAC ZL50021GAG2 ZL50021QCC SCA-7
Text: ZL50021 Enhanced 4 K Digital Switch with Stratum 3 DPLL Data Sheet Features Ordering Information ZL50021GAC 256 Ball PBGA Trays ZL50021QCC 256 Lead LQFP Trays ZL50021GAG2 256 Ball PBGA* Trays *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output
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ZL50021
ZL50021GAC
ZL50021QCC
ZL50021GAG2
GR-1244-CORE
Philips FA 145
FLR13
VCT 492 x
ZL50021
ZL50021GAC
ZL50021GAG2
ZL50021QCC
SCA-7
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"LINK STATE"
Abstract: No abstract text available
Text: Advance Data Sheet July 1999 LU3X38FTR 256-Pin PBGA OCTAL-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Overview The LU3X38FTR 256-Pin PBGA is an eight-channel, single-chip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and
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LU3X38FTR
256-Pin
10Base-T/100Base-TX/FX
10Base-T,
100Base-TX,
100Base-FX
"LINK STATE"
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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pms01
Abstract: No abstract text available
Text: ZL50022 Enhanced 4 K Digital Switch with Stratum 4E DPLL Data Sheet Features Ordering Information ZL50022GAC 256 Ball PBGA ZL50022QCC 256 Lead LQFP ZL50022GAG2 258 Ball PBGA* *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output streams Trays
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ZL50022
GR-1244-CORE
ZL50022GAC
ZL50022QCC
ZL50022GAG2
pms01
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cisco 2911
Abstract: MR4A MR7N "LINK STATE"
Text: Advance Data Sheet May 1999 LU3X38FTR 256-Pin PBGA OCTAL-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Overview The LU3X38FTR 256-Pin PBGA is an eight-channel, single-chip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and
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LU3X38FTR
256-Pin
10Base-T/100Base-TX/FX
10Base-T,
100Base-TX,
100Base-FX
cisco 2911
MR4A
MR7N
"LINK STATE"
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SMII specification
Abstract: No abstract text available
Text: Advance Data Sheet October 1999 LU3X38FTR 256-Pin PBGA OCTAL-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Overview The LU3X38FTR 256-Pin PBGA is an eight-channel, single-chip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and
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LU3X38FTR
256-Pin
10Base-T/100Base-TX/FX
10Base-T,
100Base-TX,
100Base-FX
SMII specification
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63B4
Abstract: intel 6264 SARS 03 CI 6268 LS 5208 pinout MO-151 MT9042 MT9044 MT90528 MT90528AG
Text: MT90528 28-Port Primary Rate Circuit Emulation AAL1 SAR Data Sheet August 2006 Features • • • • • • • • • Ordering Information MT90528AG 456 PBGA Trays MT90528AG2 456 PBGA* Trays *Pb Free Tin/Silver/Copper -40 to +85°C AAL1 Segmentation and Reassembly device
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MT90528
28-Port
MT90528AG
MT90528AG2
af-vtoa-0078
af-vtoa-0089
63B4
intel 6264
SARS 03
CI 6268
LS 5208 pinout
MO-151
MT9042
MT9044
MT90528
MT90528AG
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cisco 2911
Abstract: K19 FET the RMII Consortium Specification W17 fet 3X38FTR LC10 LS10 MR20 MR21 MR30
Text: Preliminary Data Sheet June 2000 3X38FTR 256-Pin PBGA OCTAL-FET Fast Ethernet Transceiver for 10Base-T/100Base-TX/FX Overview The 3X38 256-Pin PBGA is an eight-channel, singlechip complete transceiver designed specifically for dual-speed 10Base-T, 100Base-TX, and 100BaseFX switches and repeaters. It supports simultaneous
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3X38FTR
256-Pin
10Base-T/100Base-TX/FX
10Base-T,
100Base-TX,
100BaseFX
100Base-FX.
cisco 2911
K19 FET
the RMII Consortium Specification
W17 fet
LC10
LS10
MR20
MR21
MR30
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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A-18
Abstract: MPC555 QADC64 272-Pin
Text: LIST OF TABLES Table 2-1 2-2 2-3 2-4 2-5 2-6 Title Page MPC555 Pin Functions for 272-Pin PBGA . 2-3 Pin Functionality Table . 2-6
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MPC555
272-Pin
MPC555
A-18
QADC64
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HALL SENSOR SS 94 A2
Abstract: hvr 1X 3 diode 4 pin hall sensor hvr 1X 7 diode h2f regulator HALL SS 94 A2 diode hvr 1x hall effect sensor 720 HIGH-VOLTAGE HALF BRIDGE DRIVER MC33980
Text: Freescale Semiconductor, Inc. MOTOROLA Order this document from Analog Marketing: MC33980/D Rev 0, 10/2002 SEMICONDUCTOR TECHNICAL DATA Market Assessment Freescale Semiconductor, Inc. Multipurpose Mechatronics PBGA Substrate Module for Intelligent LIN Distributed Systems
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MC33980/D
HC08d
HALL SENSOR SS 94 A2
hvr 1X 3 diode
4 pin hall sensor
hvr 1X 7 diode
h2f regulator
HALL SS 94 A2
diode hvr 1x
hall effect sensor 720
HIGH-VOLTAGE HALF BRIDGE DRIVER
MC33980
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IF33
Abstract: of161 MT90826 MT90826AG MT90826AL MT90826AL1 MT90826AV STI10 STo26
Text: MT90826 Quad Digital Switch Data Sheet Features • January 2006 4,096 x 4,096 channel non-blocking switching at 8.192 or 16.384 Mbps Ordering Information MT90826AL MT90826AG MT90826AV MT90826AL1 MT90826AG2 160 Pin MQFP Trays 160 Ball PBGA Trays 144 Ball LBGA
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MT90826
MT90826AL
MT90826AG
MT90826AV
MT90826AL1
MT90826AG2
IF33
of161
MT90826
MT90826AG
MT90826AL
MT90826AL1
MT90826AV
STI10
STo26
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A20 1453
Abstract: A-20 MPC555 QADC64
Text: Paragraph Number 2-1 2-2 2-3 2-4 2-5 2-6 LIST OF TABLES Page Number MPC555 Pin Functions for 272-Pin PBGA . 2-4 Pin Functionality Table . 2-7
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MPC555
272-Pin
MPC555
A20 1453
A-20
QADC64
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djlxt381leb4
Abstract: 132 gd wj 72 WJLXT381LE.B4 132 gd wj 78
Text: Intel LXT381 Octal E1 Line Interface Unit Datasheet General Description The LXT381 is an octal short haul analog Line Interface Unit for ITU G.703 2.048 Mbps transmission systems. It incorporates eight independent receivers and eight independent transmitters in a single LQFP-144 or PBGA-160 package.
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LXT381
LXT381
LQFP-144
PBGA-160
B5586-01
djlxt381leb4
132 gd wj 72
WJLXT381LE.B4
132 gd wj 78
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128-PIN
Abstract: DS21448 DS21448L DS21448LN DS21448N DS21Q348 ami 60 amp fuse
Text: DS21448 3.3V E1/T1/J1 Quad Line Interface www.maxim-ic.com GENERAL DESCRIPTION FEATURES The DS21448 is a quad-port E1 or T1 line interface unit LIU for short-haul and long-haul applications. It incorporates four independent transmitters and four independent receivers in a single 144-pin PBGA or
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DS21448
DS21448
144-pin
128-pin
-15dB,
32-Bit
128-Bit
J-STD-020A
J-STD-020.
DS21448L
DS21448LN
DS21448N
DS21Q348
ami 60 amp fuse
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LQFP-144 recommended layout
Abstract: LXT381LE 10BQ060 11DQ04 LQFP-144 LXT381 LXT381BE LXT386 MBR0540T1
Text: LXT381 Octal E1 Line Interface Unit Datasheet General Description The LXT381 is an octal short haul analog Line Interface Unit for ITU G.703 2.048 Mbit/sec. transmission systems. It incorporates eight independent receivers and eight independent transmitters in a single LQFP-144 or PBGA-160 package.
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LXT381
LXT381
LQFP-144
PBGA-160
datT381
160-Pin
LXT381BE
LQFP-144 recommended layout
LXT381LE
10BQ060
11DQ04
LXT381BE
LXT386
MBR0540T1
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