PC-TSOP/DIP8-01 Search Results
PC-TSOP/DIP8-01 Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
|---|---|---|---|---|---|---|
| PC-TSOP/DIP8-01 | Ironwood Electronics | SOIC to DIP Package Converters; Top Package Code: SO8F; Bottom Package Code: 0.6; Top Pitch (mm): 0.65; Bottom Pitch (mm): 2.54; Top Pin Count: 8; Bottom Pin Count: 8; Top Array Size: N/A; Bottom Array Size: N/A; Top Interface: SOIC Land Pattern; Bottom Interface: Thru Hole Pins; Inside Land Dim. - Ouside land dim. (in.): 0.125 - 0.325; Adapter Size Length X Width (in.): 0.7 x 0.4; Part Description: SOIC to DIP Converter; | Original |