MAX8774
Abstract: PCI8402 RTL8111B-GR PCI8412 MAX8774 pdf 2N7002E-LF AMD Athlon 64 X2 dual 4800 pin out AMD Athlon 64 X2 4800 pin diagram BT129 ALC262
Text: 1 2 3 4 5 PCB P/N AND DESCRIPTION PCB ED5 MB 8L,309X218, REVA P/N: DA0ED5MB8A8 PCB ED5 USB/B(8L, 47.5X16.8, REVA) P/N: DA0ED5SB8A5 PCB ED5 MB(8L,309X218,REVB) P/N: DA0ED5MB8B6 ED5 PCB ED5 USB/B(8L,47.5X16.8,REVB) P/N: DA0ED5SB8B3 6 7 SATA ED5 SATA ASSY P/N
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309X218,
309X218
51ED5SS0018
41ED5CS0015
31ED5MB0012
4NED5SS0011
3NED5UB0011
51ED5SS0000
41ED5CS0007
31ED5MB0004
MAX8774
PCI8402
RTL8111B-GR
PCI8412
MAX8774 pdf
2N7002E-LF
AMD Athlon 64 X2 dual 4800 pin out
AMD Athlon 64 X2 4800 pin diagram
BT129
ALC262
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component data
Abstract: avago shipping label Moisture Sensitivity JEDEC SMT reflow profile avago Moisture Sensitivity avago, SMT LED
Text: ASMT-Bx20 PCB Based Subminiature Lamps PCB PolyLED Application Note 5333 Introduction The main benefits of these PCB PolyLEDs are: This series of top mount PCB PolyLED is designed with smaller footprint to achieve high density of components on board. They have the industry standard footprint of
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ASMT-Bx20
AV02-0393EN
component data
avago shipping label Moisture Sensitivity
JEDEC SMT reflow profile
avago Moisture Sensitivity
avago, SMT LED
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SMB1N-PCB
Abstract: No abstract text available
Text: SMB1N-PCB v 1.0 08.05.2014 Description SMB1N-PCB is a printed circuit board designed for easily soldering and mounting LEDs of SMB1N series. To install the PCB on a heat sink, it features 4 mounting holes Ø2 mm on each corner. The substrate is made of copper and the finishing of mating surface is gold plate.
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SMB1W-PCB
Abstract: No abstract text available
Text: SMB1W-PCB v 1.0 08.05.2014 Description SMB1W-PCB is a printed circuit board designed for easily soldering and mounting LEDs of SMB1W series. To install the PCB on a heat sink, it features 4 mounting holes Ø2 mm on each corner. The substrate is made of copper and the finishing of mating surface is gold plate.
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short distance rf tx ic
Abstract: RF PCB Antenna micro strip line RF 2.4Ghz antenna 2.4Gh* microstrip patch antenna rectangular microstrip patch Antenna antenna matching calculation
Text: 2.4GHz RF TX/RX PCB Guidelines 2.4GHz RF TX/RX PCB Guidelines D/N：HA0224E PCB Layout Notes The RF can be connected to a passive patch antenna or an antenna connector. The RF connection is on the PCB and connects the RF pin 2 & pin 3 with a matching and balun
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D/NHA0224E
2450MHz.
2450MHz/50
32MHz
short distance rf tx ic
RF PCB Antenna
micro strip line
RF 2.4Ghz antenna
2.4Gh* microstrip patch antenna
rectangular microstrip patch Antenna
antenna matching calculation
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picor
Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1
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micro strip line
Abstract: 2.4GHz RECEIVER IC short distance rf tx ic DESIGN RULE CHECK PCB antenna matching calculation 2.4GHz amplifier layout RF PCB Antenna DESIGN RULE PCB pcb crystal layout balun differential to single
Text: 2.4GHz RF TX/RX PCB Guideline 2.4GHz RF TX/RX PCB Guideline 文件編碼：HA0224T PCB Layout 時可能需注意事項 RF Part can be connected to a passive patch antenna or an antenna connector. The RF connection is on the PCB and connects the RF pin 2 & pin 3 with a matching and balun circuit, as shown in Fig.1.
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HA0224T
50Matching
2450MHZ
2450MHZ/50
32MHz
micro strip line
2.4GHz RECEIVER IC
short distance rf tx ic
DESIGN RULE CHECK PCB
antenna matching calculation
2.4GHz amplifier layout
RF PCB Antenna
DESIGN RULE PCB
pcb crystal layout
balun differential to single
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jedec package MO-247
Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB
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AC322
jedec package MO-247
qfn 88 stencil
QN180
IEC-68-2-32
QFN PCB Layout guide
QN108
Amkor TSCSP
qfn 32 land pattern
IPC-TM-650 2.6.9
QN180 outline
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motorola 68020
Abstract: No abstract text available
Text: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 17.25mm[0.679"] Assembled 2 1 0.64mm typ. [0.025"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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FR4/G10
PC-PGA/QFP-68020-G-01
motorola 68020
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fbga Substrate design guidelines
Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB
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AC243
fbga Substrate design guidelines
CS281
ACTEL FBGA PACKAGE DRAWING
AC243
CS81
fine BGA thermal profile
pcb thermal Design guide pcb trace
fbga PCB footprint
thermal pcb guidelines
MO-195
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TMDS PCB design guidelines
Abstract: DVI TMDS PCB design guidelines DVI PCB design guidelines AN-6064 FSHDMI311 DVI RECEIVER PCB design guidelines velocity of propagation of FR4 hdmi pcb layout
Text: www.fairchildsemi.com AN-6064 — FSHDMI311 PCB Layout Guidelines DVI/HDMITM Repeater Introduction Applications Board Layout This application note provides guidelines for successful PCB layout techniques for Fairchild’s FSHDMI311 DVI/HDMITM Repeater. For additional information, review
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AN-6064
FSHDMI311
FSHDMI311
TMDS PCB design guidelines
DVI TMDS PCB design guidelines
DVI PCB design guidelines
DVI RECEIVER PCB design guidelines
velocity of propagation of FR4
hdmi pcb layout
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CYC65632
Abstract: CY7C65634 AN72332 CYC65642 AN1168 CY4602 CY4605 circuit diagram of usb repeater CY7C65642 physical layer design for USB 2.0
Text: AN72332 Author: Vetrivel.P Associated Project: No Associated Part Family: HX2VL Software Version: None Associated Application Notes: None EZ-USB HX2VL PCB Design Recommendations Abstract AN72332 presents PCB recommendations for designing with the Cypress Semiconductor CY7C65642, CY7C65632,
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AN72332
AN72332
CY7C65642,
CY7C65632,
CY7C65634
CYC65632
CYC65642
AN1168
CY4602
CY4605
circuit diagram of usb repeater
CY7C65642
physical layer design for USB 2.0
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BGA PACKAGE thermal profile
Abstract: BGA 256 PACKAGE thermal resistance 484-pin BGA The Diode Data Book with Package Outlines CII51015-2 EP2C20 EP2C35 EP2C50 F256 MS 034 aaj
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. The chapters in this section contain the required PCB layout guidelines and package specifications.
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Nelco 4000-13
Abstract: MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406 Rogers 4350B stackup 4000-13EP FR4 Prepreg
Text: PCB Stackup Design Considerations for Altera FPGAs AN-613-1.0 Application Note This application note presents an overview of the PCB stackup construction and material selection criteria. It discusses the important material parameters that influence the electrical
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AN-613-1
Mil-Std-275E)
Nelco 4000-13
MEGTRON 6
370HR
isola 370HR
Nelco 4000-13 si
Isola FR406
Rogers 4350B
stackup
4000-13EP
FR4 Prepreg
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Untitled
Abstract: No abstract text available
Text: AN11180 UCODE I2C PCB antenna reference designs Rev. 1.0 — 24 October 2012 229310 Application note COMPANY PUBLIC Document information Info Content Keywords UCODE EPC Gen2, inter-integrated circuit, I²C, Antenna Reference Design, PCB Antenna Design Abstract
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screen emulsion
Abstract: P8002355 P8002392 63Sn37Pb
Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 14 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.
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LM53
Abstract: No abstract text available
Text: FEATURES / BENEFITS LUMILIGHT Extremely long life of 50,000 hours at 55ºC PCB temperature LED LIGHT ENGINES SINGLE COLOR Extremely narrow construction for mounting in tight spaces Aluminium based PCB for easier heat dissipation and more efficient operation
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350mA
LM53
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MMM7210
Abstract: AN3585 L302 inductor C338 EUROPE C338 c341 transistor diode c341 transistor c341 FR4 SUBSTRATE MICROSTRIP ANTENNA SHEET C342
Text: Freescale Semiconductor Application Note Document Number: AN3585 Rev. 1.1, 07/2008 PCB Layout Design Guidelines for Radio Board Using the MC13853 LNA 1 Abstract Radio printed circuit boards PCB must effectively integrate the devices and other elements while avoiding
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AN3585
MC13853
QFN16
MMM7210
AN3585
L302 inductor
C338 EUROPE
C338
c341 transistor
diode c341
transistor c341
FR4 SUBSTRATE MICROSTRIP ANTENNA SHEET
C342
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FBGA-484 datasheet
Abstract: arria MS-034 AGX52014-1
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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152-pin
FBGA-484 datasheet
arria
MS-034
AGX52014-1
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AN3585
Abstract: c337 transistor C338 c341 transistor MMM7210 C337 C339 C340 C341 C342
Text: Freescale Semiconductor Application Note Document Number: AN3585 Rev. 1.1, 07/2008 PCB Layout Design Guidelines for Radio Board Using the MC13853 LNA 1 Abstract Radio printed circuit boards PCB must effectively integrate the devices and other elements while avoiding
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AN3585
MC13853
QFN16
AN3585
c337 transistor
C338
c341 transistor
MMM7210
C337
C339
C340
C341
C342
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lt1085 linear
Abstract: linear handbook LT1085-5 MOTOROLA linear handbook C51012-1 EP1S60 LT1573 MS-034 BGA956 Lt1649
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix devices. This section contains the required PCB layout guidelines and package specifications. This section contains the following chapters:
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EL7551C
EL7564C
EL7556BC
EL7562C
EL7563C
lt1085 linear
linear handbook
LT1085-5
MOTOROLA linear handbook
C51012-1
EP1S60
LT1573
MS-034
BGA956
Lt1649
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IPC-7711
Abstract: JEDEC J-STD-033b IPC 7721 J-STD-033b.1 JEDEC J-STD-033b.1 paste profile IPC7711 IPC-7721 thermal pcb guidelines to48c
Text: Application Note Soldering Guidelines for Module PCB Mounting Rev 15 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’ module products.
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FBGA-484 datasheet
Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:
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Packa35
152-pin
FBGA-484 datasheet
MS-034 1152 BGA
484-pin BGA
JEDEC FBGA
moisture sensitivity
AGX52014-1
MS-034
EP1AGX90
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PL-PLCC44-S-01
Abstract: PL-PLCC44-S-02
Text: 18.42mm [0.725"] 13.31mm [0.524"] 1 0.61mm [0.024"] strain relief standoff 17.42mm [0.686"] 14.66mm [0.577"] 18.42mm [0.725"] 0.050" typ. Ø 3.18mm [Ø 0.125"] 8.71mm [0.343"] 10.16mm [0.400"] Recommended PCB layout Top, X-ray view of PCB solder side 16.15mm [0.636"]
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PL-PLCC44-S-01)
PL-PLCC44-S-02
PL-PLCC044-S-02
PL-PLCC44-S-01
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