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    PCB WARPAGE SPEC Search Results

    PCB WARPAGE SPEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MQ80960MC-25/B-SPECIAL Rochester Electronics LLC 80960MC - 32-Bit Microprocessor With Floating Point Unit and MMU (Special) Visit Rochester Electronics LLC Buy
    9513ADC-SPECIAL Rochester Electronics 9513A - Rochester Manufactured 9513, System Timing Controller Visit Rochester Electronics Buy
    MSPEC2L0B5010 Amphenol Communications Solutions SPE Cable Assembly, IP20 Plug to IP20 Plug, 0.5m Visit Amphenol Communications Solutions
    MSPEC6P2AE010 Amphenol Communications Solutions SPE IP67 Cable Assembly, IP67 Plug on one end and Pigtail on other end, 5.0m Visit Amphenol Communications Solutions
    MSPEC2L0B3010 Amphenol Communications Solutions Single Pair Ethernet cable assemblies IP20 plug both end, MSPE series Visit Amphenol Communications Solutions

    PCB WARPAGE SPEC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA 1207 socket F

    Abstract: pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing
    Text: SOCKET F 1207 Application Specification 114-5383 7 MAY ‘07 Rev.C 1. INTRODUCTION This specification covers the requirements for application of lever-actuated Socket F 1207 position onto printed circuit (pc) boards. These sockets accept 1207-position LGA package


    Original     		PDF 1207-position LGA 1207 socket F pcb warpage after reflow pcb warpage* in smt reflow amd socket 1207 MMC socket Socket-F Tyco LGA 1207 socket F datasheet SN63 PB37 THERMO PROFILES transistor 1207 PEAK tray drawing

    DNP1105W

    Abstract: pcb warpage DNP1102F PS1191RA LED Tr 1105W AN1101W AN1102F ps1101wa AN1105W
    Text: SMT SHAPE - INFRARED LED n Infrared LED Shape Part No. Ta=25°C Features Peak Wavelength lP TYP. IF Radiant Intensity IE MIN. TYP. IF Output Power Po Cut-Off Frequency Fc TYP. MIN. TYP. IF Spatial Distribution The typical distribution example of each shape is shown below


    Original     		PDF DNP1101W AN1101W DNP1102W 1102HA-1192HA 1192FA 105W-RR DNP1105W pcb warpage DNP1102F PS1191RA LED Tr 1105W AN1101W AN1102F ps1101wa AN1105W

    TRANSISTOR DNH

    Abstract: PS5022 PS1191RA PP1101W PS1101RA PS1101WA PS1102HA PS1192FA PS1192HA peak spectral response 900 nm photo detector
    Text: CHARACTERISTICS AND ABSOLUTE MAXIMUM RATING BY MATERIAL n Photo Transistor Through-Hole Shape Absolute Maximum Ratings Collector-Emitter Emitter-Collector Breakdown Collector Breakdown Collector Operating Voltage Dissipation Voltage Current Temp. Part Number


    Original     		PDF 30MIN. 15MIN. 17MIN. 14MIN. TRANSISTOR DNH PS5022 PS1191RA PP1101W PS1101RA PS1101WA PS1102HA PS1192FA PS1192HA peak spectral response 900 nm photo detector

    LGA1366

    Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
    Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA


    Original     		PDF LGA1366 LGA1366 1366-position 016mm Table12. Table12 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow

    DIODE PP602

    Abstract: pp602 PP701 pp601 40 PP601 PP1101W PS1101RA PS1101WA PS1102HA PS1191RA
    Text: CHARACTERISTICS AND ABSOLUTE MAXIMUM RATING BY MATERIAL n Photo Transistor Through-Hole Shape Absolute Maximum Ratings Collector-Emitter Emitter-Collector Breakdown Collector Breakdown Collector Operating Voltage Dissipation Voltage Current Temp. Part Number


    Original     		PDF

    OMAP4

    Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera OMAP35xx lf4300 solder dipping pop
    Text: Application Report SPRAAV2 – April 2008 PCB Assembly Guidlines for 0.4mm Package-On-Package PoP Packages, Part II Keith Gutierrez and Gerald Coley .


    Original     		PDF OMAP35xx OMAP4 LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera lf4300 solder dipping pop

    Senju M705

    Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
    Text: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT


    Original     		PDF SWPA156 Senju M705 Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar

    Untitled

    Abstract: No abstract text available
    Text: NUMBER TYPE Application Specification GS-20-0355 TITLE PAGE REVISION 1 of 9 BTFW シリーズ（1.0mm 千鳥ﾋﾟｯﾁボード to ボードコネクタ） BTFW series 1.0mm staggered pitch Board to Board connector A AUTHORIZED BY DATE M.Koga 9/18/2012


    Original     		PDF GS-20-0355 Sep/18/â GS-01-001 E-3727

    Lead Free reflow soldering profile BGA

    Abstract: XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile
    Text: Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 v1.0 December 9, 2002 Summary The primary purpose of solder reflow process is to wet the surfaces to be joined to form a strong metallurgical bond between the component and the PC board.


    Original     		PDF XAPP425 Lead Free reflow soldering profile BGA XAPP425 C-150 reflow temperature bga reflow soldering profile BGA BGA PROFILING BGA PACKAGE thermal profile

    BR1112H

    Abstract: DG1112H PG1112H PY1112H pcb warpage* in smt reflow pcb warpage after reflow BG1112H 1112H AA1112H AY1112H
    Text: Product Guide 1112H Series Thin Type SMT LED • Features ■ Applications • Meets industry standards for 2012 0806 footprint • 2.0mm (L) x 1.25mm (W) x 0.8mm (H) • 1112H is 50% thinner than the W series. • Membrane switch panels • Backlighting


    Original     		PDF 1112H BR1112H 1112H-0301 800-LED-LCD1 BR1112H DG1112H PG1112H PY1112H pcb warpage* in smt reflow pcb warpage after reflow BG1112H AA1112H AY1112H

    WS609

    Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
    Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is


    Original     		PDF XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate

    MOLEX 24 pin right angle connector

    Abstract: right angle 20 pin pcb header connector Molex 87667 right angle 40 pin male connector
    Text: PowerPlus SSI Expandable Power & Signal PowerPlusTM (SSI) Expandable Power & Signal Connectors INTRODUCTION Molex’s successfully introduced a new series of power connectors that conform to Server System Infrastructure (SSI) open specification (http://www.ssiforum.org). The DPS and MPS offer a standard


    Original     		PDF 1-800-78Molex MOLEX 24 pin right angle connector right angle 20 pin pcb header connector Molex 87667 right angle 40 pin male connector

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    BGA PROFILING

    Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		PDF 20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile

    pbga package weight

    Abstract: mindspeed pbga Cold solder joint
    Text: 500154B December 18, 2001 Plastic BGA Surface Mount Application Note Introduction One of the greatest advantages of the Plastic Ball Grid Array PBGA package is that it is typically placed onto printed circuit boards and assembled using existing surface mount


    Original     		PDF 500154B 225-pin pbga package weight mindspeed pbga Cold solder joint

    iso 7810 warpage

    Abstract: iso 7810 LTL2651 connector pcb mounted strain smart AMP Micro-MaTch Miniature Connector Tyco Electronics IDC
    Text: 108 – 15238 Product Specification 21/FEB/05 Rev. C Smart Card Connectors, Top Mount “The product may not perform according to the product specification if precautions have not been taken in the application to provide mechanical stability of the connector in relation to its mating parts”.


    Original     		PDF 21/FEB/05 21-Feb-05 R6-77 iso 7810 warpage iso 7810 LTL2651 connector pcb mounted strain smart AMP Micro-MaTch Miniature Connector Tyco Electronics IDC

    microfocus x-ray

    Abstract: omron* AOI VT-X700 X-RAY INSPECTION q319 A902 X700 8kva 130322 A-902
    Text: N EW Specifications • Hardware configuration/function specifications High-speed Automated X-Ray Inspection System Description Item VT-X700 VT-X700-M Model Sealed microfocus X-ray source Flat panel type Detector 1,550 x 1,650 × 1,620 mm Device dimensions


    Original     		PDF VT-X700 VT-X700-M 45onal microfocus x-ray omron* AOI VT-X700 X-RAY INSPECTION q319 A902 X700 8kva 130322 A-902

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    "0.4mm" bga "ball collapse" height

    Abstract: BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package 304 QFP amkor BGA and QFP Package ibm paste profile pitch 0.4mm BGA pcb warpage* in smt reflow Amkor SBGA
    Text: Applications Notes on Surface Mount Assembly of Amkor/Anam PBGA and SuperBGA Packages Paul Mescher October, 1995 amkor anam 1347 N. Alma School Road Chandler, AZ 85224 1.0 Introduction Ball Grid Array packages provide a new challenge for the surface mount industry. In all


    Original     		PDF

    entek Cu-56

    Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
    Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.


    Original     		PDF 20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile

    entek Cu-56

    Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		PDF Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability

    Untitled

    Abstract: No abstract text available
    Text: BUCHANAN Series PCB card edge connectors Model PCB3A • Convenient PCB connection for areas close to vertical surfaces ■ Corrugated socket walls minimize warpage and maximize heat dissipation ■ Also suitable to free standing, surface, panel mount or card cage mounting


    OCR Scan     		PDF LR25557 MIL-C-21097