PCN0808
Abstract: EPM3128ATC100-10 EPM240T100C5N EPM3064ATC100-10 EPM3064ATC100-10N EPM570T100C5 EPM570T100I5N EPM570T100C5N EPM3064ATC44-10 EPM3256ATC144-10
Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0808 WIRE-BOND DIAMETER REDUCTION FOR SELECTED TQFP PACKAGES Change Description Altera is implementing bond wire diameter reduction from 1.0 mil to 0.8 mil on product lines assembled in the TQFP package. This change will be implemented on selected MAX CPLD and
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PCN0808
40T100C5AA
EPM240T100C5N
EPM240T100C5NRR
EPM240T100C5RR
EPM240T100C5TT
EPM240T100I5
EPM240T100I5N
EPM240T100I5NRR
EPM240T100I5RR
PCN0808
EPM3128ATC100-10
EPM240T100C5N
EPM3064ATC100-10
EPM3064ATC100-10N
EPM570T100C5
EPM570T100I5N
EPM570T100C5N
EPM3064ATC44-10
EPM3256ATC144-10
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PCN0801
Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera
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PCN0801
PCN0801;
PCN0801
hitachi epoxy en4900
Ablestik 8290
en4900
EN-4900
hitachi en4900
epcs1n
Nitto* mp8000ch4
epoxy 8290
mp8000ch4
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RV3029C2
Abstract: OT7602C1 RV-3029
Text: Tel: +44 1460 256 100 Fax: +44 1460 256 101 www.golledge.com Golledge Electronics Ltd Eaglewood Park, ILMINSTER Somerset, TA19 9DQ, UK END OF LIFE WARNING Document ref: Issued: Authorised: PCN080702A v3.0 14 Oct 08 JPG Product affected OT7602C1 Description
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PCN080702A
OT7602C1
RV3029C2
768kHz.
OT7602C1
RV3029C2
RV-3029
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GXO-4301
Abstract: OV1564C2 OV7604C7
Text: Tel: +44 1460 256 100 Fax: +44 1460 256 101 www.golledge.com Golledge Electronics Ltd Eaglewood Park, ILMINSTER Somerset, TA19 9DQ, UK END OF LIFE WARNING Document ref: Issued: Authorised: PCN080702B v2.0 21 Jul 08 JPG Product affected OV1564C2 Description
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PCN080702B
OV1564C2
GXO-4301
OV7604C7
768kHz.
OV1564C2
GXO-4301
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FCI Connector
Abstract: colour change led Specialists numbers
Text: Product/Process Change Notification PCN08172 Product: Micropax Connectors Product Manager: Jorge Ramirez Distribution: GLOBAL Part Numbers Concerned: See list attached Issue Date: 19 Nov, 2008 Page s : 1/1 Subject: Micropax™ Connectors; Inner-colour Change Only
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PCN08172
E-3519
GS-23-018
FCI Connector
colour change led
Specialists
numbers
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Untitled
Abstract: No abstract text available
Text: Product/Process Change Notification PCN08114 Product: Mini and Maxi PV CTW Gold Products Product Manager: Missy Grubb Distribution: Part Numbers Concerned: See attached list Issue Date: August 26, 2008 Page s : 1/1 Global Subject: Plating change on the backside of the Gold plated Mini and Maxi PV® CTW products FOR
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PCN08114
-000LF
E-3519
GS-23-018
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PCN0813
Abstract: EPM240T100C5N EP1C3T144C8N EPM240T100I5N EPM1270T144C5N EPM570T144C5N EPM240T100C5 EPM570T100C5N EPM2210F256A5N f324
Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0813 POLYIMIDE WAFER COAT REMOVAL FOR SELECTED ALTERA DEVICES Change Description Altera is implementing a change to the wafer coat on selected product lines fabricated at Taiwan Semiconductor Manufacturing Co. TSMC . This change includes the exclusion of the existing
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PCN0813
PM2210GF256C5N
EPM2210GF256C5RR
EPM2210GF256I5
EPM2210GF256I5N
EPM2210GF324C3
EPM2210GF324C3N
EPM2210GF324C4
EPM2210GF324C4N
EPM2210GF324C5
PCN0813
EPM240T100C5N
EP1C3T144C8N
EPM240T100I5N
EPM1270T144C5N
EPM570T144C5N
EPM240T100C5
EPM570T100C5N
EPM2210F256A5N
f324
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PCN0802
Abstract: ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc
Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0802 ADDITIONAL TSMC WAFER FABRICATION SITE FOR CYCLONE III FPGAs Change Description Altera will begin manufacturing and shipping Cyclone III FPGAs out of Taiwan Semiconductor Manufacturing Company TSMC wafer FAB 14, located in Tainan, Taiwan.
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PCN0802
JESD46-C,
PCN0802
ALTERA PART MARKING
EP3C10
EP3C120
EP3C16
EP3C25
EP3C40
EP3C55
EP3C5
tsmc
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FCI Connector
Abstract: mobile phone PCN08139 latch headers
Text: Product/Process Change Notification PCN08139 Product: ClincherTM Latch Header Connectors Product Manager: Alejandro Aguirre Distribution: GLOBAL Part Numbers Concerned: See list attached Issue Date: Oct 3 08 Page s : 1/1 Subject: ClincherTM Latch Header Connectors color change only
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PCN08139
E-3519
GS-23-018
FCI Connector
mobile phone
PCN08139
latch headers
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PCN0803
Abstract: TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020
Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0803 PACKAGE-LID STIFFENER CHANGE FOR THE STRATIX FLIP-CHIP FAMILY Change Description Altera is introducing a dimension change to the package-lid stiffener for the Stratix FPGA flip-chip package. This effectively reduces the overall package height by approximately 0.2mm. This change
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PCN0803
J-STD-020C)
JESD46-C,
PCN0803
TI date code
altera date code format
marking ic 2008
EP1S60
stiffener
ALTERA BGA packages PART MARKING
date code marking stratix traceability
FC1020
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HI3186PST
Abstract: No abstract text available
Text: ARINC 429 Differential Line Driver Die Change for HI-3186PSx Product Change Notice PCN0812 v1.0 December 02, 2008 Overview This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3186PSx. Description The new design has been characterized against all requirements of the ARINC 429 specification and the Holt HI-3186PSx
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HI-3186PSx
HI-3186PSx.
PCN0812
HI-3186PSx
1403186PSx
JESD46-C,
QR-8048
HI3186PST
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Untitled
Abstract: No abstract text available
Text: HI-6110 Die Revision and Data Sheet Change Product Change Notice PCN0801 v1.0 May 14, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.
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HI-6110
PCN0801
DS6110
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HI-8588PST
Abstract: HI8588PSIf HI-8588PSI-10 HI-8588CRT-10
Text: Wafer Fab Process Transfer for HI-8382/8383 & HI-8588/8588-10 Series of ARINC 429 Products Product Change Notice PCN0811 v1.0 December 02, 2008 Overview The purpose of this notice is to announce the completed transfer of the Holt devices manufactured using the 100mm 4.0um
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HI-8382/8383
HI-8588/8588-10
100mm
150mm
PCN0811
QR-8005
HI8590
QR-8006
HI-8588PST
HI8588PSIf
HI-8588PSI-10
HI-8588CRT-10
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HI-1574CDI
Abstract: HI1573CDM hi-1573cdm HI-8382CM-21 HI-3282CD 6010CM-10 QR-8050 HI-1573CDI
Text: New Assembly Supplier: Criteria Labs Austin, Texas Product Change Notice PCN0810 v1.0 December 02, 2008 Overview The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.
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PCN0810
QR-8050
HI-1574CDI
HI1573CDM
hi-1573cdm
HI-8382CM-21
HI-3282CD
6010CM-10
HI-1573CDI
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Device Marking Convention
Abstract: Holt Integrated Circuits DS3587 PCN0802
Text: Marking and Data Sheet Change for HI-3585 Series of ARINC 429 SPI Interface Products Product Change Notice PCN0802 v1.0 May 14, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side
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HI-3585
PCN0802
HI-3585,
HI-3587
HI-3588
JESD46-C,
DS3585
DS3587
DS3588
Device Marking Convention
Holt Integrated Circuits
PCN0802
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SUMITOMO EME G600
Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
Text: 32 & 64-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0809 (v1.0) September 12, 2008 Overview This notice describes the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.
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64-Lead
32-Lead
PCN0809
7351LS,
JESD46-C,
QR-8036
SUMITOMO EME G600
EME G600
Moisture Sensitivity Level Rating
8050P
sumitomo lcd
1575P
JESD46-C
pc/SUMITOMO g600
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Alternative
Abstract: No abstract text available
Text: Product/Process Change Notification PCN08044 Product: PCIe Product Manager: Alan Lo Distribution: GLOBAL Part Numbers Concerned: See attached list Issue Date: March 28, 2008 Page s : 1/3 Subject Product Design Change Nature of Change: Since the global raw materials are rising up rapidly, FCI decided to implement product
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PCN08044
E-3519
GS-23-018
10046742-xxxxxTLF
Alternative
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FCI Connector
Abstract: card fci Transistor Equivalent list transistor marking code transistor marking codes date code marking diode marking code marking codes transistor mark code PCN-08
Text: Product/Process Change Notification PCN08156 Part Numbers Concerned: All Power Edge Card series. See attached list Issue Date: 8th Nov 2008 Page s : 1/2 Product: Power Edge Card Connector Product Manager: Sally Luo Distribution: Active and Contract Customers
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PCN08156
E-3519
GS-23-018
FCI Connector
card fci
Transistor Equivalent list
transistor marking code
transistor marking codes
date code marking
diode marking code
marking codes
transistor mark code
PCN-08
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PCN0805
Abstract: jedec jesd22-a108 epcs16n altera epcs16n altera marking EPCS16 EPCS128SI16N EPCS4SI8N EPCS16SI8N altera marking EPCS16si16n EPCS16
Text: Revision: 1.6.0 PROCESS CHANGE NOTIFICATION PCN0805 WAFER FABRICATION SITE CHANGE FOR SERIAL CONFIGURATION DEVICES Change Description This is an update to PCN0805; please see the revision history table for information specific to this update. Serial Configuration devices, currently manufactured in the Numonyx Catania Italy fabrication
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PCN0805
PCN0805;
EPCS64
EPCS16)
JESD22-A108
JESD22-A103
JESD22
-A114
-A115
PCN0805
jedec jesd22-a108
epcs16n
altera epcs16n
altera marking EPCS16
EPCS128SI16N
EPCS4SI8N
EPCS16SI8N
altera marking EPCS16si16n
EPCS16
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HI-6110
Abstract: No abstract text available
Text: HI-6110 Die Revision and Data Sheet Change Product Change Notice PCN0807 v1.0 December 12, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.
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HI-6110
PCN0807
JESD46-C,
DS6110
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CA92691
Abstract: QR-0813
Text: 44L TQFP Package Lead Formation Change Product Change Notice PCN0803 v1.0 May 28, 2008 Overview The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation. Description Holt Integrated Circuits’ qualified subcontractor CEI, has retooled the lead formation for the 44L TQFP (PTQS) from the
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PCN0803
JESD46-C,
QR-0813
CA92691
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DAP 08
Abstract: No abstract text available
Text: 44L PLCC Package & DAP Size Standardization Product Change Notice PCN0804 v1.0 June 30, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.
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PCN0804
JESD46-C,
QR-8016
DAP 08
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die changes
Abstract: No abstract text available
Text: ARINC 429 Differential Line Driver Die Change for 3182PSx-N Product Change Notice PCN0808 v1.0 November 12, 2008 Overview This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the 3182PSx-N. Description The new design has been characterized against all requirements of the ARINC 429 specification and the Holt HI-3182PSx-N
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3182PSx-N
3182PSx-N.
PCN0808
HI-3182PSx-N
14082PSI-N
JESD46-C,
QR-8048
die changes
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HI-8010Q
Abstract: HI3584PQI-10 HI3584PQT HI-3584PQT HI-3584PQTF-10 HI-3584PQI-10 HI-6110PQT 8583P 8010Q Moisture Sensitivity Level Rating
Text: 52-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0805 (v1.0) September 12, 2008 Overview This notice describes the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
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52-Lead
PCN0805
7351LS,
6600CGL,
JESD46-C,
QR-8013
HI-8010Q
HI3584PQI-10
HI3584PQT
HI-3584PQT
HI-3584PQTF-10
HI-3584PQI-10
HI-6110PQT
8583P
8010Q
Moisture Sensitivity Level Rating
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