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    PGA JEDEC TRAY Search Results

    PGA JEDEC TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    A82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, CPGA132, PGA-132 Visit Rochester Electronics LLC Buy
    EP1810GI-35 Rochester Electronics LLC UV PLD, 35ns, CPGA68, WINDOWED, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy
    MG8097BH/BZA Rochester Electronics LLC Microcontroller, 16-Bit, EPROM, 12MHz, NMOS, CPGA68, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy
    EP1810GC-35 Rochester Electronics LLC UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy
    MG80C186XL-20 Rochester Electronics LLC Microprocessor, 16-Bit, 20MHz, CMOS, CPGA68, CERAMIC, PGA-68 Visit Rochester Electronics LLC Buy

    PGA JEDEC TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LA-072

    Abstract: PGA JEDEC tray 216-0016
    Text: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld A D (Bottom View) J I G H Index mark Orientation pin N K L φM E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.


    Original     		PDF LA-072 X528R-50A1 LA-072 PGA JEDEC tray 216-0016

    PGA weight

    Abstract: jedec bottom LA-072 PGA JEDEC tray
    Text: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld (Bottom View) A D Index mark Index mark I V W L φM M F E G J NOTE Each lead centerline is located within φ 0.254 mm (φ 0.01 inch) of its true position (T.P.) at maximum material condition.


    Original     		PDF LA-072 X528R-50A-1 PGA weight jedec bottom LA-072 PGA JEDEC tray

    PGA weight

    Abstract: PGA JEDEC tray
    Text: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Seam Weld A B D P C Q (Bottom View) R H G S T J I Index mark K L φM N E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.


    Original     		PDF LA-A76 061MAX. X447RJ-50A PGA weight PGA JEDEC tray

    PGA weight

    Abstract: NEC 1169
    Text: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Metal Slug A V W2 (Bottom View) X D P W1 Q 2-10-32UNF 2-M3 R S I J Index mark H G N E K L φM M F X447RP-50A NOTE Each lead centerline is located within φ 0.254 mm ( φ 0.010 inch) of its true position (T.P.) at


    Original     		PDF LA-A76 2-10-32UNF X447RP-50A PGA weight NEC 1169

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    JEDEC to 243

    Abstract: PGA JEDEC tray
    Text: 53.1 62.0 37.0 A A' 60.8 243.2 315.0 322.6 35.9 3M 21001-301 53.1 PGA 20x20 SECTION A – A' 53.1 12.2 8.6 10.2 135.9 UNIT : mm Applied Package Quantity (pcs) 447-pin ceramic PGA MAX. 10 Tray Material Heat Proof Temp. Surface resistance PGA 20×20 Carbon fiber PC


    Original     		PDF 447-pin JEDEC to 243 PGA JEDEC tray

    PGA JEDEC tray

    Abstract: 3M 21001 528pin
    Text: 37 55.7 62 135.9 UNIT : mm A A' 55.7 73.5 47.3 220.5 315.0 322.6 3M21001-302 PGA 21x21–155 SECTION A-A' 8.6 12.2 10.2 55.7 Applied Package Quantity (pcs) 528-pin •ceramic PGA MAX. 8 Tray Material Heat Proof Temp. PGA 21×21 Carbon fiber PC 105°C Surface resistance less than 1×1012 Ω /


    Original     		PDF 3M21001-302 528-pin PGA JEDEC tray 3M 21001 528pin

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


    Original     		PDF

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    CS5345-CQZ

    Abstract: No abstract text available
    Text: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at


    Original     		PDF CS5345 24-Bit, CS5345 24-bit DS658F4 CS5345-CQZ

    LQFP Package tray

    Abstract: No abstract text available
    Text: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at


    Original     		PDF CS5345 24-Bit, CS5345 24-bit 12POSE, DS658PP2 LQFP Package tray

    Untitled

    Abstract: No abstract text available
    Text: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at


    Original     		PDF CS5345 24-Bit, CS5345 24-bit DS658F1

    bp-1200 operator manual

    Abstract: BP-1200 80 pin simm flash programmer BP 1200 users manual BP 4100 users manual Flash SIMM 80 programmer lcc 28 socket 40 pin eprom programmer circuit 80 lead flash simm programmer socket cpld
    Text: BP MICROSYSTEMS UNIVERSAL DEVICE PROGRAMMER 520 BP-1200 The BP-1200 uses the newest technology to satisfy the programming requirements of both engineering and • New technology provides price and performance production users at a reasonable price. breakthrough


    Original     		PDF BP-1200 BP-1200 635mm) bp-1200 operator manual 80 pin simm flash programmer BP 1200 users manual BP 4100 users manual Flash SIMM 80 programmer lcc 28 socket 40 pin eprom programmer circuit 80 lead flash simm programmer socket cpld

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    AES17-1991

    Abstract: CDB5345 CS4245 CS5345 CS5345-CQZ CS5345-CQZR
    Text: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at


    Original     		PDF CS5345 24-Bit, 24-bit CS4245 DS658F2 AES17-1991 CDB5345 CS4245 CS5345 CS5345-CQZ CS5345-CQZR

    CS5346DQZR

    Abstract: No abstract text available
    Text: CS5346 103-dB, 192-kHz, Stereo Audio ADC with 6:1 Input Mux ADC Features General Description  Multi-bit Delta Sigma Modulator The CS5346 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5346 performs stereo analog-to-digital A/D conversion of 24-bit serial values at sample


    Original     		PDF CS5346 103-dB, 192-kHz, CS5346 24-bit DS861PP2 CS5346DQZR

    AFE5807

    Abstract: AFE5808
    Text: AFE5807 www.ti.com SLOS703 – SEPTEMBER 2010 Fully Integrated, 8-Channel Ultrasound Analog Front End for Ultrasound with Passive CW Mixer, 0.75 nV/rtHz, 12/14-Bit, 65 MSPS, 141 mW/CH FEATURES DESCRIPTION • The AFE5807 is a highly integrated Analog Front-End


    Original     		PDF AFE5807 SLOS703 12/14-Bit, AFE5807 AFE5808