PGA144
Abstract: 144 PGA 144 pin pga 81F64842B Atmel DATE CODE PGA-120 PGA 84 PGA84 PGA120
Text: 68 pins PGA Ceramic Pin Grid Array PGA Package Outlines Code:8M Date: 15/12/95 Rev. B – 23/08/01 1 PGA 84 pins PGA Code 8R Date: 21/07/00 2 Rev. B – 23/08/01 100 pins PGA Code:GT Date: 14/06/00 3 PGA Rev. B – 23/08/01 PGA 120 pins PGA Code:GU Date: 25/06/99
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: : Package Diagram PGA Module 401-Pin PGA Module PG02 1 : Package Diagram 401-Pin PGA Module PG03 2
|
Original
|
PDF
|
401-Pin
|
PGA-321C-A02
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 321 PIN CERAMIC To Top / Package Lineup / Package Index PGA-321C-A02 321-pin ceramic PGA Lead pitch 2.54 interstitial Pin matrix 33 Sealing method Metal seal PGA-321C-A02 321-pin ceramic PGA (PGA-321C-A02)
|
Original
|
PDF
|
PGA-321C-A02
321-pin
PGA-321C-A02)
R321002SC-3-2
PGA-321C-A02
|
27-207
Abstract: PGA-401C-A02
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 401 PIN CERAMIC To Top / Package Lineup / Package Index PGA-401C-A02 401-pin ceramic PGA Lead pitch 2.54 interstitial Pin matrix 37 Sealing method Metal seal PGA-401C-A02 401-pin ceramic PGA (PGA-401C-A02)
|
Original
|
PDF
|
PGA-401C-A02
401-pin
PGA-401C-A02)
R401002SC-2-2
27-207
PGA-401C-A02
|
361 pin
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 361 PIN CERAMIC To Top / Package Lineup / Package Index PGA-361C-A01 361-pin ceramic PGA Lead pitch 2.54 interstitial Pin matrix 35 Sealing method Metal seal PGA-361C-A01 361-pin ceramic PGA (PGA-361C-A01)
|
Original
|
PDF
|
PGA-361C-A01
361-pin
PGA-361C-A01)
R361002SC-2-2
361 pin
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 135 PIN CERAMIC To Top / Package Lineup / Package Index PGA-135C-A06 135-pin ceramic PGA Lead pitch 100 mil Pin matrix 14 Sealing method Metal seal PGA-135C-A06 135-pin ceramic PGA (PGA-135C-A06) 2.54±0.25
|
Original
|
PDF
|
PGA-135C-A06
135-pin
PGA-135C-A06)
R135013SC-2-2
Custome-A06)
|
PGA-321
Abstract: PGA-321C-A02
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 321 PIN CERAMIC PGA-321C-A02 321-pin ceramic PGA Lead pitch 2.54 interstitial Pin matrix 33 Sealing method Metal seal PGA-321C-A02 321-pin ceramic PGA (PGA-321C-A02) 43.18 ± 0.50 SQ (1.700 ± .020)
|
Original
|
PDF
|
PGA-321C-A02
321-pin
PGA-321C-A02)
R321002SC-3-2
PGA-321
PGA-321C-A02
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 299 PIN CERAMIC PGA-299C-A02 299-pin ceramic PGA Lead pitch 2.54 mil Pin matrix 20 Sealing method Metal seal PGA-299C-A02 299-pin ceramic PGA (PGA-299C-A02) 0.46 +– 0.13 0.08 (.018 +– .005 .003 )
|
Original
|
PDF
|
PGA-299C-A02
299-pin
PGA-299C-A02)
R299002SC-1-2
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 149 PIN CERAMIC PGA-149C-A06 149-pin ceramic PGA Lead pitch 100 mil Pin matrix 15 Sealing method Metal seal PGA-149C-A06 149-pin ceramic PGA (PGA-149C-A06) 2.54 ± 0.25 (.100 ± .010) 36.00 (1.417)
|
Original
|
PDF
|
PGA-149C-A06
149-pin
PGA-149C-A06)
R149008SC-1-2
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 299 PIN CERAMIC To Top / Package Lineup / Package Index PGA-299C-A02 299-pin ceramic PGA Lead pitch 2.54 mil Pin matrix 20 Sealing method Metal seal PGA-299C-A02 299-pin ceramic PGA (PGA-299C-A02) 0.46 +– 0.13
|
Original
|
PDF
|
PGA-299C-A02
299-pin
PGA-299C-A02)
R299002SC-1-2
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 441 PIN CERAMIC To Top / Package Lineup / Package Index PGA-441C-A01 441-pin ceramic PGA Lead pitch 50 mil Pin matrix 27 Sealing method Metal seal PGA-441C-A01 441-pin ceramic PGA (PGA-441C-A01) 3-C/0.50
|
Original
|
PDF
|
PGA-441C-A01
441-pin
PGA-441C-A01)
R441001SC-1-3
|
50 mil pitch ceramic package
Abstract: a06 transistor PGA-441C-A06 PGA44
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 441 PIN CERAMIC To Top / Package Lineup / Package Index PGA-441C-A06 441-pin ceramic PGA Lead pitch 50 mil Pin matrix 27 Sealing method Metal seal PGA-441C-A06 441-pin ceramic PGA (PGA-441C-A06) 0.20 ± 0.05
|
Original
|
PDF
|
PGA-441C-A06
441-pin
PGA-441C-A06)
R441006SC-1-2
with41-pin
50 mil pitch ceramic package
a06 transistor
PGA-441C-A06
PGA44
|
fujitsu
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 401 PIN CERAMIC To Top / Package Lineup / Package Index PGA-401C-A04 401-pin ceramic PGA Lead pitch 1.27 mm Pin matrix 30 Sealing method Metal seal PGA-401C-A04 401-pin ceramic PGA (PGA-401C-A04) 0.20 ± 0.05
|
Original
|
PDF
|
PGA-401C-A04
401-pin
PGA-401C-A04)
R401005SC-1-2
fujitsu
|
PGA257-C-S19U-2
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A02 EIAJ code : ∗PGA257-C-S19U-2 256-pin ceramic PGA Number of pins 257 pins includes extra index pin Lead pitch 100mil Pin matrix 19 Sealing method Metal seal (PGA-256C-A02) 256-pin ceramic PGA (PGA-256C-A02)
|
Original
|
PDF
|
PGA-256C-A02
PGA257-C-S19U-2
100mil
256-pin
PGA-256C-A02)
R256002SC-4-2
PGA257-C-S19U-2
|
|
PGA-401C-A02
Abstract: 401C
Text: PIN GRID ARRAY PACKAGE 401 PIN CERAMIC PGA-401C-A02 Lead pitch 2.54 interstitial Pin matrix 37 Sealing method Metal seal 401-pin ceramic PGA PGA-401C-A02 401-pin ceramic PGA (PGA-401C-A02) 48.26 ± 0.55 SQ (1.900 ± .022) 2.54 (.100) TYP 0.40 ± 0.10 DIA
|
Original
|
PDF
|
PGA-401C-A02
401-pin
PGA-401C-A02)
R401002SC-2-2
PGA-401C-A02
401C
|
PGA107-C-S12U-2
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 107 PIN CERAMIC PGA-107C-A02 EIAJ code :∗PGA107-C-S12U-2 107-pin ceramic PGA Lead pitch 100 mil Pin matrix 12 Sealing method Metal seal PGA-107C-A02 107-pin ceramic PGA (PGA-107C-A02) 2.54 ± 0.25
|
Original
|
PDF
|
PGA-107C-A02
PGA107-C-S12U-2
107-pin
PGA-107C-A02)
R107002SC-3-2
PGA107-C-S12U-2
|
PGA-121C-A01
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 121 PIN CERAMIC PGA-121C-A01 EIAJ code : HPGA121-C-S13D-1 121-pin ceramic PGA Lead pitch 100 mil Pin matrix 13 Sealing method Metal seal PGA-121C-A01 121-pin ceramic PGA (PGA-121C-A01) 2.54 ± 0.25
|
Original
|
PDF
|
PGA-121C-A01
HPGA121-C-S13D-1
121-pin
PGA-121C-A01)
R121001SC-4-3
not100
PGA-121C-A01
|
PGA-179C-A06
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 179 PIN CERAMIC To Top / Package Lineup / Package Index PGA-179C-A06 179-pin ceramic PGA Lead pitch 100 mil Pin matrix 16 Sealing method Metal seal PGA-179C-A06 179-pin ceramic PGA (PGA-179C-A06) 2.54 ± 0.25
|
Original
|
PDF
|
PGA-179C-A06
179-pin
PGA-179C-A06)
R179009SC-1-2
docume17)
PGA-179C-A06
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 149 PIN CERAMIC To Top / Package Lineup / Package Index PGA-149C-A06 149-pin ceramic PGA Lead pitch 100 mil Pin matrix 15 Sealing method Metal seal PGA-149C-A06 149-pin ceramic PGA (PGA-149C-A06) 2.54 ± 0.25
|
Original
|
PDF
|
PGA-149C-A06
149-pin
PGA-149C-A06)
R149008SC-1-2
|
TYP 256
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN CERAMIC To Top / Package Lineup / Package Index PGA-256C-A04 256-pin ceramic PGA Lead pitch 100 mil Pin matrix 19 Sealing method Metal seal PGA-256C-A04 256-pin ceramic PGA (PGA-256C-A04) 3.40 +– 0.41
|
Original
|
PDF
|
PGA-256C-A04
256-pin
PGA-256C-A04)
R256006SC-3-2
TYP 256
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A03 256-pin ceramic PGA Lead pitch 100mil Pin matrix 19 Sealing method Metal seal PGA-256C-A03 256-pin ceramic PGA (PGA-256C-A03) 0.46 +– 0.13 0.05 DIA (.018 +– .005 .002 ) 2.54 (.100) MAX C1.02 (.040) TYP
|
Original
|
PDF
|
PGA-256C-A03
100mil
256-pin
PGA-256C-A03)
R256003SC-3-2
|
a06 transistor
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE 135 PIN CERAMIC PGA-135C-A06 135-pin ceramic PGA Lead pitch 100mil Pin matrix 14 Sealing method Metal seal PGA-135C-A06 135-pin ceramic PGA (PGA-135C-A06) 2.54±0.25 (.100±.010) 1.60(.063) MAX 15.01(.591) DAI TYP 1.27(.050)TYP DIA
|
Original
|
PDF
|
PGA-135C-A06
100mil
135-pin
PGA-135C-A06)
R135013SC-2-2
a06 transistor
|
361-Pin
Abstract: 361 pin
Text: PIN GRID ARRAY PACKAGE 361 PIN CERAMIC PGA-361C-A01 Lead pitch 2.54 interstitial Pin matrix 35 Sealing method Metal seal 361-pin ceramic PGA PGA-361C-A01 361-pin ceramic PGA (PGA-361C-A01) 45.72 ± 0.53 SQ (1.800 ± .021) 2.54 (.100) TYP 0.40 ± 0.10 DIA
|
Original
|
PDF
|
PGA-361C-A01
361-pin
PGA-361C-A01)
R361002SC-2-2
361 pin
|
Untitled
Abstract: No abstract text available
Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN CERAMIC PGA-80C-A01 EIAJ code : HPGA080-C-S12D-1 80-pin ceramic PGA Lead pitch 100 mil Pin matrix 12 Sealing method Metal seal PGA-80C-A01 80-pin ceramic PGA (PGA-80C-A01) 2.54±0.25 (.100±.010)
|
Original
|
PDF
|
PGA-80C-A01
HPGA080-C-S12D-1
80-pin
PGA-80C-A01)
R80001SC-3-2
C-A01)
|