JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
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schematic impulse sealer
Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").
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PK100
060ROM
schematic impulse sealer
qfp 64 0.4 mm pitch land pattern
Rotron
pk100 power supply
XC4013E-PQ240
EFTEC-64
XC4010E-PQ208
MO-151-AAN-1
PK100
land pattern for TSOP 2 86 PIN
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
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BC 1098
Abstract: EPM7384 ALTERA 68 PLCC t187
Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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232-pin
240-pin
100-pin
256-pin
484-pin
672-pin
BC 1098
EPM7384
ALTERA 68 PLCC
t187
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transistors BC 458
Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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EP20K100E
Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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49-pin
169-pin
EP20K100E
EP20K160E
EP20K200
EP20K200E
EP20K300E
EP20K60E
EP20K100
0245 TQFP-208
208RQFP
280-PGA
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100 PIN "PGA" ALTERA DIMENSION
Abstract: No abstract text available
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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altera ep610
Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.
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ep600i
Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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208 pin rqfp drawing
Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.
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bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
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ep600i
Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)
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MF202
Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical
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16-pin
MF202
160P6)
152P6T)
135S8)
42Alloy)
leadframe materials
QFP PACKAGE thermal resistance
POWER QFP
MITSUBISHI INTEGRATED CIRCUIT PACKAGES
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20-PIN
Abstract: THS7002 THS7002CPWP THS7002IPWP
Text: THS7002 70-MHz PROGRAMMABLE-GAIN AMPLIFIER SLOS214 – OCTOBER 1998 D D D D ADSL Differential Receiver Preamp Features – Low Voltage Noise . . . 2nV/√Hz – Accessible Output Pin for External Filtering – Voltage Feedback, Gmin = –1, 2 PGA Features
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THS7002
70-MHz
SLOS214
THS7002
20-PIN
THS7002CPWP
THS7002IPWP
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S1021
Abstract: THS7001 500 watts amplifier schematic diagram 15-V SLMA002 SLOU057 THS7001CPWP BNC T connectors CT2196MST-ND
Text: THS7001 ProgrammableĆGain Amplifier Evaluation Module User’s Guide December 1999 Mixed-Signal Products SLOU057 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information
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THS7001
SLOU057
CT2196MST
THS7001
SLOP250)
S1021
500 watts amplifier schematic diagram
15-V
SLMA002
SLOU057
THS7001CPWP
BNC T connectors
CT2196MST-ND
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Untitled
Abstract: No abstract text available
Text: THS7001, THS7002 70-MHz PROGRAMMABLE-GAIN AMPLIFIERS SLOS214B – OCTOBER 1998 – REVISED AUGUST 1999 D D D D Separate Low Noise Preamp and PGA Stages Shutdown Control Preamp Features – Low Voltage Noise . . . 1.7 nV/√Hz – Accessible Output Pin for External
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THS7001,
THS7002
70-MHz
SLOS214B
THS7001
THS7002
SSYA008
SLOA033
SLOA034
SZZA017A
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S1021
Abstract: THS7002 15-V SLMA002 THS4001 TP10 CT2196MST-ND
Text: THS7002 ProgrammableĆGain Amplifier Evaluation Module User’s Guide July 1999 Mixed-Signal Products SLOU037 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information
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THS7002
SLOU037
THS7002
S1021
15-V
SLMA002
THS4001
TP10
CT2196MST-ND
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Untitled
Abstract: No abstract text available
Text: THS7001, THS7002 70-MHz PROGRAMMABLE-GAIN AMPLIFIERS SLOS214B – OCTOBER 1998 – REVISED AUGUST 1999 D D D D Separate Low Noise Preamp and PGA Stages Shutdown Control Preamp Features – Low Voltage Noise . . . 1.7 nV/√Hz – Accessible Output Pin for External
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THS7001,
THS7002
70-MHz
SLOS214B
THS7001
THS7002
\\Roarer\root\data13\imaging\BITTING\cpl
atch\20000718\07172000\TXII\07172000\ths7
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THS7001
Abstract: THS7001CPWP THS7001EVM THS7001IPWP THS7002 THS7002CPWP THS7002EVM THS7002IPWP
Text: THS7001, THS7002 70-MHz PROGRAMMABLE-GAIN AMPLIFIERS SLOS214B – OCTOBER 1998 – REVISED AUGUST 1999 D D D D Separate Low Noise Preamp and PGA Stages Shutdown Control Preamp Features – Low Voltage Noise . . . 1.7 nV/√Hz – Accessible Output Pin for External
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THS7001,
THS7002
70-MHz
SLOS214B
THS7001
THS7001
THS7001CPWP
THS7001EVM
THS7001IPWP
THS7002
THS7002CPWP
THS7002EVM
THS7002IPWP
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4572 IC 8PIN
Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines
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503-Pin
4572 IC 8PIN
epx780
TQFP 144 PACKAGE DIMENSION
ALTERA EP610
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68-JLCC package
Abstract: No abstract text available
Text: 11 Data Sheet General Information Æftl ^ n^\ Thermal Resistance °C/W September 1991, ver. 2 In tr o d u c tio n T a b l e s 1 a n d 2 g i v e t h e r m a l re s is t a n c e d a ta for A lt e r a C l a s s i c a n d M A X 5 0 0 0 E P L D s . All th e rm a l c h a ra c te r is tics are m e a s u r e d u s in g the T e m p e r a t u r e
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EPM5064
EPM5128
EPM5130
EPM5192
68-JLCC package
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