PIN diode SPICE model
Abstract: Microwave PIN diode spice Microwave PIN diode pin diode ge-2 transistor TM 937 UMX5601 V920 pin model spice MSC Microwave
Text: Spice Model Data for UMX5601 PIN Diode TM SPICE MODEL DATA The overall SPICE PIN diode model developed for the UMX5601 exhibits the equivalent circuit shown below where: - CPACK is the package capacitance L CONTACT is the contact inductance CI is the punch through I-region capacitance
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UMX5601
beta/11}
tau/13}
beta/15}
tau/17}
beta/19}
PIN diode SPICE model
Microwave PIN diode spice
Microwave PIN diode
pin diode
ge-2 transistor
TM 937
V920
pin model spice
MSC Microwave
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BA679
Abstract: No abstract text available
Text: VISHAY BA679_Spice Vishay Semiconductors BA679 Spice Parameters * Technology: DISCRETE DIODE * Device: PIN Diode BA 679 * Type: Typical nom * Model established: 03-95, by B. Beckmann, TM1iC63-HN + IS = 718p RS = 1.37 N = 1.889 IBV= 100p + CJO=1.19p VJ = 240m M = 175m FC = 500m
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BA679
TM1iC63-HN
19-Nov-03
D-74025
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di292
Abstract: pj 26 diode MJ-05 ci3022 ci470 SCM30 ci573 CMOS spice model di2910 RI57
Text: Spice Models InputBuff Operation Guide How to Use InputBuff Overview Pin VPWR should be connected to the system positive supply and be between 4.5 and 5.5 volts with respect to ground. Pin VGND should be connected to system ground. This memo responds to customer requests for a SPICE model for the HOTLink TTL and ECL input buffers. The requested uses of the output model include:
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pj 59
Abstract: PJ216 pj 26 diode PJ 75 PJ 67 PJ 74 PJ-25 ci3015 pj 84 pj 50 diode
Text: fax id: 5113 Spice Models InputBuff Operation Guide How to Use InputBuff Overview Pin VPWR should be connected to the system positive supply and be between 4.5 and 5.5 volts with respect to ground. Pin VGND should be connected to system ground. This memo responds to customer requests for a SPICE model for the HOTLink TTL and ECL input buffers. The requested uses of the output model include:
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di292
Abstract: CMOS spice model ci470 CI573 pj 26 diode i2931 di640 ci547 RI57 W1-300
Text: Spice Models for HOTLink spect to ground. Pin VGND should be connected to InputBuff Operation Guide system ground. Overview Pin A is the modeled input pin. The TTLinput buffĆ This memo responds to customer requests for a er is valid for all of the TTL inputs on the
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CY7B923/933.
CY7B933.
di292
CMOS spice model
ci470
CI573
pj 26 diode
i2931
di640
ci547
RI57
W1-300
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PIN diode SPICE model
Abstract: NET028 NET045 NET051 pin diode model spice R2080
Text: PAROLI SPICE Simulation Models for I/O’s Appnote 84 by Jürgen Blank EQUIVALENT CIRCUITS FOR PAROLI INPUT AND OUTPUT INTERFACES, VERSION 52 1. OVERVIEW 2. PAD MODELING This application note is designed to provide equivalent circuit models that represent the current PAROLI modules input and
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D-13623,
PIN diode SPICE model
NET028
NET045
NET051
pin diode model spice
R2080
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k0304
Abstract: K0204 N03m DIODE C06 15 k0203 26M transistor 473e K0607WB resistor 56E L05 diode
Text: AND8010/D ECLinPS Lite MC100LVELT22 SPICE Model Kit Prepared by Paul Shockman http://onsemi.com APPLICATION NOTE ON Semiconductor Logic Applications Engineering Introduction The objective of this kit is to provide schematic and SPICE parameter information for performing system level
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AND8010/D
MC100LVELT22
LVELT22"
LVELT22
LVELT22
r14525
k0304
K0204
N03m
DIODE C06 15
k0203
26M transistor
473e
K0607WB
resistor 56E
L05 diode
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N03m
Abstract: 794e k0203 N04m MC100LVELT22 motorola LOGIC L05 diode k0305 NE 544 spice model
Text: AND8010/D ECLinPS Lite MC100LVELT22 SPICE Model Kit Prepared by Paul Shockman http://onsemi.com APPLICATION NOTE Motorola Logic Applications Engineering Introduction The objective of this kit is to provide schematic and SPICE parameter information for performing system level
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AND8010/D
MC100LVELT22
LVELT22"
LVELT22
LVELT22
r14153
N03m
794e
k0203
N04m
MC100LVELT22
motorola LOGIC
L05 diode
k0305
NE 544 spice model
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MSWSH-020-24
Abstract: MEST2G-025-10
Text: Spice Models for Aeroflex / Metelics PIN Diode Switch Elements CHIP Robert Caverly Non-Linear Diode SPICE N=1 PIN Diode SPST & SPDT Switch Elements S Par's Is mA Iknee mA Repi Ohm s CJmod Series PIN Y Y 2.50E-07 5 1000 0.04 MEST2GFC-010-25 Series Pin N N
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50E-07
MEST2GFC-010-25
MEST2G-020-15
30E-07
90E-06
MEST2G-050-45
A17134
MSWSH-020-24
MEST2G-025-10
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PIN diode SPICE model
Abstract: MSWSS-020-40 MSWSHB-020-30 Diodes D250 MSWSH 040-40 MMSPN050-53 MEST2G-080-25 MEST2G-050-80 MSWSH-020-24 MSWSHC-040-40
Text: Spice Models for Aeroflex / Metelics PIN Diode Switch Elements CHIP Robert Caverly Non-Linear Diode SPICE N=1 PIN Diode SPST & SPDT Switch Elements S Par's Is mA Iknee mA Repi Ohm s CJmod el Rlim Ω t nSec W um CJ50 pF Rs Ω PKG Series PIN Y Y 2.50E-07
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MEST2G-010-20
MEST2GFC-010-25
MEST2G-020-15
MEST2G-025-10
MEST2G-050-45
MEST2G-050-80
MEST2G-080-25
MEST2G-150-10-CM30
MEST2G-150-10-CM32
MEST2G-150-20
PIN diode SPICE model
MSWSS-020-40
MSWSHB-020-30
Diodes D250
MSWSH 040-40
MMSPN050-53
MSWSH-020-24
MSWSHC-040-40
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GB20SHT06-CAU SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GB20SHT06-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB20SHT06-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc.
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GB20SHT06-CAU
GB20SHT06-CAU.
05-SEP-2013
GB20SHT0ODE
GB20SHT06
46E-17
00E-05
26E-09
GB20SHT06-CAU SPICE
high-temperature-sic-bare-die
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1N8030-GA SPICE
Abstract: No abstract text available
Text: 1N8030-GA SPICE Model Parameters Copy this code from the SPICE model into a SPICE software program for simulation of the 1N8030-GA. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc. * 43670 Trade Center Place Ste. 155
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1N8030-GA
1N8030-GA.
05-SEP-2013
1N8030-GA
1N8030
57E-18
1N8030-GA SPICE
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Untitled
Abstract: No abstract text available
Text: GB05SLT12-252 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB05SLT12-252. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 04-SEP-2013 $ * * GeneSiC Semiconductor Inc.
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GB05SLT12-252
GB05SLT12-252.
04-SEP-2013
GB05SLT12-252
TEMP-24)
GB05SLT12
83E-18
00E-10
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GB02SHT03-46 SPICE
Abstract: No abstract text available
Text: GB02SHT03-46 SPICE Model Parameters Copy this code from the SPICE model into a SPICE software program for simulation of the GB02SHT03-46. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 29-AUG-2014 $ * * GeneSiC Semiconductor Inc. *
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GB02SHT03-46
GB02SHT03-46.
29-AUG-2014
GB02SHT03-46
GB02SHT03ANODE
GB02SHT03
57E-18
40E-05
GB02SHT03-46 SPICE
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GB20SHT12-CAU SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GB20SHT12-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB20SHT12-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * *
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GB20SHT12-CAU
GB20SHT12-CAU.
05-SEP-2013
GB20SATHODE
GB20SHT12
74E-13
68E-5
15E-09
GB20SHT12-CAU SPICE
high-temperature-sic-bare-die
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GB05SHT06-CAL SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GB05SHT06-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB05SHT06-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * * * * * * * $Revision: 1.0 $Date: 05-SEP-2013
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GB05SHT06-CAL
GB05SHT06-CAL.
05-SEP-2013
GB05SHT06
99E-17
87E-05
38E-10
00E-10
GB05SHT06-CAL SPICE
high-temperature-sic-bare-die
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Untitled
Abstract: No abstract text available
Text: GB01SLT06-214 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SLT06-214. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 09-SEP-2013 $ * * GeneSiC Semiconductor Inc.
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GB01SLT06-214
GB01SLT06-214.
09-SEP-2013
GB01SLT06-214
GB01SLT06
57E-18
40E-05
12E-11
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GAP3SHT33-CAU SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GAP3SHT33-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GAP3SHT33-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 04-SEP-2013 $ * *
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GAP3SHT33-CAU
GAP3SHT33-CAU.
04-SEP-2013
GAP3SHT33
39E-14
01E-11
00E-10
00E-03
GAP3SHT33-CAU SPICE
high-temperature-sic-bare-die
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GB05SHT06-CAU SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GB05SHT06-CAU SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB05SHT06-CAU. * MODEL OF GeneSiC Semiconductor Inc. * * * * * * * * $Revision: 1.0 $Date: 05-SEP-2013
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GB05SHT06-CAU
GB05SHT06-CAU.
05-SEP-2013
GB05SHT06
99E-17
87E-05
38E-10
00E-10
GB05SHT06-CAU SPICE
high-temperature-sic-bare-die
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1N8026-GA SPICE
Abstract: No abstract text available
Text: 1N8026-GA SPICE Model Parameters Copy this code from the SPICE model into a SPICE software program for simulation of the 1N8026-GA. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc. * 43670 Trade Center Place Ste. 155
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1N8026-GA
1N8026-GA.
05-SEP-2013
1N8026-GA
1N8026
TEMP-24)
45E-15
1N8026-GA SPICE
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GB01SHT06-CAL SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GB01SHT06-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SHT06-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * * GeneSiC Semiconductor Inc.
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GB01SHT06-CAL
GB01SHT06-CAL.
05-SEP-2013
GB01SHT06
57E-18
40E-05
12E-11
00E-10
GB01SHT06-CAL SPICE
high-temperature-sic-bare-die
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GB01SHT12-CAL SPICE
Abstract: high-temperature-sic-bare-die
Text: Die Datasheet GB01SHT12-CAL SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SHT12-CAL. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 05-SEP-2013 $ * *
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GB01SHT12-CAL
GB01SHT12-CAL.
05-SEP-2013
GB01Semperature
GB01SHT12
88E-18
90E-11
00E-10
GB01SHT12-CAL SPICE
high-temperature-sic-bare-die
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Untitled
Abstract: No abstract text available
Text: GB01SLT12-214 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GB01SLT12-214. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 09-SEP-2013 $ * * GeneSiC Semiconductor Inc.
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GB01SLT12-214
GB01SLT12-214.
09-SEP-2013
GB01SLT12-214
TEMP-24)
GB01SLT12
27E-19
90E-11
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Untitled
Abstract: No abstract text available
Text: GAP3SLT33-214 SPICE Model Parameters Please copy this code from the SPICE model into LTSPICE version 4 software for simulation of the GAP3SLT33-214. * MODEL OF GeneSiC Semiconductor Inc. * * $Revision: 1.0 $ * $Date: 09-SEP-2013 $ * * GeneSiC Semiconductor Inc.
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GAP3SLT33-214
GAP3SLT33-214.
09-SEP-2013
GAP3SLT33-214
GAP3SLT33
39E-14
01E-11
00E-10
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