tm 1628 smd
Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
|
Original
|
AN598
DS00599B-page
tm 1628 smd
AN598
78610
3002 ic equivalent
cte table epoxy
IC 3004
200B
hear
HEINEMANN
|
PDF
|
822 smd
Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the
|
Original
|
|
PDF
|
J-STD-020 MSL Rating
Abstract: mil J-STD-020
Text: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
|
Original
|
2002/95/EC,
2005/618/EC.
J-STD-020 MSL Rating
mil J-STD-020
|
PDF
|
90Sn10
Abstract: No abstract text available
Text: KEMET Surface Mount Ceramic Revision Nil, 01 November 2005 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
|
Original
|
2002/95/EC,
2005/618/EC.
90Sn10
|
PDF
|
tungsten slug glass diode
Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which
|
Original
|
|
PDF
|
UPS840e3
Abstract: EIA-481-2
Text: UPS840e3 POWERMITE 3 SURFACE MOUNT 8 AMP 40 V SCHOTTKY RECTIFIER SCOTTSDALE DIVISION APPEARANCE The UPS840e3 offers a small and powerful surface mount package that is RoHS compliant for a 40 Volt 8 Amp rated Schottky. These ratings are found only in much larger packages. They are ideal for surface mount applications
|
Original
|
UPS840e3
UPS840e3
EIA-481-2
|
PDF
|
Yamaichi IC51-0644-807 footprint
Abstract: IC51-0562-1514 footprint ssop 0.635 IC51-0562 socket IC51-0644-807 IC51-0804-808 Yamaichi IC51-0804-808 tqfp 56 socket SN700870PM SN700782PCB
Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology Tom Jackson Advanced System Logic – Semiconductor Group SCZA003A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor
|
Original
|
SCZA003A
Yamaichi IC51-0644-807 footprint
IC51-0562-1514
footprint ssop 0.635
IC51-0562 socket
IC51-0644-807
IC51-0804-808
Yamaichi IC51-0804-808
tqfp 56 socket
SN700870PM
SN700782PCB
|
PDF
|
V18AUMLA1206
Abstract: V18AUMLA1210 V18AUMLA1812 V18AUMLA2220 V18AUMLA2220H
Text: Next Surface Mount Varistors Multilayer Transient Voltage Surge Suppressor AUML Varistor Series The AUML Series of Multilayer Transient Surge Suppressors was specifically designed to suppress the destructive transient voltages found in an automobile. The most common transient condition results from large
|
Original
|
-55oC
125oC.
V18AUMLA222OT.
V18AUMLA2220H.
V18AUMLA2220A.
V18AUMLA1206
V18AUMLA1210
V18AUMLA1812
V18AUMLA2220
V18AUMLA2220H
|
PDF
|
S840
Abstract: msc 0043 MSC 501
Text: UPS840e3 Compliant Powermite 3 Surface Mount 8 Amp 40 V Schottky Rectifier DESCRIPTION The UPS840e3 offers an exceptionally small and powerful RoHS compliant package for a 40 V, 8 Amp Schottky rectifier. Competing solutions typically come only in much larger packages. It is an
|
Original
|
UPS840e3
UPS840e3
RF01102,
S840
msc 0043
MSC 501
|
PDF
|
A5625-01
Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which
|
Original
|
|
PDF
|
powermite
Abstract: EIA-481-B TR13 8700 CJ marking s17 do216 DO-216
Text: UPS5817e3 and UPS5819e3 POWERMITE 1 SURFACE MOUNT 1 AMP 20 and 40 V SCHOTTKY RECTIFIERS SCOTTSDALE DIVISION APPEARANCE The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount package that is RoHS compliant for a 1 Amp rated Schottky. These ratings
|
Original
|
UPS5817e3
UPS5819e3
UPS5819e3
UPS5817e3
DO-216
powermite
EIA-481-B
TR13
8700 CJ
marking s17
do216
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 4-TERMINAL SURFACE MOUNT RESISTORS* CAPACITORS *COILS* DELAY LINES SF SERIES □ Industry’s widest range! Values from .001Q-5KQ, tolerances to ±0.01%, TC's to 5ppm, 1W to 3W □ Excellent for current sensing applications □ Available on exclusive SWIFT delivery program!
|
OCR Scan
|
001Q-5KQ,
1ft1000
R0025,
20ppm,
100ppm
100ppm,
|
PDF
|
HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E
Abstract: GH sc-59 to-92 hall sensor ultrasonic range meter IC Ultrasonic welding circuit transistor Common collector configuration thermoset plastics Application Note 27703 HALL EFFECT TO 92 leadframe
Text: GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect is combined with modern integrated circuit IC
|
Original
|
|
PDF
|
N140 ALLEGRO
Abstract: Ultrasonic welding generator Allegro Hall-Effect ICs GH SC-59 Loctite 406 pressure low die bond sensor RTV HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E FLEX THERMOSET COMPOUND TO-236A TRA-CON
Text: Application Note 27703.1‡ GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING by Peter J. Gilbert Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical
|
Original
|
|
PDF
|
|
|
transient suppressor
Abstract: harris varistor V18AUMLA1206 V18AUMLA1210 V18AUMLA1812 V18AUMLA2220 V18AUMLA2220T PN diode specifications adhesive brake pads J1113
Text: AUML Series Data Sheet [ /Title Multilayer Surface Mount Automotive Transient Surge Suppressors AUML Series The AUML Series of Multilayer Transient Surge Suppressors was specifically designed to suppress the destructive /Subtransient voltages found in an automobile. The most
|
Original
|
1-800-4-HARRIS
transient suppressor
harris varistor
V18AUMLA1206
V18AUMLA1210
V18AUMLA1812
V18AUMLA2220
V18AUMLA2220T
PN diode specifications
adhesive brake pads
J1113
|
PDF
|
N140 ALLEGRO
Abstract: HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E Allegro Hall-Effect ICs Ultrasonic welding generator GTS2000
Text: Application Note 27703.1B GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD FORMING Introduction The Hall effect, discovered by E. F. Hall in 1879, is the basis for all Hall-effect devices. When this physical effect is combined with modern integrated circuit IC
|
Original
|
1-508-ALLEGRO
N140 ALLEGRO
HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E
Allegro Hall-Effect ICs
Ultrasonic welding generator
GTS2000
|
PDF
|
0 123 100 001
Abstract: SF 827 d
Text: 4-TERMINAL SURFACE MOUNT SF SERIES RoHS RESISTORS CAPACITORS COILS DELAY LINES Term.W is RoHS compliant & 260°C compatible Industry’s widest range! Values from .001Ω-5KΩ, tolerances to ±0.01%, TC’s to 5ppm, 1W to 3W Excellent for current sensing applications
|
Original
|
001-5K,
R0125,
R0075,
10ppm,
20ppm,
100ppm
100ppm,
200ppm,
FA060A
GF-061.
0 123 100 001
SF 827 d
|
PDF
|
fa060
Abstract: SFG-2 FA-060 1R00 R001 R0025 R005 R015
Text: 4-TERMINAL SURFACE MOUNT M COILSM M DELAY LINES RESISTORSM M CAPACITORSM 5.5-41-5 H Industry’s widest range! Values from .001Ω-5KΩ, tolerances to ±0.01%, TC’s to 5ppm, 1W to 3W H Excellent for current sensing applications H Available on exclusive SWIFT TM delivery program!
|
Original
|
SC100,
R0025,
10ppm,
20ppm,
100ppm
100ppm,
FA060
fa060
SFG-2
FA-060
1R00
R001
R0025
R005
R015
|
PDF
|
AN1260
Abstract: A112 A113
Text: MOTOROLA Order this document by AN1260/D SEMICONDUCTOR TECHNICAL DATA AN1260 Storage and Handling of Drypacked Surface Mounted Devices SMD Prepared by: R. Kampa, D. Hagen, W. Lindsay, and K.C. Brown INTRODUCTION This information provides Motorola customers with the
|
Original
|
AN1260/D
AN1260
AN1260/D*
AN1260
A112
A113
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Varistor Products Surface Mount Multilayer Varistors MLVs > AUML Series AUML Varistor Series RoHS The AUML Series of Multilayer Transient Surge Suppressors was specifically designed to suppress the destructive transient voltages found in an automobile. The most common
|
Original
|
V18AUMLA222OT.
V18AUMLA2220H.
V18AUMLA2220A.
|
PDF
|
powerPAD
Abstract: No abstract text available
Text: Thermally Enhanced ICs Low Cost Plastic Package Improves Surface-Mount IC Cooling Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter, Texas Instruments, Incorporated, Dallas, Texas C MOS components have historically operated ing power of the internal gates of the IC only becomes a
|
Original
|
|
PDF
|
fixed attenuator surface mount
Abstract: ceramic attenuator MHz PI-820
Text: SURFACE MOUNT MODEL PI-820 PIN DIODE ATTENUATOR 800-2000 MHz FEATURES • PCS Frequency Coverage: 800-2000 MHz • Balanced 4 Diode ir Configuration Increases Attenuation and Doubles Upper Frequency Limit • Low VSWR and Flat Attenuation Characteristics • Silicon PIN Diodes on Ceramic Offer Improved Insertion Loss
|
OCR Scan
|
PI-820
PI-820
fixed attenuator surface mount
ceramic attenuator MHz
|
PDF
|
Intel reflow soldering profile BGA
Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.
|
Original
|
conductivi49-58.
Intel reflow soldering profile BGA
all ic data
infrared heating gun
82425EX
80c196kb 1988
28F010
80C196KB
pcb warpage after reflow
Intel reflow soldering profile BGA intel
conveyor belt alignment
|
PDF
|
MBR140SF
Abstract: L4f marking marking L4F
Text: MBR140SFT1 Surface Mount Schottky Power Rectifier Plastic SOD−123 Package . . . using the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection
|
Original
|
MBR140SFT1
OD-123
38x38
MBR140SF
L4f marking
marking L4F
|
PDF
|
