Untitled
Abstract: No abstract text available
Text: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
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97-AQ132C
-or97-AQ132C-P
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mounting pad PQFP
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
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mounting pad PQFP
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amp pga socket
Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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97-AQ132D
97-AQ132D
-or97-AQ132D-P
amp pga socket
DIMENSIONS PQFP 132
ASTM-B16-85
mounting pad PQFP
132 pin PGA socket
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18022
Abstract: 132 pin PGA socket
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
-or97-AQ132D-P
18022
132 pin PGA socket
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132 pin PGA socket
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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97-AQ132D
-or97-AQ132D-P
132 pin PGA socket
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Untitled
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
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amp pga socket
Abstract: AMS-QQ-N-290
Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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97-AQ132D
132-Pin
97-AQ132D-P
amp pga socket
AMS-QQ-N-290
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Untitled
Abstract: No abstract text available
Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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97-AQ132D
132-Pin
C36ending
97-AQ132D-P
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VBH48A
Abstract: VPC176A PQFP 176 pqfp144 VQZ120A PLASTIC FLAT PACKAGE VBG48A VEF44A VEJ44A VGB52A
Text: Plastic Quad Flat Package PQFP 32 Lead Molded Plastic Quad Flat Package NS Package Number VBE32A 2000 National Semiconductor Corporation MS101167 www.national.com Plastic Quad Flat Package (PQFP) May 1999 Plastic Quad Flat Package (PQFP) 44 Lead (10mm x 10mm) Molded Plastic Quad Flat Package, EIAJ
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VBE32A
MS101167
VEF44A
VEJ44A
VEK44A
VGZ44A
VBH48A
VPC176A
PQFP 176
pqfp144
VQZ120A
PLASTIC FLAT PACKAGE
VBG48A
VEF44A
VEJ44A
VGB52A
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Untitled
Abstract: No abstract text available
Text: Order Number: EB382/D Rev. 0, 3/2001 Semiconductor Products Sector Engineering Bulletin MC68302FC 132-Lead PQFP Motorola is pleased to announce improvements in the manufacturability of 68302 products assembled in 132-lead PQFP. The manufacturability improvements consist of: 1 conversion to a non-MCR Molded
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EB382/D
MC68302FC
132-Lead
160-lead
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A3PE1500
Abstract: A3PE3000 IO23PDB0V2 IO23NDB0V2 IO30PDB1V1 IO05PDB0V0 IO06PDB0V1 IO32PDB1V1 IO10PDB0V1 IO283PDB7V1
Text: ProASIC3E Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .
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208-Pin
A3PE600
IO112PDB6V1
IO85NPB5V0
A3PE1500
A3PE3000
IO23PDB0V2
IO23NDB0V2
IO30PDB1V1
IO05PDB0V0
IO06PDB0V1
IO32PDB1V1
IO10PDB0V1
IO283PDB7V1
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A3PE600L
Abstract: 896-Pin FBGA 896 A3PE3000L A3P1000 IO283PDB7V1 ACTEL FBGA 144 ProASIC3 EL B17 AF29
Text: Military ProASIC3/EL Packaging 3 – Package Pin Assignments 208-Pin PQFP 1 208 208-Pin PQFP Note: This is the top view of the package. Note For Package Manufacturing and Environmental information, visit the Resource Center at .
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208-Pin
A3P1000
IO199PDB3
IO162RSB2
A3PE600L
896-Pin
FBGA 896
A3PE3000L
IO283PDB7V1
ACTEL FBGA 144
ProASIC3
EL B17
AF29
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smd diode OE R612
Abstract: smd diode u1j ss smii R645 CAP 103 2KV diode U1J EPC1PC8 smd diode R648 SMD R618 R647
Text: LXD9785 PQFP Demo Board with FPGA for SMII-to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249325-001 LXD9785 PQFP Demo Board with FPGA for SMII-to-MII Conversion User Guide.
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LXD9785
MM74HC14M
U14-29
SN74LVC244AD
EP20K100QC20
SC1566CM-2
NC7SZ125M5
EPM7032AETC
14DIP
smd diode OE R612
smd diode u1j
ss smii
R645
CAP 103 2KV
diode U1J
EPC1PC8
smd diode R648
SMD R618
R647
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T2D DIODE 94
Abstract: QE R518 T2D DIODE 46 EPC1PC8 QE r517 crystal j3f SG-8200 resistor r336 r331 r322 r330 r1 QE r525 qe r524
Text: LXD9781 PQFP Demo Board with FPGAs for RMII-to-MII Conversion Developer Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249043-001 LXD9781 PQFP Demo Board with FPGAs for RMII-to-MII Conversion User Guide.
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LXD9781
for9781
LXT9781
20-Pin
144-Pin
16-Pin
SN74LVC244ADW
T2D DIODE 94
QE R518
T2D DIODE 46
EPC1PC8
QE r517
crystal j3f
SG-8200
resistor r336 r331 r322 r330 r1
QE r525
qe r524
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smd diode R648
Abstract: TVS diode r725 smd diode R646 amp 4546 smd diode u1j hp r707 Diode smd f6 smd R552 smd diode R645 diode U1J
Text: LXD9785 PQFP Demo Board with FPGA for SS-SMII Fiber -to-MII Conversion Development Kit Manual January 2001 As of January 15, 2001, this document replaces the Level One document Order Number: 249323-001 LXD9785 PQFP Demo Board with FPGA for SS-SMII (Fiber)-to-MII Conversion User Guide.
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LXD9785
SN74LVC244AD
EP20K100QC208
SC1566CM-2
NC7SZ125M5
EPM7032AETC4
14DIP
smd diode R648
TVS diode r725
smd diode R646
amp 4546
smd diode u1j
hp r707
Diode smd f6
smd R552
smd diode R645
diode U1J
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EPM7128E
Abstract: PQFP-100 EPM7128S
Text: EPM7128E & EPM7128S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 84-Pin PLCC 100-Pin PQFP 100-Pin TQFP 1 , (2) 160-Pin PQFP INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (3) TMS (3) TCK (3) TDO (3) GNDINT GNDIO VCCINT (5.0 V only) VCCIO (3.3 V or 5.0 V)
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EPM7128E
EPM7128S
84-Pin
100-Pin
160-Pin
EPM7128E
7000S
PQFP-100
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EPM7128S
Abstract: EPM7128E
Text: EPM7128E & EPM7128S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 84-Pin PLCC 100-Pin PQFP 100-Pin TQFP 1 , (2) 160-Pin PQFP INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (3) TMS (3) TCK (3) TDO (3) GNDINT GNDIO VCCINT (5.0 V only) VCCIO (3.3 V or 5.0 V)
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EPM7128E
EPM7128S
84-Pin
100-Pin
160-Pin
EPM7128E
7000S
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m 208 b1
Abstract: EPM7256E EPM7256S
Text: EPM7256E & EPM7256S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 160-Pin PQFP 1 , (2) 192-Pin PGA (2) 208-Pin RQFP/PQFP (3) INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (4) TMS (4) TCK (4) TDO (4) GND 139 141 140 142 146 23 98 135 3, 18, 32, 47, 57, 64, 66, 81,
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EPM7256E
EPM7256S
160-Pin
192-Pin
208-Pin
EPM7256E
7000S
m 208 b1
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PQFP 132 PACKAGE DIMENSION intel
Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
Text: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch
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Intel386TM
Intel386
PQFP 132 PACKAGE DIMENSION intel
Intel 100 pin PQFP dimension
DIMENSIONS PQFP 132
DIMENSIONS pqfp 100
PQFP dimension intel
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Untitled
Abstract: No abstract text available
Text: ^ c te l -m Package Characteristics and Mechanical Drawings P a c k a g e T h e rm a l C h a ra c te ris tic s Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Plastic Quad Flatpack (PQFP)
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PBGA272
PBGA313
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lj26
Abstract: D35B D35A
Text: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 x 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width FUNCTIONAL DESCRIPTION
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LH5420
36-bit
36/18/9-bit
132-pin
0D1L273
132-Pin,
PQFP132-P-S950)
LH5420P-25
lj26
D35B
D35A
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d358
Abstract: D35B pitch 0.4 QFP 256p D20B D22B D24B D268 D28B LH5420 LH543620
Text: LH5420 256 x 36 x 2 Bidirectional FIFO FEATURES • TTL/CMOS-Compatible I/O • Fast Cycle Times: 25/30/35 ns • Space-Saving PQFP Package • Two 256 x 36-bit FIFO Buffers • PQFP to PGA Package Conversion * • Full 36-bit Word Width FUNCTIONAL DESCRIPTION
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LH5420
36-bit
36/18/9-bit
132pqfp
132-pin
001LS73
LH5420
132-Pin,
d358
D35B
pitch 0.4 QFP 256p
D20B
D22B
D24B
D268
D28B
LH543620
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land pattern PQFP 132
Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L
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PQ80-
5U-1982
M0-112,
PS0-4035
P5C-4049
land pattern PQFP 132
PQFP 132 PACKAGE DIMENSION
MO-112
N2979
land pattern PQFP 208
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m0-112
Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
Text: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L
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PQ80-
5U-1982
M0-112,
PS0-4035
P5C-4049
m0-112
land pattern PQFP 132
MO-069
tc 4049
MO-112
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