EHP-A09K-S5TC-S3000CADAE1K-1T8-AM
Abstract: J-STD-020D
Text: Technical Data Sheet Advanced Power Top View LEDs EHP-A09K-S5TC-S3000CADAE1K-1T8-AM Lead Pb Free Product - RoHS Compliant Applications Feattures P-LCC-6 package. Small package with high efficiency. Colorless clear resin. Wide viewing angle 120o. Precondition: Bases on JEDEC J-STD
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EHP-A09K-S5TC-S3000CADAE1K-1T8-AM
DHE-0001229
EHP-A09K-S5TC-S3000CADAE1K-1T8-AM
J-STD-020D
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EHP-A09K-BRTT-5670HDAEBD9K-1T8-AM
Abstract: TCX 0413
Text: Technical Data Sheet Advanced Power Top View LEDs EHP-A09K-BRTT-5670HDAEBD9K-1T8-AM Lead Pb Free Product - RoHS Compliant Applications Feattures P-LCC-6 package. Small package with high efficiency. Colorless clear resin. Wide viewing angle 120o. Precondition: Bases on JEDEC J-STD
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EHP-A09K-BRTT-5670HDAEBD9K-1T8-AM
DHE-0001224
EHP-A09K-BRTT-5670HDAEBD9K-1T8-AM
TCX 0413
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citizen diode
Abstract: No abstract text available
Text: Heat dissipation design is a precondition in order to maximize the performance of the LED. In this document, the data that is deemed necessary in the detailed heat dissipation structure of the products and the heat dissipation design of the lighting apparatus is provided as a reference for the appropriate thermal design.
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CL-L251-C4
CL-L251-C6
citizen diode
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P-18585
Abstract: DS1233
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Oct-96 9644 A5 CARSEM DM635839AAA 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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DS1233
Oct-96
DM635839AAA
OT223
P-18585
P-18652
P-18653,
P-18764
P-18765
P-18585
DS1233
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16875
Abstract: ds1232 P-16852 16876
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1232 Jan-96 9547 C1 ANAM, K. DN537172ABA 3.0µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-16818 READPOINT (Sample Size/No. of Fails)
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DS1232
Jan-96
DN537172ABA
P-16818
P-16852
P-16853,
P-16875
P-16876
16875
ds1232
P-16852
16876
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Apr-97 9712 M3 ANAM, K. DN507374ABY 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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DS5002
Apr-97
DN507374ABY
P-19491
P-19494
P-19495,
P-19530
P-19531
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an 17820
Abstract: DS2107A
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jul-96 9623 A6 ANAM, K. DN604282AAB1 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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DS2107A
Jul-96
DN604282AAB1
P-17820
P-17863
P-17864,
P-17904
P-17905
an 17820
DS2107A
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P-20460
Abstract: 20461 DS2181A
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2181A Aug-97 9728 A2 ANAM, K. DN722742ABB 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~
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DS2181A
Aug-97
DN722742ABB
P-20243
P-20302
P-20303,
P-20458
P-20459
P-20460
20461
DS2181A
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LTM4602
Abstract: LTM4600 LTM4601 15X15 0623 IPC-9701 IPC 9701 power one date code
Text: RELIABILITY DATA LTM4600 / LTM4601 / LTM4602 1/15/2007 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE NEWEST DATE CODE DEVICE HOURS 1 EQV to +100°C LGA 15X15 551 0452 0645 2,820,404 551 2,820,404 • J-STD-020 LEVEL 4 PRECONDITIONING4 (96 HOURS 30°C/60%RH + 3X IR REFLOW +245°C)
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LTM4600
LTM4601
LTM4602
15X15
J-STD-020
LTM4600/4601/4602
LTM4600
LTM4602
15X15
0623
IPC-9701
IPC 9701
power one date code
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DS2165
Abstract: APR97
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2165 Apr-97 9651 B1 HYUNDAI DL622720AAA 1.2µ OXIDE 24 PDIP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning: T/C: -55°C to +125°C, 10~
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DS2165
Apr-97
DL622720AAA
P-19489
P-19488
P-19489,
P-19534
P-19535
DS2165
APR97
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Untitled
Abstract: No abstract text available
Text: Marktech 0603 SMT LEDs Features Compatible with Automatic Placement Equipment Compatible with Infrared and Vapor Phase Reflow Solder Process IC Compatible Industry Standard 0603 Footprint JEDEC Preconditions Stress Tested Water Clear Lens Series Line−Up
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MTSM9100LBâ
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Untitled
Abstract: No abstract text available
Text: Marktech 1206 SMT LEDs Features Water clear package Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow solder processes IC Compatible Industry standard footprint JEDEC precondition stress tested Long life solid state reliability
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MTSM5100LBâ
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DS12885
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 Nov-95 9538 A2 ANAM, K. DN531869AAD1 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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DS12885
Nov-95
DN531869AAD1
P-16605
P-16649
P-16650,
P-16679
P-16680
DS12885
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21103
Abstract: transistor HR DS1267 p21105 HR 250 P21103 P-21105
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Nov-97 9737 A1 ANAM, PI. DK727730AAA 1.2µ OX/NI 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): 0 Hr
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DS1267
Nov-97
DK727730AAA
P-20871
P-20990
P-20991,
P-21102
P-211JOB
21103
transistor HR
DS1267
p21105
HR 250
P21103
P-21105
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vehicle rain sensor
Abstract: PEC 726 UF1004FCT rain sensor "rain sensor" C167CR ISO-9141 iso 9141 driver rain sensor automotive ISO 9141 K line interface diesel control
Text: Automotive electronics The C167CR adds gateway functions to the automotive computer Another leap forward in the comfort, safety and serviceability of motor vehicles can be achieved only by combining individual controllers to create multifunctional units. The precondition for doing so is a
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C167CR
C167CR*
ISO-9141
products/ICs/34/167
vehicle rain sensor
PEC 726 UF1004FCT
rain sensor
"rain sensor"
iso 9141 driver
rain sensor automotive
ISO 9141 K line interface
diesel control
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1754-3
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 May-96 9617 A2 HYUNDAI DL607533AAI 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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May-96
P-17523
P-17543
P-17544,
P-17640
P-17641
P-17642
C/100%
P-17643
DL607533AAI
1754-3
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Untitled
Abstract: No abstract text available
Text: Implementing FIR Filters January 1996, ver. 1 Introduction in FLEX Devices Application Note 73 The finite impulse response FIR filter is used in many digital signal processing (DSP) systems to perform signal preconditioning, antialiasing, band selection, decimation/interpolation, low-pass filtering, and
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74 HTC 08
Abstract: 74 HTC 00 P-20606
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Sep-97 9737 A6 CARSEM DM718527ABB 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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DS2502
Sep-97
P-20518
P-20556,
P-20606
DM718527ABB
P-20607
P-20608
P-20609
74 HTC 08
74 HTC 00
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40 RH 304
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Oct-95 9544 A1 HYUNDAI DL508411AAK 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : 85°C/85% RH, 168 hours HTC Vapor Phase, 3 Passes
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DS1267
Oct-95
P-16441
P-16440
P-16685,
P-16695
P-16696
P-16697
C/100%
P-16698
40 RH 304
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Untitled
Abstract: No abstract text available
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS80C320 May-96 9613 B3 ANAM, K. DN602132AAB2 0.8µ OX/NI 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase
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May-96
P-17518
P-16981
P-17519,
P-17629
P-17630
P-17631
C/100%
P-17632
DN602132AAB2
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18704
Abstract: P-18701
Text: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Nov-96 9627 B2 ANAM, PI. DK623631ABA2 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):
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Nov-96
P-18596
P-18639
P-18640,
P-18701
P-18702
P-18703
C/100%
P-18704
DK623631ABA2
18704
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Untitled
Abstract: No abstract text available
Text: Ami 0415 1024 x 1 IMOX ECL Bipolar RAM Fast access time 8 ns typ. — improves system cycle Outputs preconditioned during write cycle eliminating write recovery glitch Emitter follower outputs — easy wire-ORing Power dissipation decreases with increasing tempera
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Am10415
1024-bit
10-bit
MIL-STD-883,
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27LS00
Abstract: 27LS01 27LS00 RAM Am27LS
Text: Am27LS00/01 Series 256-Bit Low-Power Schottky Bipolar RAM > 3 DISTINCTIVE CHARACTERISTICS • • High Internal ECL circuitry for optimum speed/power perfor mance over voltage and temperature • Output preconditioned during write to eliminate the write
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Am27LS00/01
256-Bit
256-words
Am27LS00
MIL-STD-883,
27LS00
27LS01
27LS00 RAM
Am27LS
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SN54FB2033
Abstract: SN74FB2033A
Text: SN54FB2033, SN74FB2033A 8-BIT TTL/BTL REGISTERED TRANSCEIVERS S C BS174G - N O VEM BER 1991 - REVISED N O VEM BER 1996 Compatible With IEEE 1194.1-1991 BTL Standard B-Port Biasing Network Preconditions the Connector and PC Trace to the BTL High-Level Voltage
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SN54FB2033,
SN74FB2033A
SCBS174G
SN54FB2033
SN54FB2033
SN74FB2033A
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