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    QFN 32 STENCIL Search Results

    QFN 32 STENCIL Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    LTC3210EUD#TRPBF Analog Devices MAIN/CAM LED Cntr in 3 × 3 QFN Visit Analog Devices Buy
    HMC695LP4 Analog Devices 24 Id QFN (4x4mm w/2.8mm ep) Visit Analog Devices Buy
    HMC695LP4TR Analog Devices 24 Id QFN (4x4mm w/2.8mm ep) Visit Analog Devices Buy
    LTC3210EUD#PBF Analog Devices MAIN/CAM LED Cntr in 3 × 3 QFN Visit Analog Devices Buy

    QFN 32 STENCIL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 32 land pattern

    Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
    Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and


    Original     		PDF 32-pin MO-220 199707558G qfn 32 land pattern MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern

    si4730-d60-gu

    Abstract: SI4735-D60-GU Si473x si4734 Si47XX si4735-d60 am sw fm radio PCB schematic diagram si4730d60gu Si470x SI4731 D60
    Text: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features           Ordering Information: See page 32. Pin Assignments Si473x QFN Applications NC Modules for consumer electronics  Clock radios  Mini HiFi and docking stations


    Original     		PDF Si4730/31/34/35-D60 Si473x si4730-d60-gu SI4735-D60-GU Si473x si4734 Si47XX si4735-d60 am sw fm radio PCB schematic diagram si4730d60gu Si470x SI4731 D60

    RF5602

    Abstract: RF5602SB 802.16e wimax chip RF5602WM33410 RF56023
    Text: RF5602 RF56023.3 V to 5.0 V, 2.3 GHz to 2.7 GHz Linear Power Amplifier 3.3 V TO 5.0 V, 2.3 GHz TO 2.7 GHz LINEAR POWER AMPLIFIER Package Style: QFN, 16-Pin, 3 mm x 3 mm x 0.45 mm Features   Single 3.3 V to 5 V Supply 32 dB to 34 dB Small Signal Gain


    Original     		PDF RF5602 RF56023 16-Pin, 11b/g/n RF5602 RF5602WM33410 RF5602WL50410 RF5602WL33410 RF5602WB50410 RF5602WB33410 RF5602SB 802.16e wimax chip

    24 leads qfn 5x5

    Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
    Text: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some


    Original     		PDF AN0017 AN0017-8206 24 leads qfn 5x5 qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		PDF SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100

    MIL-STD-1686C

    Abstract: 24L-QFN CHS2411-QDG AN0017 s2411 SP4T package 1686C
    Text: CHS2411-QDG RoHS COMPLIANT 23-26GHz Reflective SP4T Switch GaAs Monolithic Microwave IC in QFN package Description The CHS2411-QDG is a monolithic reflective SP4T switch in K-Band. Positive supply voltage only is required. The circuit is manufactured with a standard


    Original     		PDF CHS2411-QDG 23-26GHz CHS2411-QDG 24L-QFN DSCHS2411-QDG8249 MIL-STD-1686C AN0017 s2411 SP4T package 1686C

    marking 18w sot23

    Abstract: marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG
    Text: Tape and Reel Packaging Specifications BRD8011/D Rev. 7, January−2007 SCILLC, 2007 Previous Edition @ 2006 “All Rights Reserved’’ http://onsemi.com Micro8 is a trademark of International Rectifier. PowerFLEX is a trademark of Texas Instruments Incorporated.


    Original     		PDF BRD8011/D January-2007 marking 18w sot23 marking code 564 SC-74 BRD8011/D sot23-6 marking code 561 QFN 64 8x8 footprint On semiconductor date Code sot-143 24w cooler tvs SMC MARKING lg diode 923 SMA marking code LG

    AN0017

    Abstract: CHS2411-QDG STD-020C MIL-STD-1686C
    Text: CHS2411-QDG RoHS COMPLIANT 23-26GHz Reflective SP4T Switch GaAs Monolithic Microwave IC In QFN package Description n The CHS2411 is a monolithic reflective SP4T Switch in K-Band. Positive supply voltage only is required. The circuit is manufactured with a standard PHEMT process : 0.25µm gate


    Original     		PDF CHS2411-QDG 23-26GHz CHS2411 DSCHS2411QDG6174 AN0017 CHS2411-QDG STD-020C MIL-STD-1686C

    s2083

    Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
    Text: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder


    Original     		PDF S2083 s2083 qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32

    AN4077

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note Document Number: AN4077 Rev. 2, 10/2012 MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low-g consumer grade


    Original     		PDF AN4077 MMA845xQ AN4077

    Si4705-D60-GU

    Abstract: No abstract text available
    Text: Si4704/05-D60 B ROADCAST F M R ADIO R ECEIVER WITH R D S / R B D S Features             Applications Ordering Information: See page 30. Pin Assignments Table and portable radios Mini/micro systems  CD/DVD and Blu-ray players


    Original     		PDF Si4704/05-D60 EN55020 Si4705-D60 Si4705-D60-GU

    AN4077

    Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
    Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade


    Original     		PDF AN4077 MMA845xQ AN4077 Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8

    SI4734

    Abstract: No abstract text available
    Text: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features                 Ordering Information: See page 31. Pin Assignments Si473x-D60 QFN DFS   Seven selectable AM channel filters AM/FM/SW/LW digital tuning


    Original     		PDF Si4730/31/34/35-D60 Si473x-D60 EN55020 Si4731/35 SI4734

    Untitled

    Abstract: No abstract text available
    Text: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features                 Ordering Information: See page 31. Pin Assignments Si473x-D60 QFN DFS   Seven selectable AM channel filters AM/FM/SW/LW digital tuning


    Original     		PDF Si4730/31/34/35-D60 Si473x-D60 EN55020 Si4731/35

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    Untitled

    Abstract: No abstract text available
    Text: Si5322 P I N - P ROGRAMMABLE P R E C I S I O N C LOCK M U LT IP L I E R Features      Not recommended for new  designs. For alternatives, see the Si533x family of products. Selectable output frequencies  ranging from 19.44 to 1050 MHz


    Original     		PDF Si5322 Si533x

    Untitled

    Abstract: No abstract text available
    Text: Si5322 P I N - P ROGRAMMABLE P R E C I S I O N C LOCK M U LT IP L I E R Features      Not recommended for new  designs. For alternatives, see the Si533x family of products. Selectable output frequencies  ranging from 19.44 to 1050 MHz


    Original     		PDF Si5322 Si533x

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note Document Number: AN4622 Rev. 4.0, 6/2013 MMPF0100 and MMPF0200 Layout Guidelines 1 Introduction This document describes good practices for the layout of PF0100 and PF0200 devices on printed circuit boards. Though the guidelines are applicable to PF0100 and PF0200,


    Original     		PDF AN4622 MMPF0100 MMPF0200 PF0100 PF0200 PF0200, PF0100Z