BGA 11x11 junction to board thermal resistance
Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature
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320-ball
432-ball
27x27
31x31
35x35
40x40
45x45
BGA 11x11 junction to board thermal resistance
45x45 mm bga
BGA 64 PACKAGE thermal resistance
qfn jc jb
45x45 bga
BGA 23X23
PQFP 32X32
QFN 48 JC JB
35x35 bga
QFN 20X20
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52110 Rev. 1, 3/2011 MCF52110 MCF52110 ColdFire Microcontroller Supports MCF52110 and MCF52100 The MCF52110 microcontroller family is a member of the ColdFire family of reduced instruction set computing
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MCF52110
MCF52110
MCF52100
32-bit
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pin diagram for core i7 processor
Abstract: JESD51-2 JESD51-3 JESD51-7 MCF52110 uart in pin diagram for core i3 processor BKD C6
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52110 Rev. 1, 3/2011 MCF52110 MCF52110 ColdFire Microcontroller Supports MCF52110 and MCF52100 The MCF52110 microcontroller family is a member of the ColdFire family of reduced instruction set computing
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MCF52110
MCF52110
MCF52100
32-bit
pin diagram for core i7 processor
JESD51-2
JESD51-3
JESD51-7
uart in pin diagram for core i3 processor
BKD C6
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MCF5221X
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52211 Rev. 2, 3/2011 MCF52211 MCF52211 ColdFire Microcontroller Supports MCF52210 / 52211 / 52212 / 52213 The MCF52211 microcontroller family is a member of the ColdFire family of reduced instruction set computing
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MCF52211
MCF52211
MCF52210
32-bit
MCF5221X
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MCF52210CEP66
Abstract: MCF52211 MCF52211CAE66 MCF52211CEP66 MCF52211CVM66 MCF52210 MCF52210CAE66 MCF5221X
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MCF52211 Rev. 2, 3/2011 MCF52211 MCF52211 ColdFire Microcontroller Supports MCF52210 / 52211 / 52212 / 52213 The MCF52211 microcontroller family is a member of the ColdFire family of reduced instruction set computing
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MCF52211
MCF52211
MCF52210
32-bit
MCF52210CEP66
MCF52211CAE66
MCF52211CEP66
MCF52211CVM66
MCF52210CAE66
MCF5221X
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bss138 MARKING c38
Abstract: No abstract text available
Text: bq500210 www.ti.com SLUSAL8C – JUNE 2011 – REVISED SEPTEMBER 2012 Qi Compliant Wireless Power Transmitter Manager Check for Samples: bq500210 FEATURES APPLICATIONS • • 1 • • • • • • Intelligent Control of the Power Transfer between Base Station and Mobile Device
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bq500210
bq500110
bss138 MARKING c38
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Untitled
Abstract: No abstract text available
Text: Document Number: KL14P80M48SF0 Rev. 3, 9/19/2012 Freescale Semiconductor Data Sheet: Technical Data KL14P80M48SF0 KL14 Sub-Family Data Sheet Supports the following: MKL14Z32VFM4, MKL14Z64VFM4, MKL14Z32VFT4, MKL14Z64VFT4, MKL14Z32VLH4, MKL14Z64VLH4, MKL14Z32VLK4, and MKL14Z64VLK4
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KL14P80M48SF0
MKL14Z32VFM4,
MKL14Z64VFM4,
MKL14Z32VFT4,
MKL14Z64VFT4,
MKL14Z32VLH4,
MKL14Z64VLH4,
MKL14Z32VLK4,
MKL14Z64VLK4
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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Untitled
Abstract: No abstract text available
Text: Document Number: KL24P80M48SF0 Rev. 3, 9/19/2012 Freescale Semiconductor Data Sheet: Technical Data KL24P80M48SF0 KL24 Sub-Family Data Sheet Supports the following: MKL24Z32VFM4, MKL24Z64VFM4, MKL24Z32VFT4, MKL24Z64VFT4, MKL24Z32VLH4, MKL24Z64VLH4, MKL24Z32VLK4, MKL24Z64VLK4
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KL24P80M48SF0
MKL24Z32VFM4,
MKL24Z64VFM4,
MKL24Z32VFT4,
MKL24Z64VFT4,
MKL24Z32VLH4,
MKL24Z64VLH4,
MKL24Z32VLK4,
MKL24Z64VLK4
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SN65MLVD048
Abstract: No abstract text available
Text: SN65MLVD048 www.ti.com SLLS903 – DECEMBER 2009 QUAD CHANNEL M-LVDS RECEIVERS Check for Samples: SN65MLVD048 FEATURES 1 • 2 • • • • • • • 1 Low-Voltage Differential 30-Ω to 55-Ω Line Receivers for Signaling Rates(1) up to 250Mbps; Clock Frequencies up to 125MHz
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SN65MLVD048
SLLS903
250Mbps;
125MHz
TIA/EIA-899
SN65MLVD048
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Untitled
Abstract: No abstract text available
Text: Document Number: KL05P48M48SF1 Rev. 3, 11/29/2012 Freescale Semiconductor Data Sheet: Technical Data KL05P48M48SF1 KL05 Sub-Family Data Sheet Supports: MKL05Z8VFK4, MKL05Z16VFK4, MKL05Z32VFK4, MKL05Z8VLC4, MKL05Z16VLC4, MKL05Z32VLC4, MKL05Z8VFM4, MKL05Z16VFM4, MKL05Z32VFM4,
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KL05P48M48SF1
MKL05Z8VFK4,
MKL05Z16VFK4,
MKL05Z32VFK4,
MKL05Z8VLC4,
MKL05Z16VLC4,
MKL05Z32VLC4,
MKL05Z8VFM4,
MKL05Z16VFM4,
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Untitled
Abstract: No abstract text available
Text: Document Number: KL04P48M48SF1 Rev. 3, 11/29/2012 Freescale Semiconductor Data Sheet: Technical Data KL04P48M48SF1 KL04 Sub-Family Data Sheet Supports: MKL04Z8VFK4, MKL04Z16VFK4, MKL04Z32VFK4, MKL04Z8VLC4, MKL04Z16VLC4, MKL04Z32VLC4, MKL04Z8VFM4, MKL04Z16VFM4, MKL04Z32VFM4,
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KL04P48M48SF1
MKL04Z8VFK4,
MKL04Z16VFK4,
MKL04Z32VFK4,
MKL04Z8VLC4,
MKL04Z16VLC4,
MKL04Z32VLC4,
MKL04Z8VFM4,
MKL04Z16VFM4,
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Untitled
Abstract: No abstract text available
Text: Document Number: KL25P80M48SF0 Rev. 3, 9/19/2012 Freescale Semiconductor Data Sheet: Technical Data KL25P80M48SF0 KL25 Sub-Family Data Sheet Supports the following: MKL25Z32VFM4, MKL25Z64VFM4, MKL25Z128VFM4, MKL25Z32VFT4, MKL25Z64VFT4, MKL25Z128VFT4, MKL25Z32VLH4, MKL25Z64VLH4,
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KL25P80M48SF0
MKL25Z32VFM4,
MKL25Z64VFM4,
MKL25Z128VFM4,
MKL25Z32VFT4,
MKL25Z64VFT4,
MKL25Z128VFT4,
MKL25Z32VLH4,
MKL25Z64VLH4,
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
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Untitled
Abstract: No abstract text available
Text: TPS62150 TPS62151, TPS62152, TPS62153 www.ti.com SLVSAL5A – NOVEMBER 2011 – REVISED OCTOBER 2012 3-17V 1A Step-Down Converter in 3x3 QFN Package Check for Samples: TPS62150, TPS62151, TPS62152, TPS62153 FEATURES DESCRIPTION 1 • • • • • • •
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TPS62150
TPS62151,
TPS62152,
TPS62153
TPS62150,
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xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
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md 5406
Abstract: pin out md 5406 Si5341
Text: S i 5 3 4 1/40 L O W - J I T T E R, 1 0 - O U T P U T , A NY -F R E Q U E N C Y, A NY -O U T P U T CLOCK GENERATOR Features RSVD OUT8 OUT8 VDDO8 OUT7 OUT7 VDDO7 54 53 52 51 50 49 OUT9 VDDO9 OUT9 58 55 VDD 59 RSVD FB_IN 60 56 FB_IN 61 OUT6 44 OUT6 RST 6 43
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Untitled
Abstract: No abstract text available
Text: CDCM7005 www.ti.com SCAS793E – JUNE 2005 – REVISED FEBRUARY 2013 3.3-V HIGH PERFORMANCE CLOCK SYNCHRONIZER AND JITTER CLEANER Check for Samples: CDCM7005 FEATURES 1 • GND GND GND GND GND C VBB GND AVCC AVCC AVCC AVCC AVCC GND STATUS_ REF or PRI_SEC_
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CDCM7005
SCAS793E
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md 5406
Abstract: No abstract text available
Text: Si 5 3 4 5 / 4 4 /42 1 0 - C H A N N E L , A NY -F R E Q U E N C Y, A NY - O U T P U T J I T T E R A T T E N U A T O R /C LOC K M U LT IP L IE R Features Preliminary Rev. 0.9 7/14 Copyright 2014 by Silicon Laboratories VDDO9 OUT8 VDDO8 OUT7 OUT7 VDDO7 53
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Si5345
Si5345:
Si5344:
Si5342:
md 5406
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BQ500211
Abstract: No abstract text available
Text: bq500211 www.ti.com SLUSAO2 – JUNE 2012 5-V, Qi Compliant Wireless Power Transmitter Manager Check for Samples: bq500211 FEATURES DESCRIPTION • • The bq500211 is a second generation digital wireless power controller that integrates all functions required
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bq500211
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AT32UC3B1128-Z1UT
Abstract: AT32UC3B0256 AT32UC3B0512 ISO7816 PA05 application AT32UC3B1512
Text: Features • High Performance, Low Power AVR 32 UC 32-Bit Microcontroller • • • • • • • • • • • • • • • – Compact Single-cycle RISC Instruction Set Including DSP Instruction Set – Read-Modify-Write Instructions and Atomic Bit Manipulation
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32-Bit
32059J
AT32UC3B1128-Z1UT
AT32UC3B0256
AT32UC3B0512
ISO7816
PA05 application
AT32UC3B1512
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AT32UC3B1512
Abstract: at32uc3b0512 AT32UC3B0256 QFN-48 QFN-64 Qmatrix tqfp-64 AT32UC3B1128-Z1UT AT32UC3B0128 op closed-loop 60MHZ
Text: Features • High Performance, Low Power AVR 32 UC 32-Bit Microcontroller • • • • • • • • • • • • • • • – Compact Single-cycle RISC Instruction Set Including DSP Instruction Set – Read-Modify-Write Instructions and Atomic Bit Manipulation
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32-Bit
32059IS
AT32UC3B1512
at32uc3b0512
AT32UC3B0256
QFN-48
QFN-64
Qmatrix
tqfp-64
AT32UC3B1128-Z1UT
AT32UC3B0128
op closed-loop 60MHZ
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ZL30241
Abstract: ZL30241LDF1 ZL30241LDG1
Text: Data Sheet ZL30241 Single Channel Precision Universal Clock Generator and NCO Ordering Information ZL30241LDG1 48 Pin QFN Tray ZL30241LDF1 48 Pin QFN Tape/Reel Matte Tin -40oC to +85oC Package size: 7 x 7 mm Features Outputs • PLL • • One PLL with ultra low jitter
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ZL30241
ZL30241LDG1
ZL30241LDF1
-40oC
ZL30241
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