in400x
Abstract: P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC
Text: SLIC Subscriber Line Interface Circuit Le79555 Device APPLICATIONS DESCRIPTION • Ideal for high-density, low-power linecard applications The Le79555 device was designed for high-density POTS applications requiring a power saving, small footprint SLIC device. The new SLIC device fulfills today's requirements for
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Le79555
44-pin
in400x
P0640EA70
bd 625
QFN 64 8x8 footprint
32-PIN
44-PIN
MUR120
le79555-3vc
TQFP044
795552QC
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qfn 44 PACKAGE footprint
Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The
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AN-002
ML6652
AN-002
ML6652CM/EM
QFN/LPCC44
ML6652.
ML6652CH/EH
qfn 44 PACKAGE footprint
qfn 76 PACKAGE footprint
ML6652CM
qfn 48 PACKAGE footprint
QFN 36 footprint
qfn 64 pcb layout
ML6652CH
LPCC44
eco solder paste
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TOSHIBA 8879
Abstract: QFN-20 footprint
Text: Selection Guide SEMTECH WIRELESS & SENSING PRODUCTS Touch Interface Solutions Digitally Enhanced Human Sensing for Smarter and Robust Applications S Multi-touch Low Power Robust ESD Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver
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SX9300*
SX9300
Wireles879*
TouchSG-0612
TOSHIBA 8879
QFN-20 footprint
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QFN-36 footprint
Abstract: No abstract text available
Text: Selection Guide SEMTECH WIRELESS & SENSING PRODUCTS Touch Interface Solutions Digitally Enhanced Human Sensing for Smarter and Robust Applications S Multi-touch Low Power Robust ESD Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver
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SX9300*
SX9300
TouchSG-AG-0612
QFN-36 footprint
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Untitled
Abstract: No abstract text available
Text: CY8C20X36A/46A/66A/96A/46AS/66AS CapSense Applications CapSense® Applications Features Pull-up, high Z, open-drain modes on all GPIOs CMOS drive mode –5 mA source current on ports 0 and 1 and 1 mA on ports 2, 3, and 4 • 20 mA total source current on all GPIOs
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CY8C20X36A/46A/66A/96A/46AS/66AS
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K/SPI-41-000-026 08 P2
Abstract: No abstract text available
Text: CY8C20X36A/46A/66A/96A/46AS/66AS CapSense Applications CapSense® Applications Pull-up, high Z, open-drain modes on all GPIOs CMOS drive mode –5 mA source current on ports 0 and 1 and 1 mA on ports 2, 3, and 4 • 20 mA total source current on all GPIOs
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CY8C20X36A/46A/66A/96A/46AS/66AS
CY8C20X36A:
CY8C20X46A/46AS/96A:
CY8C20X66A/66AS:
K/SPI-41-000-026 08 P2
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2X15
Abstract: PJBZ5200Q PJBZ5221Q PJBZ5222Q PJBZ5223Q SC75
Text: PJBZ5200Q SERIES 500mW ZENERS IN QFN 1.2x1.5 mm² PACKAGE PRELIMINARY This new PANJIT Zener family comes in a very small package that only uses 1.8 sq mm PCB area. With a maximum power dissipation rating of 500mW, the PJBZ5200Q Series is an industry first. It's superior power-footprint ratio
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PJBZ5200Q
500mW
500mW,
278mW
PJBZ5257Q
PJBZ5258Q
PJBZ5259Q
2X15
PJBZ5221Q
PJBZ5222Q
PJBZ5223Q
SC75
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qualcomm 7500
Abstract: rf spdt mhz dbm 32 pins qfn 5x5 footprint E k m QFN 3X3 F QFN 3X3 PE42692 QUALCOMM Reference design QUALCOMM QFN GSM qualcomm PE3336
Text: 2008 Product Selection Guide Changing how you design RF. Forever. Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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10B-6
qualcomm 7500
rf spdt mhz dbm
32 pins qfn 5x5 footprint
E k m QFN 3X3
F QFN 3X3
PE42692
QUALCOMM Reference design
QUALCOMM QFN
GSM qualcomm
PE3336
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PE33632
Abstract: PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694
Text: 2010 Product Selection Guide First Changing how you design RF. Forever. Edition Welcome to Peregrine Semiconductor UltraCMOS : The Green RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for
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and940
10B-6
PE33632
PE33362
PE33632 die
pe33382
PE42692
PE33362 die
PE42510A1
PE4340
PE33631
PE42694
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TAG 302-600
Abstract: PE42924
Text: Changing RF Design. Forever. TM 2013 Commercial Products Product Selection Guide First Edition Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor NASDAQ: PSMI is a fabless provider of high-performance radio-frequency (RF)
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Untitled
Abstract: No abstract text available
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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QFN 64 8x8 footprint
Abstract: 8x8 68 footprint QFN 52 8x8 footprint QFN 68 8x8 QFN 80 pin QFN 36 footprint
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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qfn 52 6x6
Abstract: QFN 52 footprint qfn 6x6 footprint
Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA
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QFN 52 8x8 footprint
Abstract: No abstract text available
Text: NB4N121K 3.3V Differential In 1:21 Differential Fanout Clock Driver with HCSL level Output http://onsemi.com Description The NB4N121K is a Clock differential input fanout distribution 1 to 21 HCSL level differential outputs, optimized for ultra low propagation delay variation. The NB4N121K is designed with HCSL
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NB4N121K
NB4N121K/D
QFN 52 8x8 footprint
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Untitled
Abstract: No abstract text available
Text: NB3N121K 3.3V Differential 1:21 Fanout Clock and Data Driver with HCSL Outputs Description http://onsemi.com The NB3N121K is a differential 1:21 Clock and Data fanout buffer with High−speed Current Steering Logic HCSL outputs optimized for ultra low propagation delay variation. The NB3N121K is designed
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NB3N121K
NB3N121K/D
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Untitled
Abstract: No abstract text available
Text: NB4N121K 3.3V Differential 1:21 Differential Fanout Clock Driver with HCSL level Output http://onsemi.com Description The NB4N121K is a Clock differential input fanout distribution 1 to 21 HCSL level differential outputs, optimized for ultra low propagation delay variation. The NB4N121K is designed with HCSL
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NB4N121K
NB4N121K
NB4N121K/D
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NB3N121K
Abstract: tray qfn 8x8 QFN 52 8x8 footprint
Text: NB3N121K 3.3V Differential 1:21 Fanout Clock and Data Driver with HCSL Outputs Description http://onsemi.com The NB3N121K is a differential 1:21 Clock and Data fanout buffer with High−speed Current Steering Logic HCSL outputs optimized for ultra low propagation delay variation. The NB3N121K is designed
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NB3N121K
NB3N121K/D
tray qfn 8x8
QFN 52 8x8 footprint
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Untitled
Abstract: No abstract text available
Text: MC10EP57, MC100EP57 3.3V / 5V ECL 4:1 Differential Multiplexer Description The MC10/100EP57 is a fully differential 4:1 multiplexer. By leaving the SEL1 line open pulled LOW via the input pulldown resistors the device can also be used as a differential 2:1 multiplexer
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MC10EP57,
MC100EP57
MC10/100EP57
MC10EP57/D
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PE42480
Abstract: No abstract text available
Text: 2014-2015 High-Performance Analog Product Catalog Welcome to Peregrine Semiconductor Peregrine Semiconductor NASDAQ: PSMI , founder of RF SOI (silicon on insulator), is a leading fabless provider of high-performance, integrated RF solutions. Since 1988 Peregrine and its founding
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PE42480
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EP57
Abstract: MC100EP57 MC10EP57 100EP57
Text: MC10EP57, MC100EP57 3.3V / 5V ECL 4:1 Differential Multiplexer Description The MC10/100EP57 is a fully differential 4:1 multiplexer. By leaving the SEL1 line open pulled LOW via the input pulldown resistors the device can also be used as a differential 2:1 multiplexer
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MC10EP57,
MC100EP57
MC10/100EP57
MC10EP57/D
EP57
MC100EP57
MC10EP57
100EP57
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Untitled
Abstract: No abstract text available
Text: MC10EP57, MC100EP57 3.3V / 5V ECL 4:1 Differential Multiplexer Description The MC10/100EP57 is a fully differential 4:1 multiplexer. By leaving the SEL1 line open pulled LOW via the input pulldown resistors the device can also be used as a differential 2:1 multiplexer
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MC10EP57,
MC100EP57
MC10/100EP57
MC10EP57/D
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Untitled
Abstract: No abstract text available
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
NB100LVEP222
LVEP222
NB100LVEP222/D
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QFN 64 8x8 footprint
Abstract: QFN-52 LVEP222 MC100LVE222 NB100LVEP222
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
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LVEP222
NB100LVEP222/D
QFN 64 8x8 footprint
QFN-52
MC100LVE222
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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