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    QFN 52 FOOTPRINT Search Results

    QFN 52 FOOTPRINT Result Highlights (5)

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    TPSM53603RDAR Texas Instruments 36-V, 3-A step-down power module in small 5.5 x 5 x 4mm RLF QFN package with small footprint Visit Texas Instruments Buy
    PTPSM53604RDAR Texas Instruments 36-V, 4-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRod™ QFN with simple footprint 15-B3QFN Visit Texas Instruments
    R5F513T5ADFJ#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5ADNE#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T3ADFL#10 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation

    QFN 52 FOOTPRINT Datasheets Context Search

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    in400x

    Abstract: P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC
    Text: SLIC Subscriber Line Interface Circuit Le79555 Device APPLICATIONS DESCRIPTION • Ideal for high-density, low-power linecard applications The Le79555 device was designed for high-density POTS applications requiring a power saving, small footprint SLIC device. The new SLIC device fulfills today's requirements for


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    Le79555 44-pin in400x P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC PDF

    qfn 44 PACKAGE footprint

    Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
    Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The


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    AN-002 ML6652 AN-002 ML6652CM/EM QFN/LPCC44 ML6652. ML6652CH/EH qfn 44 PACKAGE footprint qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH LPCC44 eco solder paste PDF

    TOSHIBA 8879

    Abstract: QFN-20 footprint
    Text: Selection Guide SEMTECH WIRELESS & SENSING PRODUCTS Touch Interface Solutions Digitally Enhanced Human Sensing for Smarter and Robust Applications S Multi-touch Low Power Robust ESD Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver


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    SX9300* SX9300 Wireles879* TouchSG-0612 TOSHIBA 8879 QFN-20 footprint PDF

    QFN-36 footprint

    Abstract: No abstract text available
    Text: Selection Guide SEMTECH WIRELESS & SENSING PRODUCTS Touch Interface Solutions Digitally Enhanced Human Sensing for Smarter and Robust Applications S Multi-touch Low Power Robust ESD Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver


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    SX9300* SX9300 TouchSG-AG-0612 QFN-36 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: CY8C20X36A/46A/66A/96A/46AS/66AS CapSense Applications CapSense® Applications Features Pull-up, high Z, open-drain modes on all GPIOs CMOS drive mode –5 mA source current on ports 0 and 1 and 1 mA on ports 2, 3, and 4 • 20 mA total source current on all GPIOs


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    CY8C20X36A/46A/66A/96A/46AS/66AS PDF

    K/SPI-41-000-026 08 P2

    Abstract: No abstract text available
    Text: CY8C20X36A/46A/66A/96A/46AS/66AS CapSense Applications CapSense® Applications Pull-up, high Z, open-drain modes on all GPIOs CMOS drive mode –5 mA source current on ports 0 and 1 and 1 mA on ports 2, 3, and 4 • 20 mA total source current on all GPIOs


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    CY8C20X36A/46A/66A/96A/46AS/66AS CY8C20X36A: CY8C20X46A/46AS/96A: CY8C20X66A/66AS: K/SPI-41-000-026 08 P2 PDF

    2X15

    Abstract: PJBZ5200Q PJBZ5221Q PJBZ5222Q PJBZ5223Q SC75
    Text: PJBZ5200Q SERIES 500mW ZENERS IN QFN 1.2x1.5 mm² PACKAGE PRELIMINARY This new PANJIT Zener family comes in a very small package that only uses 1.8 sq mm PCB area. With a maximum power dissipation rating of 500mW, the PJBZ5200Q Series is an industry first. It's superior power-footprint ratio


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    PJBZ5200Q 500mW 500mW, 278mW PJBZ5257Q PJBZ5258Q PJBZ5259Q 2X15 PJBZ5221Q PJBZ5222Q PJBZ5223Q SC75 PDF

    qualcomm 7500

    Abstract: rf spdt mhz dbm 32 pins qfn 5x5 footprint E k m QFN 3X3 F QFN 3X3 PE42692 QUALCOMM Reference design QUALCOMM QFN GSM qualcomm PE3336
    Text: 2008 Product Selection Guide Changing how you design RF. Forever. Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for


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    10B-6 qualcomm 7500 rf spdt mhz dbm 32 pins qfn 5x5 footprint E k m QFN 3X3 F QFN 3X3 PE42692 QUALCOMM Reference design QUALCOMM QFN GSM qualcomm PE3336 PDF

    PE33632

    Abstract: PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694
    Text: 2010 Product Selection Guide First Changing how you design RF. Forever. Edition Welcome to Peregrine Semiconductor UltraCMOS : The Green RF Process Technology Peregrine Semiconductor is a leading supplier of high-performance RF CMOS and mixed-signal communications ICs which are ideally suited for


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    and940 10B-6 PE33632 PE33362 PE33632 die pe33382 PE42692 PE33362 die PE42510A1 PE4340 PE33631 PE42694 PDF

    TAG 302-600

    Abstract: PE42924
    Text: Changing RF Design. Forever. TM 2013 Commercial Products Product Selection Guide First Edition Welcome to Peregrine Semiconductor UltraCMOS RF Process Technology Peregrine Semiconductor NASDAQ: PSMI is a fabless provider of high-performance radio-frequency (RF)


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    Untitled

    Abstract: No abstract text available
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


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    QFN 64 8x8 footprint

    Abstract: 8x8 68 footprint QFN 52 8x8 footprint QFN 68 8x8 QFN 80 pin QFN 36 footprint
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


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    qfn 52 6x6

    Abstract: QFN 52 footprint qfn 6x6 footprint
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


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    QFN 52 8x8 footprint

    Abstract: No abstract text available
    Text: NB4N121K 3.3V Differential In 1:21 Differential Fanout Clock Driver with HCSL level Output http://onsemi.com Description The NB4N121K is a Clock differential input fanout distribution 1 to 21 HCSL level differential outputs, optimized for ultra low propagation delay variation. The NB4N121K is designed with HCSL


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    NB4N121K NB4N121K/D QFN 52 8x8 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: NB3N121K 3.3V Differential 1:21 Fanout Clock and Data Driver with HCSL Outputs Description http://onsemi.com The NB3N121K is a differential 1:21 Clock and Data fanout buffer with High−speed Current Steering Logic HCSL outputs optimized for ultra low propagation delay variation. The NB3N121K is designed


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    NB3N121K NB3N121K NB3N121K/D PDF

    Untitled

    Abstract: No abstract text available
    Text: NB4N121K 3.3V Differential 1:21 Differential Fanout Clock Driver with HCSL level Output http://onsemi.com Description The NB4N121K is a Clock differential input fanout distribution 1 to 21 HCSL level differential outputs, optimized for ultra low propagation delay variation. The NB4N121K is designed with HCSL


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    NB4N121K NB4N121K NB4N121K/D PDF

    NB3N121K

    Abstract: tray qfn 8x8 QFN 52 8x8 footprint
    Text: NB3N121K 3.3V Differential 1:21 Fanout Clock and Data Driver with HCSL Outputs Description http://onsemi.com The NB3N121K is a differential 1:21 Clock and Data fanout buffer with High−speed Current Steering Logic HCSL outputs optimized for ultra low propagation delay variation. The NB3N121K is designed


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    NB3N121K NB3N121K/D tray qfn 8x8 QFN 52 8x8 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: MC10EP57, MC100EP57 3.3V / 5V ECL 4:1 Differential Multiplexer Description The MC10/100EP57 is a fully differential 4:1 multiplexer. By leaving the SEL1 line open pulled LOW via the input pulldown resistors the device can also be used as a differential 2:1 multiplexer


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    MC10EP57, MC100EP57 MC10/100EP57 MC10EP57/D PDF

    PE42480

    Abstract: No abstract text available
    Text: 2014-2015 High-Performance Analog Product Catalog Welcome to Peregrine Semiconductor Peregrine Semiconductor NASDAQ: PSMI , founder of RF SOI (silicon on insulator), is a leading fabless provider of high-performance, integrated RF solutions. Since 1988 Peregrine and its founding


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    DOC-35227-4 PE42480 PDF

    EP57

    Abstract: MC100EP57 MC10EP57 100EP57
    Text: MC10EP57, MC100EP57 3.3V / 5V ECL 4:1 Differential Multiplexer Description The MC10/100EP57 is a fully differential 4:1 multiplexer. By leaving the SEL1 line open pulled LOW via the input pulldown resistors the device can also be used as a differential 2:1 multiplexer


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    MC10EP57, MC100EP57 MC10/100EP57 MC10EP57/D EP57 MC100EP57 MC10EP57 100EP57 PDF

    Untitled

    Abstract: No abstract text available
    Text: MC10EP57, MC100EP57 3.3V / 5V ECL 4:1 Differential Multiplexer Description The MC10/100EP57 is a fully differential 4:1 multiplexer. By leaving the SEL1 line open pulled LOW via the input pulldown resistors the device can also be used as a differential 2:1 multiplexer


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    MC10EP57, MC100EP57 MC10/100EP57 MC10EP57/D PDF

    Untitled

    Abstract: No abstract text available
    Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential


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    NB100LVEP222 NB100LVEP222 LVEP222 NB100LVEP222/D PDF

    QFN 64 8x8 footprint

    Abstract: QFN-52 LVEP222 MC100LVE222 NB100LVEP222
    Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential


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    NB100LVEP222 NB100LVEP222 LVEP222 NB100LVEP222/D QFN 64 8x8 footprint QFN-52 MC100LVE222 PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
    Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses


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