QFN 9X9 Search Results

AS102

Abstract: diversity sdio Tuner AS-102 DVB-T Tuner Demodulator SDIO DVB Demodulator dvb-h DVB-T Demodulator Tuner demodulator datasheet
Contextual Info: DVB-T RF Tuner + Demodulator SOC Integrated Mass Mobility Diversity Tuner Production Item Main Feature Application Package Interfaces AS101 DVB-H / T Cellular / Module 5x5mm CSP QFN SPI / SDIO / USB Yes Yes - - AS102 DVB-T PCTV / PND / MP4 / DVD 9x9mm QFN

AN315

Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
Contextual Info: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are

QFN 64 8x8 dimension

Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 64 8x8 dimension

Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

QFN 64 8x8 dimension

Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 64 8x8 dimension

Abstract: DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6
Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 64 8x8 dimension

Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
Contextual Info: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Contextual Info: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the

DUAL ROW QFN leadframe

Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
Contextual Info: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the

QFN leadframe

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

AK08D300-CLCC

Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

48-PIN

Abstract: FR30 GIO10 W86L488 W86L488AY W86L488Y ase qfn 48
Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge Preliminary W86L488 W86L488 Data Sheet Revision History Pages Version on Web Dates Version 1 08/2002 0.50 First published. 2 12/2002 0.60 Add QFN package. Main Contents 1.Modify pin function of CLK, ACLK,

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

NP364

Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
Contextual Info: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.

QFN 64 9x9 footprint

Abstract: QFN 64 footprint
Contextual Info: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

PXA27

Abstract: W86L488AY W86L488Y
Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

W86L488

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

Contextual Info: W86L488 Winbond Host Interface SD/SDIO/MMC Memory Card Bridge W86L488 REVISION HISTORY VERSION DATE 0.50 08/2002 First published. 0.60 12/2002 Add QFN package. 0.70 03/2003 PAGE P6, P11, P26, P43, P46 P8, P24, P41, P44, DESCRIPTION P10, P25, P42, P45, 1. Modify pin function of CLK, ACLK, BCLK,

PIC18F45K22

Abstract: PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22
Contextual Info: PIC18F “K22” Family of Microcontrollers Broadest Line of Low Power, 5V 8-bit MCUs Summary The nanoWatt XLP PIC18F “K22” Flash Family of microcontrollers offer all of the advantages of the well recognized PIC18F High Performance MCUs; C compiler optimized architecture and an industry leading peripheral