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    QFN-24 6X6 PACKAGE Search Results

    QFN-24 6X6 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    QFN-24 6X6 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: VG111 The Communications Edge TM • MTTF > 100 years GND GND GND GND VA CTRL 2 1 28 GND 27 GND Amp GND 10 26 GND RF IN 11 25 RF OUT GND 12 24 GND Variable Attenuator 23 GND GND 14 22 GND 15 16 17 18 19 20 21 N/C • 6x6 mm 28-pin QFN package 3 GND 9 GND 13


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    PDF VG111 28-pin VG111 dyn800-WJ1-4401 VG111" 1-800-WJ1-4401

    variable inductor 17 18

    Abstract: No abstract text available
    Text: VG101 The Communications Edge TM Cellular-band Variable Gain Amplifier • MTTF > 100 years GND GND GND VA CTRL GND GND 2 1 28 GND 27 GND Amp GND 10 26 GND RF IN 11 25 RF OUT GND 12 24 GND Variable Attenuator 23 GND GND 14 22 GND 15 16 17 18 19 20 21 GND • 6x6 mm 28-pin QFN package


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    PDF VG101 28-pin VG101 1-800-WJ1-4401 VG101" variable inductor 17 18

    CHL8228G

    Abstract: CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6
    Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN packages APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based


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    PDF CHL8225G/8G 200kHz CHL8225G CHL8228G CHL8228G-00CRT CHL8228 CHL8225G-00CRT qfn 8x8 reel CHL822 qfn 52 6x6 A/sh 40/085/21/QFN-6x6

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


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    PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    CHL8228G-00CRT

    Abstract: No abstract text available
    Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based


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    PDF CHL8225G/8G 40-pin 56-pin CHL8225G/8G CHL8228G CHL8228G CHL8228G-00CRT

    tray qfn 6x6

    Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
    Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA


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    PDF O-236AB OT-23) OT-23 O-220 O-252 OT-223 QFN00/Reel 490/Tray tray qfn 6x6 tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


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    PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    QFN leadframe

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


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    PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) QFN leadframe

    AK08D300-CLCC

    Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


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    PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) AK08D300-CLCC AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5

    NP364

    Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
    Text: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.


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    PDF 10mA/20mV NP445 NP364 QFN11T040-005 QFN11T040-006 QFN11T048-005 QFN11T048-008 QFN11T048-008 A101121-001 NP364 QFN11T032-003 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003

    Untitled

    Abstract: No abstract text available
    Text: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS  Intel VR12 & AMD® SVI based systems  High Performance Desktops CPU VRs  Value Servers CPU & DDR Memory VRs ISEN_L2  3.3V +10%/-15% supply voltage; 0ºC to 85ºC


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    PDF 200kHz CHL8103/04/13) CHL8102/03/04/13 CHL8103/04/13 CHL8104 CHL8103) CHL8103/4

    PIC18F45K22

    Abstract: PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22
    Text: PIC18F “K22” Family of Microcontrollers Broadest Line of Low Power, 5V 8-bit MCUs Summary The nanoWatt XLP PIC18F “K22” Flash Family of microcontrollers offer all of the advantages of the well recognized PIC18F High Performance MCUs; C compiler optimized architecture and an industry leading peripheral


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    PDF PIC18F PIC18F 12-bit com/PIC18K22 DS41438A DS41438A* PIC18F45K22 PIC18F46K22 pic18f25k22 PIC18F26k22 PIC18F23K22 PIC18F67K22 40 pin PIC18F46K22 Pic18f24k22 DS41398 PIC18LF46K22

    Untitled

    Abstract: No abstract text available
    Text: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS  Intel VR12 & AMD® SVI based systems  High Performance Desktops CPU VRs  Value Servers CPU & DDR Memory VRs ISEN_L2  3.3V +10%/-15% supply voltage; 0ºC to 85ºC


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    PDF 200kHz CHL8103/04/13) CHL8102/03/04/13 CHL8103/04/13 CHL8104 CHL8103) CHL8103/4

    Untitled

    Abstract: No abstract text available
    Text: Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, QFN packages APPLICATIONS  Intel VR12 & AMD® SVI based systems  High Performance Desktops CPU VRs  Value Servers CPU & DDR Memory VRs 40 39 38 37 36 ISEN_L2  3.3V +10%/-15% supply voltage; 0ºC to 85ºC


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    PDF CHL8103/04/13) 200kHz CHL8103/4 CHL8104 CHL8103)

    Untitled

    Abstract: No abstract text available
    Text: CHL8225G/8G Digital Multi-Phase Buck Controller FEATURES DESCRIPTION APPLICATIONS • Multiphase GPU systems RCSP IRTN1 ISEN1 IRTN2 ISEN2 IRTN3 ISEN3 IRTN4 ISEN4 IRTN5 ISEN5 PIN DIAGRAM 40 39 38 37 36 35 34 33 32 31 1 30 ISEN6  Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN


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    PDF CHL8225G/8G 40-pin 56-pin CHL8225G/8G CHL8225G CHL8228G

    Untitled

    Abstract: No abstract text available
    Text: 36 Pin to 40 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:


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    PDF 6MM-40 AK40D600-TSOP

    VG111-PCB1900

    Abstract: MOTOROLA TRANSISTOR JESD22-A114 MMBT2222 VG111 VG111-PCB2100 QFN-6x6 package capacitor 22 pf DNP
    Text: VG111 The Communications Edge TM PCS/UMTS-band Variable Gain Amplifier Applications GND 5 GND 6 GND Vctrl 7 GND GND The VG111 is a PCS / UMTS-band high dynamic range variable gain amplifier VGA packaged in a 6x6 mm surface-mount package. The +22 dBm output


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    PDF VG111 VG111 1-800-WJ1-4401 VG111-PCB1900 MOTOROLA TRANSISTOR JESD22-A114 MMBT2222 VG111-PCB2100 QFN-6x6 package capacitor 22 pf DNP

    QFN "100 pin" PACKAGE

    Abstract: JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28
    Text: Tape & Reel Packaging for Automated Handling The Future of Analog IC Technology General Overview Surface mount products are available in Tape & Reel packaging. Below is a table of standard Tape & Reel configurations. These packages conform to EIA-481-1/2/3 and JEDEC standards. All products are lead


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    PDF EIA-481-1/2/3 TSOT23 QFN "100 pin" PACKAGE JEDEC qfn tape QFN 3x4 SOT23 JEDEC standard orientation MP transistor SOIC16 SOIC24 SOIC28 TSSOP16 TSSOP28

    TG2H214220-FL

    Abstract: TGA2572 TGA2573 lte transceiver TGA2540-FL TQM963014 TGA2517 TQM6M9069 TQP6M9002 TQM7M5013
    Text: Product Selection Guide Choose TriQuint’s Innovative RF Solutions Connecting the Digital World to the Global Network Welcome to Our Product Selection Guide Table of Contents About TriQuint Semiconductor.3 Guide by Market Automotive. 4


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    PDF

    P1050-QJ

    Abstract: No abstract text available
    Text: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ June 2008 - Rev 06-Jun-08 Features 16 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description The XP1050-QJ is a packaged linear power amplifier


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    PDF 06-Jun-08 P1050-QJ XP1050-QJ P1050-QJ

    Untitled

    Abstract: No abstract text available
    Text: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ August 2008 - Rev 18-Aug-08 Features 16 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description The XP1050-QJ is a packaged linear power amplifier


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    PDF 18-Aug-08 P1050-QJ XP1050-QJ

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    Untitled

    Abstract: No abstract text available
    Text: 7.1 - 8.5 GHz Linear Power Amplifier 6x6mm QFN P1050-QJ October 2008 - Rev 01-Oct-08 Features 14.5 dB Small Signal Gain 49 dBm Third Order Intercept Point OIP3 Integrated Power Detector 6x6mm QFN Package, RoHS Compliant 100% RF Testing General Description


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    PDF 01-Oct-08 P1050-QJ XP1050-QJ

    CHV2710-QJ

    Abstract: CHV2710-QJ-0G00 CHV2710-QJ-0G0T PB-CHV2710-0000 RO4003
    Text: 2.5 GHz InGaP HBT 5W Linear Power Amplifier CHV2710-QJ August 2007 - Rev 30-Aug-07 Features Internal Pre-matching Single Supply operation, 12V Power Gain 9 dB ESD Protection on board Current Control for multiple applications 2.5% EVM @ 29 dBm avg power, 802.16 OFDM


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    PDF CHV2710-QJ 30-Aug-07 CHV2710 CHV2710-QJ CHV2710-QJ-0G00 CHV2710-QJ-0G0T PB-CHV2710-0000 RO4003