Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    QFN-44 PCB LAYOUT GUIDE Search Results

    QFN-44 PCB LAYOUT GUIDE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10035667-002LF Amphenol Communications Solutions Board Guiding Visit Amphenol Communications Solutions
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    QFN-44 PCB LAYOUT GUIDE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    EN5394QI

    Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394
    Text: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5394QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5394QI power converter packages are designed with a plastic leadframe


    Original     		EN5394QI QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394 PDF

    EN5364QI

    Abstract: No abstract text available
    Text: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5364QI power converter packages are designed with a plastic leadframe


    Original     		EN5364QI PDF

    qfn 44 PACKAGE footprint

    Abstract: EN5365QI EN5365 QFN PACKAGE thermal resistance
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5365QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5365QI power converter packages are designed with a plastic leadframe


    Original     		EN5365QI qfn 44 PACKAGE footprint EN5365 QFN PACKAGE thermal resistance PDF

    EN5336QI

    Abstract: stencil qfn stencil
    Text: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5336QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5336QI power converter packages are designed with a plastic leadframe


    Original     		EN5336QI stencil qfn stencil PDF

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    epoxy prepreg panasonic

    Abstract: Capacitor tantalum 0402 10uF/16V IPC-600-A IPC-SM-840 type b class 2 ceramic capacitor 1uf/16v UAR10-4W5100 IPC-6011 ipc sm 840 CMD15-21VRC smd diode s1
    Text: WirelessUSB LS Micro-Bridge Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for micro-bridge printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio IC and its application as an


    Original     		PDF

    VCO19V

    Abstract: BNX002-01 VCO-19V TCO-986 GMC10CG100J50NT tco986 293D106X9016B2T TRF3750 DB25F-RA 745536-2
    Text: TRF3750 QFN/TSSOP Evaluation Module User’s Guide 2004 Wireless Infrastructure Products SLWU009 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		TRF3750 SLWU009 DB25F-RA 26-Aug-2004 VCO19V BNX002-01 VCO-19V TCO-986 GMC10CG100J50NT tco986 293D106X9016B2T TRF3750 DB25F-RA 745536-2 PDF

    IPC-SM-840

    Abstract: IPC-600-A IPC-6011 13001 datasheet 0.1 uf/50v smd capacitor ceramic SMD capacitor 0.1 uf/50v AN5030 tb 9207 transistor 13001 pcb design of a radio
    Text: WirelessUSB LS Printed Circuit Board Layout Guidelines The PCB Is a Component of Your Wireless Communication Product Design This application note provides guidelines for printed circuit board PCB design using the WirelessUSB™ LS 2.4-GHz DSSS Radio SoC IC and its application as an integrated


    Original     		PDF

    SAC305

    Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
    Text: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board


    Original     		AN3778 SAC305 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance PDF

    IPC-D-330

    Abstract: JESD51-2
    Text: Freescale Semiconductor Application Note AN3962 Rev. 1.0, 10/2009 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat


    Original     		AN3962 IPC-D-330 JESD51-2 PDF

    IPC-D-330

    Abstract: AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2
    Text: Freescale Semiconductor Application Note AN3962 Rev. 2.0, 8/2010 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat


    Original     		AN3962 IPC-D-330 AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2 PDF

    XLT08SO

    Abstract: XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint
    Text: MPLAB ICE 2000/4000 TRANSITION SOCKET SPECIFICATION 2005 Microchip Technology Inc. DS51194L Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.


    Original     		DS51194L likel011-632-634-9065 DS51194K1-page XLT08SO XLT14SO XLT18SO XLT20SO1 tqfp 44 socket QFN-24 footprint QFN-20 footprint PDF

    AN4077

    Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
    Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade


    Original     		AN4077 MMA845xQ AN4077 Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8 PDF

    Integrated Synthesizers with Mixers

    Abstract: Digital Step Attenuators 3G/4G Power Amplifiers CATV Amplifiers CATV Hybrid Amplifier Modules Gain Blocks Linear Amplifiers Low Noise Amplifiers Variable Gain Amplifiers WiFi Power Amplifiers
    Text: RFMD PRODUCT SELECTION GUIDE 2013-2014 Amplifiers Attenuators Modulators Switches Upconverters/Downconverters Voltage-Controlled Oscillators Synthesizers CATV Amplifiers and Tuners High Reliability Components Components for Cellular Applications Open Foundry Services


    Original     		11F-B, Integrated Synthesizers with Mixers Digital Step Attenuators 3G/4G Power Amplifiers CATV Amplifiers CATV Hybrid Amplifier Modules Gain Blocks Linear Amplifiers Low Noise Amplifiers Variable Gain Amplifiers WiFi Power Amplifiers PDF

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32 PDF

    PC MOTHERBOARD CIRCUIT diagram

    Abstract: CX93001-EIS_V0.2002-V92 CX93001 CX93001-EIS mobile MOTHERBOARD CIRCUIT diagram toshiba MOTHERBOARD CIRCUIT diagram CX20548-11Z CSM92 computer motherboard circuit diagram I7 motherboard circuit diagram
    Text: CSM92 Reference Modem User’s Guide Conexant Proprietary Information Doc. No. USG-201664 A June 3, 2008 CSM92 Reference Modem User’s Guide Revision Record Revision A Date 6/3/2008 Comments Initial release 2008 Conexant Systems, Inc. All Rights Reserved.


    Original     		CSM92 USG-201664 ERJ6GEYJ152V MC0805-152-JTW MCR10EZPJ152 50ppm; TTL/15pF; 000MHz PC MOTHERBOARD CIRCUIT diagram CX93001-EIS_V0.2002-V92 CX93001 CX93001-EIS mobile MOTHERBOARD CIRCUIT diagram toshiba MOTHERBOARD CIRCUIT diagram CX20548-11Z computer motherboard circuit diagram I7 motherboard circuit diagram PDF

    qfn 44 PACKAGE footprint

    Abstract: PLCC 44 socket layout TQFP 100 pin Socket 16 soic pcb footprint 68 pin plcc socket view bottom surface mount to dip adapter 44-pin plcc pcb mount footprint datasheet for 5407 dip package footprint soic QFP Package 144 lead
    Text: TRANSITION SOCKET SPECIFICATION 2006 Microchip Technology Inc. DS51194P Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		DS51194P so36-4803 DS51194P-page qfn 44 PACKAGE footprint PLCC 44 socket layout TQFP 100 pin Socket 16 soic pcb footprint 68 pin plcc socket view bottom surface mount to dip adapter 44-pin plcc pcb mount footprint datasheet for 5407 dip package footprint soic QFP Package 144 lead PDF

    WAN0158

    Abstract: X-RAY INSPECTION qfn 32 stencil WAN-0236 QFN PCB Layout guide die paddle 32-pin QFN PCB Layout guide 81-pin EH11 qfn 44 PACKAGE footprint
    Text: w WAN-0236 Recommendations on Soldering a Dual Row QFN Package to a PCB INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		WAN-0236 WAN0158 X-RAY INSPECTION qfn 32 stencil WAN-0236 QFN PCB Layout guide die paddle 32-pin QFN PCB Layout guide 81-pin EH11 qfn 44 PACKAGE footprint PDF

    QFN40

    Abstract: QFN-40 AN3286 AN1902 FDZ293P MC13883
    Text: Freescale Semiconductor Application Note Document Number: AN3286 Rev. 0.1, 02/2010 Layout and Design Guidelines for the MC13883 1 Introduction This application note describes guidelines for a Printed Circuit Board PCB footprint for the QFN40 package used for the MC13883 integrated charger. Included are


    Original     		AN3286 MC13883 QFN40 MC13883 AN1902 QFN-40 AN3286 FDZ293P PDF