Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    QFN-48 LAND PATTERN Search Results

    QFN-48 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    HSDC-EXTMOD03B-DB Renesas Electronics Corporation Digital Pattern Generation board for High-speed JESD204B DACs Visit Renesas Electronics Corporation
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation

    QFN-48 LAND PATTERN Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    qfn 48 7x7 stencil

    Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
    Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die


    Original     		XAPP439 qfn 48 7x7 stencil qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    qfn 32 land pattern

    Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
    Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and


    Original     		32-pin MO-220 199707558G qfn 32 land pattern MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    qfn 6x6 foot print

    Abstract: QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater sensors-free QFN footprint QFN-6x6 package qfn stencil QFN-48 LAND PATTERN
    Text: Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona


    Original     		AN3111 qfn 6x6 foot print QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater sensors-free QFN footprint QFN-6x6 package qfn stencil QFN-48 LAND PATTERN PDF

    QFN-6x6 0.5mm

    Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
    Text: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona


    Original     		AN3111 QFN-6x6 0.5mm QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111 PDF

    AN3111

    Abstract: AN-311-1 etch amkor exposed pad qfn 44 PACKAGE footprint sensor x-ray QFN footprint
    Text: AN3111 Rev 5, 04/2010 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona INTRODUCTION The purpose of this application note is to describe


    Original     		AN3111 16-Lead, AN3111 AN-311-1 etch amkor exposed pad qfn 44 PACKAGE footprint sensor x-ray QFN footprint PDF

    AN3111

    Abstract: qfn 48 PACKAGE footprint qfn 44 PACKAGE footprint
    Text: AN3111 Rev 4, 01/2010 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona INTRODUCTION The purpose of this application note is to describe


    Original     		AN3111 16-Lead, AN3111 qfn 48 PACKAGE footprint qfn 44 PACKAGE footprint PDF

    EMC4001

    Abstract: No abstract text available
    Text: USB2514 USB 2.0 High-Speed 4-Port Hub Controller PRODUCT FEATURES Data Brief General Description „ The SMSC 4-Port Hub is low power, OEM configurable, MTT multi transaction translator hub controller IC with 4 downstream ports for embedded USB solutions. The


    Original     		USB2514 48-Pin MO-48QFN-7x7 MO-220 EMC4001 PDF

    JEDEC Drawing MO-220 qfn

    Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    jedec footprint MO-220 VHHD-2

    Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
    Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SM802XXX Flexible Ultra-Low Jitter Clock Synthesizer Clockworks FLEX General Description Features The SM802xxx series is a member of the ClockWorks™ family of devices from Micrel and provide an extremely low-noise timing solution for applications such as 1-100


    Original     		SM802XXX SM802xxx 250fs 115fs 25MHz 875MHz 20MHz) 245fs 12kHz PDF

    AN4077

    Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
    Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade


    Original     		AN4077 MMA845xQ AN4077 Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8 PDF

    TB466

    Abstract: qfn 32 land pattern moisture sensitivity ISL29001
    Text: Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead ODFN Package Technical Brief March 14, 2008 TB466.1 Introduction Part I - ODFN Board Mounting Guidelines Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical


    Original     		TB466 qfn 32 land pattern moisture sensitivity ISL29001 PDF

    MMA845x

    Abstract: mma8452 MMA8453 MMA8452 calibration mma8452 I2C mma8452q MMA8451 MMA845XQ MC9S08QE8 MMA8453Q
    Text: AN3923 Rev 1, 02/2010 Freescale Semiconductor Application Note MMA8450Q Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA8450Q and/or other family derivatives.


    Original     		AN3923 MMA8450Q MMA845xQ MMA8450Q. MMA845x mma8452 MMA8453 MMA8452 calibration mma8452 I2C mma8452q MMA8451 MC9S08QE8 MMA8453Q PDF

    LVEP222

    Abstract: MC100LVE222 NB100LVEP222 lqfp52 AG QC TRANSISTOR
    Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential


    Original     		NB100LVEP222 NB100LVEP222 LVEP222 NB100LVEP222/D MC100LVE222 lqfp52 AG QC TRANSISTOR PDF

    Untitled

    Abstract: No abstract text available
    Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential


    Original     		NB100LVEP222 NB100LVEP222 LVEP222 NB100LVEP222/D PDF

    QFN 64 8x8 footprint

    Abstract: QFN-52 LVEP222 MC100LVE222 NB100LVEP222
    Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential


    Original     		NB100LVEP222 NB100LVEP222 LVEP222 NB100LVEP222/D QFN 64 8x8 footprint QFN-52 MC100LVE222 PDF

    qfn 48 7x7 stencil

    Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Document Number: MMA6271QT Rev 2, 06/2007 Freescale Semiconductor Technical Data ±2.5g - 10g Two Axis Low-g Micromachined Accelerometer The MMA6271QT low cost capacitive micromachined accelerometer features signal conditioning, a 1-pole low pass filter, temperature compensation and gSelect which allows for the selection among 4 sensitivities. Zero-g offset full scale


    Original     		MMA6271QT MMA6271QT MMA6271QT: 7g/10g 7g/10g) PDF

    Untitled

    Abstract: No abstract text available
    Text: Document Number: MMA7261QT Rev 3, 09/2007 Freescale Semiconductor Technical Data ±2.5g - 10g Three Axis Low-g Micromachined Accelerometer The MMA7261QT low cost capacitive micromachined accelerometer features signal conditioning, a 1-pole low pass filter, temperature


    Original     		MMA7261QT MMA7261QT MMA7261QT: 7g/10g 7g/10g) PDF

    QFN tray

    Abstract: tray qfn 6x6 MMA6270QR2 MMA6270QT QFN-16
    Text: Document Number: MMA6270QT Rev 4, 04/2008 Freescale Semiconductor Technical Data ±1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer The MMA6270QT low cost capacitive micromachined accelerometer features signal conditioning, a 1-pole low pass filter, temperature compensation


    Original     		MMA6270QT MMA6270QT MMA6270QT: QFN tray tray qfn 6x6 MMA6270QR2 QFN-16 PDF