qfn 48 7x7 stencil
Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die
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XAPP439
qfn 48 7x7 stencil
qfn 28 land pattern
land pattern for QFN 7x7
24 leads qfn 5x5
qfn 3X3 land pattern
"exposed pad" PCB via
XAPP439
pcb design 0,5 mm pitch 5x5 matrix
qfg48 dimensions
QFN PACKAGE thermal resistance
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance
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AN1902
QFN 76 9x9 footprint
QFN 64 8x8 footprint
QFN PACKAGE thermal resistance
JEDEC JESD51-8 BGA
4914 smd
qfn 32 land pattern
QFN 64 9x9 footprint
QFN 9X9
AN1902
MO-220
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QFN-48 LAND PATTERN
Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when
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FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level
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AN1902
FOOTPRINT MO-229 2X3 SOLDERING
Theta-JC QFP die down
QFN 56 7x7 footprint
EIA-783
EIA and EIAJ standards 783
QFN 76 9x9 footprint
AN1902
QFN 56 7x7 0.5
JESD51-7
MO-220
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qfn 32 land pattern
Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and
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32-pin
MO-220
199707558G
qfn 32 land pattern
MO-220 5x5mm
"BGA Rework Practices",
hakko
vqfn 44 land pattern
MO-220
qfp 32 land pattern
jedec package MO-220 vkkd
qfn land pattern
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BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.
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BD 4914
QFN 76 9x9 footprint
qfn 48 7x7 stencil
QFN 64 8x8 footprint
QFN 64 9x9 footprint
land pattern BGA 0.75 freescale
QFN 56 7x7 footprint
QFN PCB Layout guide
Motorola MAP QFN
MO-220 8x8
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qfn 6x6 foot print
Abstract: QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater sensors-free QFN footprint QFN-6x6 package qfn stencil QFN-48 LAND PATTERN
Text: Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona
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AN3111
qfn 6x6 foot print
QFN-6x6 0.5mm
AN3111
QFN-6x6 48
nozzle heater
sensors-free
QFN footprint
QFN-6x6 package
qfn stencil
QFN-48 LAND PATTERN
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QFN-6x6 0.5mm
Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Text: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona
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AN3111
QFN-6x6 0.5mm
QFN-6x6 48
qfn 6x6 foot print
qfn 44 PACKAGE footprint
qfn stencil
AN3111
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AN3111
Abstract: AN-311-1 etch amkor exposed pad qfn 44 PACKAGE footprint sensor x-ray QFN footprint
Text: AN3111 Rev 5, 04/2010 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona INTRODUCTION The purpose of this application note is to describe
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16-Lead,
AN3111
AN-311-1
etch
amkor exposed pad
qfn 44 PACKAGE footprint
sensor x-ray
QFN footprint
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AN3111
Abstract: qfn 48 PACKAGE footprint qfn 44 PACKAGE footprint
Text: AN3111 Rev 4, 01/2010 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona INTRODUCTION The purpose of this application note is to describe
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16-Lead,
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qfn 48 PACKAGE footprint
qfn 44 PACKAGE footprint
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EMC4001
Abstract: No abstract text available
Text: USB2514 USB 2.0 High-Speed 4-Port Hub Controller PRODUCT FEATURES Data Brief General Description The SMSC 4-Port Hub is low power, OEM configurable, MTT multi transaction translator hub controller IC with 4 downstream ports for embedded USB solutions. The
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USB2514
48-Pin
MO-48QFN-7x7
MO-220
EMC4001
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JEDEC Drawing MO-220 qfn
Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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jedec footprint MO-220 VHHD-2
Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the
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Abstract: No abstract text available
Text: SM802XXX Flexible Ultra-Low Jitter Clock Synthesizer Clockworks FLEX General Description Features The SM802xxx series is a member of the ClockWorks™ family of devices from Micrel and provide an extremely low-noise timing solution for applications such as 1-100
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SM802XXX
SM802xxx
250fs
115fs
25MHz
875MHz
20MHz)
245fs
12kHz
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AN4077
Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
Text: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade
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MMA845xQ
AN4077
Freescale MMA845xQ
MMA8453Q
AN4071
MMA8451
mma8452q
MMA8451Q
78MG
MMA845x
MC9S08QE8
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TB466
Abstract: qfn 32 land pattern moisture sensitivity ISL29001
Text: Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead ODFN Package Technical Brief March 14, 2008 TB466.1 Introduction Part I - ODFN Board Mounting Guidelines Optical Dual-in-line Flat No-lead (ODFN) packages are developed for light sensor applications. The mechanical
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MMA845x
Abstract: mma8452 MMA8453 MMA8452 calibration mma8452 I2C mma8452q MMA8451 MMA845XQ MC9S08QE8 MMA8453Q
Text: AN3923 Rev 1, 02/2010 Freescale Semiconductor Application Note MMA8450Q Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA8450Q and/or other family derivatives.
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MMA8450Q
MMA845xQ
MMA8450Q.
MMA845x
mma8452
MMA8453
MMA8452 calibration
mma8452 I2C
mma8452q
MMA8451
MC9S08QE8
MMA8453Q
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LVEP222
Abstract: MC100LVE222 NB100LVEP222 lqfp52 AG QC TRANSISTOR
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
NB100LVEP222
LVEP222
NB100LVEP222/D
MC100LVE222
lqfp52
AG QC TRANSISTOR
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Untitled
Abstract: No abstract text available
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
LVEP222
NB100LVEP222/D
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QFN 64 8x8 footprint
Abstract: QFN-52 LVEP222 MC100LVE222 NB100LVEP222
Text: NB100LVEP222 2.5 V/3.3 V 1:15 Differential ECL/PECL ÷1/÷2 Clock Driver The NB100LVEP222 is a low skew 1:15 differential ÷1/÷2 ECL fanout buffer designed with clock distribution in mind. The LVECL/LVPECL input signal pairs can be used in a differential
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NB100LVEP222
NB100LVEP222
LVEP222
NB100LVEP222/D
QFN 64 8x8 footprint
QFN-52
MC100LVE222
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qfn 48 7x7 stencil
Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical
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Abstract: No abstract text available
Text: Document Number: MMA6271QT Rev 2, 06/2007 Freescale Semiconductor Technical Data ±2.5g - 10g Two Axis Low-g Micromachined Accelerometer The MMA6271QT low cost capacitive micromachined accelerometer features signal conditioning, a 1-pole low pass filter, temperature compensation and gSelect which allows for the selection among 4 sensitivities. Zero-g offset full scale
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MMA6271QT
MMA6271QT
MMA6271QT:
7g/10g
7g/10g)
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Untitled
Abstract: No abstract text available
Text: Document Number: MMA7261QT Rev 3, 09/2007 Freescale Semiconductor Technical Data ±2.5g - 10g Three Axis Low-g Micromachined Accelerometer The MMA7261QT low cost capacitive micromachined accelerometer features signal conditioning, a 1-pole low pass filter, temperature
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MMA7261QT
MMA7261QT
MMA7261QT:
7g/10g
7g/10g)
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QFN tray
Abstract: tray qfn 6x6 MMA6270QR2 MMA6270QT QFN-16
Text: Document Number: MMA6270QT Rev 4, 04/2008 Freescale Semiconductor Technical Data ±1.5 g - 6 g Dual Axis Low-g Micromachined Accelerometer The MMA6270QT low cost capacitive micromachined accelerometer features signal conditioning, a 1-pole low pass filter, temperature compensation
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MMA6270QT
MMA6270QT
MMA6270QT:
QFN tray
tray qfn 6x6
MMA6270QR2
QFN-16
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