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    QFP 0.2MM PITCH Search Results

    QFP 0.2MM PITCH Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    QFP 0.2MM PITCH Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    1124-0527-P1

    Abstract: 1124-0524-P1 1124-0042-P1 1124-0046-P1 1124-0033-P1 1124-0026-P1 1124-0510-P1 1124-0518-P1 1124-0003-P1 1124-0514-P1
    Text: Datasheet : A wide variety of tip cartridges are available for use with the TD-100 and the MT-100 Handpieces. Please refer to the table below for available tip cartridge styles. Description PACE P/N 1124-0001-P1 1/32" Conical Sharp Extended 1124-0002-P1 1/64" Conical Sharp


    Original     		TD-100 MT-100 1124-0001-P1 1124-0002-P1 1124-0003-P1 1124-0004-P1 1124-0005-P1 1124-0006-P1 1124-0007-P1 1124-0008-P1 1124-0527-P1 1124-0524-P1 1124-0042-P1 1124-0046-P1 1124-0033-P1 1124-0026-P1 1124-0510-P1 1124-0518-P1 1124-0514-P1 PDF

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


    Original     		100x10 PDF

    Untitled

    Abstract: No abstract text available
    Text: KA hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOAs original thick film technology • Thick film printed circuit substrate applies the non-noble


    Original     		100x10 PDF

    pitch 0.4mm BGA

    Abstract: BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka
    Text: KA, SC hybrid IC EU features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available • High reliability achieved by KOA’s original thick film technology


    Original     		100x10 100x10-6/k pitch 0.4mm BGA BGA and QFP Package mounting 0.4mm pitch BGA AI2O3 QFP lead pitch 0.3mm QFP 0.2mm pitch QFP 0.3mm pitch Noble resistor hybrid ic sc ka PDF

    0.3mm pitch BGA

    Abstract: pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm
    Text: 1733 Reader's Spreadspg189-328:1570 Reader's Spreadspg189-328 1/27/09 4:58 PM Page 54 KA, SC hybrid IC EU features NEW • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding COB • Various types of package are available


    Original     		Spreadspg189-328 Spreadspg189-328 100x10-6/K 0.3mm pitch BGA pitch 0.4mm BGA QFP 0.3mm pitch 0.4mm pitch BGA BGA and QFP Package mounting KOA Chip Resistors Packaging BGA and QFP Package paste resistor thick film hybrid ic sc ka qfp 0.4mm PDF

    ci 740

    Abstract: DIL 330 ic package styles ceramic QFP Package 100 lead CLCC 44
    Text: Integrated Circuits Package Information Latest changes to this document - 11th February 2002 Delvery packaging specification added Publication No: D/Packs/8 February 2002 1 CML Microcircuit Package Information Package Suffixes CML package styles are currently identified with the following suffixes: J, LG, LH, LS and P.


    Original     		230mm ci 740 DIL 330 ic package styles ceramic QFP Package 100 lead CLCC 44 PDF

    p548

    Abstract: permittivity of aluminium oxide
    Text: DC-DCコンバータ DC-DC CONVERTER 品番 ECD036-018A01-10 Part No. 特長 FEATURES YSuper mini and thinner size YHigh wattage density 20W/cc YRealization of high efficiency with the adoption of synchronous rectification method YAdjustable output voltage with external voltage


    Original     		ECD036-018A01-10 Y20W/cc K30VJ85 K35VJ85 p548 permittivity of aluminium oxide PDF

    s1d13517

    Abstract: COM35H3835 s1d13748 s1d13781 COM43H4M09 COM57T5132 Epson S1D13781 COM57T5136 COM57H5140 04-6281-267-2X2-846
    Text: Connecting EPSON Display Controllers to ORTUSTECH LCD Panels Rev.1.3 NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.


    Original     		PDF

    S1D13513

    Abstract: s1d13748 COM27H2M90 04-6281-267-2X2-846 s1d13742 SPH-002T-P0.5 S1D13742-QFP FH26G-67S-0.3SHBW S1D13719PFBGA COM41T4148
    Text: Connecting EPSON Display Controllers to Casio LCD Panels Rev.1.00 NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.


    Original     		PDF

    SPH-002T-P0.5

    Abstract: Casio lcd casio lcd tft 1.6" COM35T3829 FH26G-67S-0.3SHBW 32 PIN FPC CONNECTOR COM22T2M59 COM55T5108 S1D13513 S1D13742-QFP
    Text: Connecting EPSON Display Controllers to Casio LCD Panels Rev.0.90 NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.


    Original     		PDF

    SED1335

    Abstract: pg320240wrf pg320240
    Text: POWERTIP TECH. CORP. DISPLAY DEVICES FOR BETTER ELECTRONIC DESIGN Specification For Approval Customer ： Model Type ： LCD MODULE Sample Code ： Mass Production Code ： PG320240WRF-DE4HL1 Revision ： Customer Sign Sales Sign Checked By QA Approved By Prepared By


    Original     		PG320240WRF-DE4HL1 PT-A-005-2 SED1335 pg320240wrf pg320240 PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    IC Package Names and Code Designations

    Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
    Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages


    Original     		10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408 PDF

    IPC-7525

    Abstract: jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220
    Text: Fairchild Semiconductor Application Note September 2005 Revised September 2005 PCB Land Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction Overview The current miniaturization trend towards higher performance in


    Original     		AN-5067 IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J JEDEC Drawing MO-220 7mm IPC-9701 MLP32A Thin Quad flat package mo-220 PDF

    CN56

    Abstract: cn93 cn85
    Text: CMOS 16-BIT SINGLE CHIP MICROCONTROLLER S5U1C17F57T Manual Software Evaluation Tool for S1C17F57 S5U1C17F57T Manual (Rev.0.9) Seiko Epson Corporation i NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written


    Original     		16-BIT S5U1C17F57T S1C17F57) intelle52-2827-4346 CN56 cn93 cn85 PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    pick and place robot

    Abstract: land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY
    Text: 2 7 Surface Mount Technology 1/16/97 5:04 PM CH07WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 7 SURFACE MOUNT TECHNOLOGY 7.1. INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately


    Original     		CH07WIP pick and place robot land pattern QFP 208 programming smt machine pick and place robot used for circuit assembling Surface mount SMA connector 300C IPC-SM-782 OMEGA P-M edge mount sma footprint SURFACE MOUNT TECHNOLOGY PDF

    enamelled copper wire swg table

    Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
    Text: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .


    Original     		element-14 127mm 210x297mm) 420x297mm) 33MTR enamelled copper wire swg table RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2 PDF

    M190G

    Abstract: epson inkjet printhead epson printer m190 BAT500 epson m190 inkjet printhead module epson m180 M-T53II epson dotmatrix printhead T103A
    Text: Printing Product Guide 2004 2005 Printing Product Guide 2004 -2005 SEIKO EPSON CORPORATION EPSON worldwide site http://www.epson.com All features and specifications described are subject to change without notice. EPSON and ESC/POS are registered trademarks of SEIKO EPSON Corporation.


    Original     		0A00928 M190G epson inkjet printhead epson printer m190 BAT500 epson m190 inkjet printhead module epson m180 M-T53II epson dotmatrix printhead T103A PDF

    smd ic marking 1ft

    Abstract: smd diode bcg Siemens 3-Pin to Bantam Plug Cable 301436 microdot 10-32 male connector 4mm banana plug socket mitsubishi 5218 smd diode 2ba electronic passive components catalog goldstar TV repair
    Text: Professionals Trust Pomona Performance Test and Measurement Calibration RF Audio / Video Automotive Telecom 2006 - 2007 Full Line Catalog Table of Contents For over half a 3 New Products 8 Customized Products 9 Coaxial Cable Assemblies and Breakouts 18 Coaxial Connectors, Adapters and Kits


    Original     		11004-eng smd ic marking 1ft smd diode bcg Siemens 3-Pin to Bantam Plug Cable 301436 microdot 10-32 male connector 4mm banana plug socket mitsubishi 5218 smd diode 2ba electronic passive components catalog goldstar TV repair PDF

    dinverter 768r

    Abstract: G7D-412S Ericsson Installation guide for RBS 6201 OMRON G7d TH3 thermistor 6201 RBS ericsson user manual TMS77C82NL reed relay rs 349-355 i ball 450 watt smps repairing RBS -ericsson 6601
    Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.


    Original     		HEF4527BT HEF4531BT HEF4534BP HEF4534BT MSP-STK430X320 AD9054/PCB AD9054BST-135 IPS521G IPS521S IRL2203S dinverter 768r G7D-412S Ericsson Installation guide for RBS 6201 OMRON G7d TH3 thermistor 6201 RBS ericsson user manual TMS77C82NL reed relay rs 349-355 i ball 450 watt smps repairing RBS -ericsson 6601 PDF

    Untitled

    Abstract: No abstract text available
    Text: RN ICPAK Nuaent QFP Sockets REMARKS 3 Check the IC’s pin pitch before insertion. If the IC’s pin pitch is uneven, it might not fit into the socket or the 1C may become damaged. 4) Check that the contacts are clean before mount­ ing. Poor contact may result if the socket contacts


    OCR Scan     		PDF

    lcc aluminium capacitors

    Abstract: No abstract text available
    Text: 3 r*Jij - 'W '& tb flM S Ag-Pd : 3 0 0 / i m S - 3 0 0 ^ m B W — <S x 1 5 0 ^ m (§ -150A <m |B ]Pl(4S ») Ag-Pt : 3 0 0 A m ( i - 3 0 0 / i m l 5 l l ( — Ä )x 150/«m l§ -2 0 0 ^ m |B ] l! i( ! H £ ) Cu : 1 0 0 /im « - 1 5 0 / / m H P S ( - Ä K


    OCR Scan     		-150A 100ppm/ lcc aluminium capacitors PDF