QFP 128 BONDING Search Results

QFP 128 BONDING Result Highlights (5)

Part	Manufacturer	Description
SM34020APCM40	Texas Instruments	SM34020APCM40 144-QFP
DP83843BVJE/NOPB	Texas Instruments	PHYTER 80-QFP 0 to 70
5962-9679002NXB	Texas Instruments	Digital Signal Processor 144-QFP -55 to 125
5962-9679001NXB	Texas Instruments	Digital Signal Processor 144-QFP -55 to 125
TL28L92IFR	Texas Instruments	3.3-V/5-V Dual Universal Asynchronous Receiver/Transmitter 44-QFP -40 to 85

QFP 128 BONDING Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
100L Abstract: JESD51-2 JESD51-7 32 QFP PACKAGE thermal resistance tqfp 7x7 1.4 tray tqfp 7x7 tray tqfp 64 thermal resistance Techpoint Text: TQFP Thin Profile Quad Flat Pack • 7 x 7mm to 14 x 14mm • 32 to 128 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 14 x 14mm The Thin Profile Quad Flat Pack TQFP belongs to STATS ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP	Original		PDF
BR931 Abstract: motorola mca MCA3200ETL MCA6200ETL MCA750ETL H4C018 Motorola Master Selection Guide H4C161 wirebond die flag lead frame an1512 Text: Semicustom Application Specific Integrated Circuits In Brief . . . Motorola supports strategic programs and co–development partnerships to accelerate the availability of advanced processes CMOS, BiCMOS, Bipolar , packaging and CAD technology. Extensive research,	Original		PDF
Arm processor vlsi technology Abstract: PC302 QFP 128 bonding Text: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec	OCR Scan	45-micron Arm processor vlsi technology PC302 QFP 128 bonding	PDF
MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR Abstract: uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358 Text: Design Manual CMOS-8L Family CMOS Gate Array Ver. 5.0 Document No. A12158EJ5V0DM00 5th edition Date Published June 1999 N CP(K) 1997, 1998 Printed in Japan 1 [MEMO] 2 Design Manual A12158EJ5V0DM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS	Original	A12158EJ5V0DM00 Semiconductor2/9044 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR uPD65837 uPD65869 X17512 upd65839 RF Transistors Ceramic MARKING F25 marking code F302 535 D65841 uPD65851 X46358	PDF
PC5004 Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding Text: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz	OCR Scan	55-micron PC5004 VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding	PDF
bi 240 Abstract: SnAgCu NA200 NA200 flux QFP-208 NA-200 paste profile SMD Packages QFP 128 bonding QFP PACKAGE thermal resistance Text: Quality Evaluation Data for Lead-free SMD Peripheral Packages Sn-Bi plating August 30, 2002 Seiko Epson Corporation Contents 1. Observation of Surface Condition of Sn-Bi Type Lead Plating 2. Soldering Evaluation for Lead Plating 2-1 Solderability test results for stand-alone packages	Original	NA200) bi 240 SnAgCu NA200 NA200 flux QFP-208 NA-200 paste profile SMD Packages QFP 128 bonding QFP PACKAGE thermal resistance	PDF
68hc26 Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE Text: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1	Original		PDF
NA200 flux Abstract: bi 240 QFP 208 MT90810AK3 NA200 QFP208-pin epson, whisker Text: Soldering Information for the MT90810AK3 Sn-Bi plating lead-free package 260 oC Peak Temperature from Seiko Epson Corporation For more information about Seiko Epson Lead-Free packages, Please consult their web site at :	Original	MT90810AK3 NA200) NA200 flux bi 240 QFP 208 MT90810AK3 NA200 QFP208-pin epson, whisker	PDF
68hc11pa8 Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4 Text: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s	Original	MRQSY96/D 68hc11pa8 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4	PDF
116-Pin Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size	Original	C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow	PDF
synopsys Platform Architect Abstract: clock tree balancing DesignWare SPI vhdl code for watchdog timer of ATM 0.18-um CMOS technology characteristics vhdl coding for analog to digital converter CML Vterm 27x27 Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.1 May 19, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the	Original		PDF
S1D15719 Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B Text: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4	Original	S1L70000 S1L60000 S1L50000 S1L30000 16-bit 32-bit S1D15719 S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B	PDF
68HC11L6 Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20 Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.	Original		PDF
144 QFP body size Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter Text: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the	Original		PDF

NAND Flash Programmer with TSOP-48 adapter Abstract: INTEL Core i7 860 schematic diagram inverter lcd monitor fujitsu MB506 ULTRA HIGH FREQUENCY PRESCALER fujitsu LVDS vga MB89625R VHDL code simple calculator of lcd display JTag Emulator MB90F497 Millbrook BGA TBA 129-5 Text: Master Product Selector Guide February 2001 Fujitsu Microelectronics, Inc. Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Application Specific ICs ASICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original		PDF
SSC3020 Abstract: SSC3030 F1841 SSC3110 F605 SSC3010 SSC3120 SSC3150 Text: S S C 3 0 0 0 s e r ie s HIGH SPEED CMOS STANDARD CELL • DESCRIPTION The SSC3000 Series is comprised of the SSC3000 and SSC3500 family of standard cells. Each family is offered in 20 preset gate to I/O combinations. Both the SSC3000 and SSC3500 offer high speed and high drive capability	OCR Scan	SSC3000 SSC3500 SSC3000Serles SSC3020 SSC3030 F1841 SSC3110 F605 SSC3010 SSC3120 SSC3150	PDF
FN 1016 Abstract: MPA 67 MPA1064DH BFR32 B1582 transistor fn 1016 DL201 MPA1016DD MPA1036HI 269 SL3.0/transistor fn 1016 Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPA1000 Product Description Motorola Programmable Array MPA products are a high density, high performance, low cost, solution for your reconfigurable logic needs. When used with our automatic high performance design tools, MPA delivers custom logic	Original	MPA1000 MPA1016 MPA1036 DL201 FN 1016 MPA 67 MPA1064DH BFR32 B1582 transistor fn 1016 MPA1016DD MPA1036HI 269 SL3.0/transistor fn 1016	PDF
m60013 Abstract: M60016 m60011 M60014 z46n M60030 M60024 Z24N M60012 m60043 Text: A m its u b is h i CMOS GATE ARRAYS ELECTRONIC DEVICE GROUP Mitsubishi CMOS Gate Arrays INTRODUCTION Mitsubishi offers three fami lies of CMOS gate arrays: 1.0 /im, 1.3 /j.m, and 2.0 ji.m, with usable gates ranging from 200 to 35,000. The 1.0 and 1.3 p.m devices are	OCR Scan	MDS-GA-11-90-RK m60013 M60016 m60011 M60014 z46n M60030 M60024 Z24N M60012 m60043	PDF
KGA0E000BA Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC Text: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte	Original	16-bit 32-bit ARM10 16-bit HT80Cer KGA0E000BA kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC	PDF
Multi-Chip Modules motorola Abstract: No abstract text available Text: MOTOROLA SC •CNEI'IORY/ASI L^E D b3t.7ESl □Df iTbtn 053 M N0T3 MOTOROLA SEMICONDUCTOR Order by MCMLiD • TECHNICAL DATA Advance Information APPLICATION SPECIFIC MULTICHIP MODULES MCML SERIES MULTICHIP MODULES CMOS/BICMOS SEMICONDUCTORS This specification defines the product characteristics for the MCML Series of	OCR Scan	sma098 110T3 Multi-Chip Modules motorola	PDF
Date Code Formats Altera EPF10K Abstract: ep22v10 5962-9061102XA 5962-8854901xa 8686401LA 5962-8686401LA lift controller in vhdl ALTERA PART MARKING EPM7160 EPX780 transistor b2020 Text: Introduction Contents March 1995 Introduction The PLD Advantages of Altera	Original		PDF
exposed QFP 144 Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7 Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal	Original		PDF
"Single-Port RAM" Abstract: CE71 CE71J1 CE71J2 CE71J3 tb 304 Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V	Original	ASIC-FS-20655-11/99 "Single-Port RAM" CE71 CE71J1 CE71J2 CE71J3 tb 304	PDF
MSS30 Abstract: CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard Text: CE71 Series Embedded Array t 0.25µm CMOS Technology Features 0.18µm Leff 0.24µm drawn Propagation delay of 61 ps Separate core and I/O supply voltages Mixed-signal macros–A/D and D/A converters I/Os: 2.5V, 3.3V, 5V tolerant Core power supply voltage: 2.5V, 1.8V, 1.5V	Original	ASIC-FS-20655-11/99 MSS30 CE71 CE71J1 CE71J2 CE71J3 dual lvds vhdl fujitsu lvds standard	PDF

QFP 128 BONDING Search Results

QFP 128 BONDING Result Highlights (5)

QFP 128 BONDING Datasheets Context Search

100L

BR931

Arm processor vlsi technology

MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

PC5004

bi 240

68hc26

NA200 flux

68hc11pa8

116-Pin

synopsys Platform Architect

S1D15719

68HC11L6

144 QFP body size

NAND Flash Programmer with TSOP-48 adapter

SSC3020

FN 1016

m60013

KGA0E000BA

Multi-Chip Modules motorola

Date Code Formats Altera EPF10K

exposed QFP 144

"Single-Port RAM"

MSS30