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    QFP 144 PACKAGE Search Results

    QFP 144 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    UPD703185GF-XXX-3BA-A Renesas Electronics Corporation 32-bit Microcontrollers, QFP, / Visit Renesas Electronics Corporation
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    QFP 144 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN CERAMIC FPT-144C-C02 144-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Ceramic material Alumina Mounting height 2.0mm MAX FPT-144C-C02 144-pin ceramic QFP


    Original     		FPT-144C-C02 144-pin FPT-144C-C02) F144005SC-1-3 PDF

    FPT-144P-M05

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)


    Original     		FPT-144P-M05 144-pin FPT-144P-M05) F144006S-2C-3 FPT-144P-M05 PDF

    QFP 144 PACKAGE

    Abstract: QFP144-P-2828-1
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M01 EIAJ code : ∗QFP144-P-2828-1 144-pin plastic QFP Lead pitch 0.65mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M01 144-pin plastic QFP (FPT-144P-M01)


    Original     		FPT-144P-M01 QFP144-P-2828-1 144-pin FPT-144P-M01) QFP 144 PACKAGE QFP144-P-2828-1 PDF

    QFP144

    Abstract: QFP144-P-2020-1
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M03 EIAJ code : ∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03 144-pin plastic QFP (FPT-144P-M03)


    Original     		FPT-144P-M03 QFP144-P-2020-1 144-pin FPT-144P-M03) QFP144 QFP144-P-2020-1 PDF

    QFP 144 PACKAGE

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN CERAMIC FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm Base ceramic material Alumina FPT-144C-C01 144-pin ceramic QFP (FPT-144C-C01) 3.30(.130) (Mounting height)


    Original     		FPT-144C-C01 144-pin FPT-144C-C01) F144004SC-3-2 QFP 144 PACKAGE PDF

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN CERAMIC FPT-144C-C01 144-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80 mm Base ceramic material Alumina FPT-144C-C01 144-pin ceramic QFP


    Original     		FPT-144C-C01 144-pin FPT-144C-C01) F144004SC-3-2 PDF

    QFP144

    Abstract: QFP Package 144 lead QFP144-P-2828-2
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M02 EIAJ code : ∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02 144-pin plastic QFP (FPT-144P-M02)


    Original     		FPT-144P-M02 QFP144-P-2828-2 144-pin FPT-144P-M02) QFP144 QFP Package 144 lead QFP144-P-2828-2 PDF

    frequency hopping spread spectrum

    Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
    Text: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM


    Original     		Z87001/Z87L01 Z87001 Z87L01 144-Pin and001010 frequency hopping spread spectrum spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010 PDF

    A2 diode

    Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
    Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5


    Original     		S176GM-50-3EU, S176GM-50-8EU-2 S208GD-50-5ML-2 S208GD-50-5EL-1 P208GD-50-LML, S208GD-50-8EU-2 S216GM-40-8EV P240GN-50-LMU, S256GD-40-LMV, S272GP-50-LMU, A2 diode transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board


    Original     		96-144M65 QQ-B-626. -or96-144M65-P PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board


    Original     		QQ-B-626. -or97-68340-P PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-144M65 -or96-144M65-P 144-PGM15048-30 PDF

    144 QFP body size

    Abstract: ASTM-B16-85
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		-or97-68340-P 145-PGM15024-30 144 QFP body size ASTM-B16-85 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		145-PGM15024-30 PDF

    ASTM-B16-85

    Abstract: MIL-T-10727
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		-or97-68340-P 145-PGM15024-30 ASTM-B16-85 MIL-T-10727 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		-or97-68340-P 145-PGM15024-30 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		-or97-68340-P 145-PGM15024-30 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		-or97-68340-P 145-PGM15024-30 PDF

    144 QFP body size

    Abstract: ASTM-B16-85 96-144M65
    Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		96-144M65 96-144M65 -or96-144M65-P 144-PGM15048-30 144 QFP body size ASTM-B16-85 PDF

    18025

    Abstract: No abstract text available
    Text: P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter FEATURES • Convert surface mount QFP packages to a 15x15 PGA footprint • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs • Pins are mechanically fastened and soldered to board using Aries’ patented process,


    Original     		144-Pin 15x15 C36000 ASTM-B16-00 97-68340-P 145-PGM15024-30 18025 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		96-144M65 -or96-144M65-P 144-PGM15048-30 PDF

    AMS-QQ-N-290

    Abstract: ASTM-B16-00
    Text: P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter FEATURES • Convert surface mount QFP packages to a 15x15 PGA footprint • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs • Pins are mechanically fastened and soldered to board using Aries’ patented process,


    Original     		144-Pin 15x15 C36000 97-68340-P 145-PGM15024-30 AMS-QQ-N-290 ASTM-B16-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		96-144M65 -or96-144M65-P 144-PGM15048-30 PDF

    144 QFP body size

    Abstract: No abstract text available
    Text: Part No. 96-144M65 - QFP to PGA Adapter for 144 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		96-144M65 -or96-144M65-P 144-PGM15048-30 144 QFP body size PDF